Assembly of heat-dissipating device and circuit board

Abstract

In an assembly of a heat-dissipating device and a circuit board, the circuit board has a heat-generating component and is formed with board holes. The heat-dissipating device includes a base plate, a heat-dissipating component, fastening members, biasing members, engaging members, and resilient washers. The base plate abuts against the heat-generating component, and is formed with through-holes. The heat-dissipating component is disposed on the base plate. Each fastening member has a shank part extending through one through-hole and one board hole, a head part, and a threaded connection part. Each biasing member abuts against the base plate and the head part of one fastening member. Each engaging member is disposed at a lower surface of the circuit board and engages the threaded connection part of one fastening member. Each washer is sleeved on one fastening member, and abuts against an upper surface of the circuit board.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiment with reference to the accompanying drawings, of which:

FIG. 1 is a schematic partly sectional view of a conventional assembly of a heat-dissipating device and a circuit board;

FIG. 2 is a schematic partly sectional view of another conventional assembly of a heat-dissipating device and a circuit board;

FIG. 3 is an exploded perspective view of the preferred embodiment of an assembly of a heat-dissipating device and a circuit board according to the present invention;

FIG. 4 is an exploded perspective view of a heat-dissipating device of the preferred embodiment;

FIG. 5 is a schematic partly sectional view of the heat-dissipating device of the preferred embodiment;

FIG. 6 is a schematic side view of the assembly of the preferred embodiment; and

FIG. 7 is a schematic partly sectional view of the assembly of the preferred embodiment.

Claims

1. An assembly of a heat-dissipating device and a circuit board, said assembly comprising: a circuit board having a heat-generating component mounted on an upper surface thereof, and formed with a plurality of spaced apart board holes; anda heat-dissipating device including a base plate disposed to abut against a top surface of said heat-generating component on said circuit board, and formed with a plurality of through-holes, each of which is aligned with a respective one of said board holes,a heat-dissipating component mounted on top of said base plate and disposed above said heat-generating component,a plurality of fastening members, each of which includes a shank part extending through one of said through-holes in said base plate and one of said board holes in said circuit board, a head part connected to a top end of said shank part and having an outer diameter larger than that of said shank part, and a threaded connection part extending downwardly from said shank part,a plurality of biasing members, each of which has opposite ends that abut respectively against said base plate and a bottom face of said head part of a corresponding one of said fastening members,a plurality of engaging members, each of which is disposed at a lower surface of said circuit board and engages said threaded connection part of a respective one of said fastening members, anda plurality of resilient washers, each of which is sleeved on said shank part of a respective one of said fastening members, and abuts against said upper surface of said circuit board.

2. The assembly of claim 1, wherein each of said resilient washers is made of a dielectric rubber material.

3. The assembly of claim 1, wherein said shank part of each of said fastening members has an outer surface formed with an engaging groove that is disposed adjacent to said threaded connection part for engaging the respective one of said resilient washers.

4. The assembly of claim 1, wherein said heat-dissipating component includes a plurality of spaced apart upright heat-dissipating fins.

5. The assembly of claim 1, wherein said heat-dissipating device further includes a heat-dissipating fan mounted on top of said base plate for generating heat-dissipating air flow toward said heat-dissipating component.

6. The assembly of claim 5, wherein said base plate includes a first plate body mounted with said heat-dissipating component, a second plate body mounted with said heat-dissipating fan and disposed at a horizontal level lower than that of said first plate body, and a connecting portion interconnecting said first and second plate bodies.

7. The assembly of claim 6, wherein at least one of said through-holes is formed in said first plate body adjacent to said connecting portion.

8. The assembly of claim 7, wherein said heat-dissipating device further includes a cover body mounted on top of said base plate and disposed to cover said heat-dissipating component and said heat-dissipating fan, said cover body having a top side formed with an air intake hole for establishing fluid communication between said heat-dissipating fan and the outside environment, and a rear side formed with an air vent hole for establishing fluid communication between said heat-dissipating component and the outside environment.

9. The assembly of claim 8, wherein said heat-dissipating device further includes a sound-absorbing member mounted on a top side of said first plate body and disposed adjacent to said air vent hole.