Patent Application
20120104077
The present invention relates to a soldering technology, and more particularly to an automatic soldering apparatus and a soldering method of the automatic soldering apparatus.
Nowadays, a traditional soldering apparatus generally comprises a base, a cylinder used as a driving unit and a hot press. When the traditional soldering apparatus is used to connect a first electronic component to a second electronic component by a solder material, the cylinder is generally used to generate an impact force to the hot press and the first electronic component once, and thus the hot press and the first electronic component can press the solder material to deform the solder material up to a certain degree prior to heating the solder material, for the purpose of firmly soldering.
However, when the traditional soldering apparatus is used to execute a soldering process, the impact force of the cylinder deforms the solder material prior to heating it, so that the first electronic component may be easily damaged due to the impact force.
A primary object of the present invention is to provide an automatic soldering apparatus and a soldering method thereof, which can avoid from damaging one of electronic components during soldering, and thus can overcome the disadvantages existing in the conventional technologies, as described above.
To achieve the above object, the present invention provides an automatic soldering apparatus which comprises a base, a driving unit, a hot press and a control device, wherein the driving unit is mounted on the base, and has a stepping motor and a screw transmission mechanism connected to the stepping motor. Moreover, the screw transmission mechanism has a screw driven by the stepping motor and a sliding block driven by the screw. The hot press is mounted on the sliding block. The control device is electrically connected to the stepping motor for controlling the stepping motor to work and thus drive the hot press on the sliding block to move in a stepping manner.
Furthermore, to achieve the above object, the present invention further provides a soldering method of an automatic soldering apparatus, and the soldering method comprises the following steps of:
(S1) positioning a to-be-soldered part and an electronic component having a solder material;
(S2) driving a hot press to firstly move, until the hot press is in contact with the part;
(S3) heating the solder material by the hot press; and
(S4) driving the hot press to secondly move to press the solder material through the part after the solder material on the electronic component is melted, so as to connect the part to the melted solder material on the electronic component by soldering, such that a complete connection between the part and the electronic component soldered by the solder material is carried out.
As described above, when the automatic soldering apparatus and the soldering method of the present invention are used to execute a soldering process, a route of the hot press can be controlled to firstly melt the solder material and then deform it, so as to avoid the hot press from impacting and damaging the part.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings. Furthermore, directional terms described by the present invention, such as upper, lower, front, back, left, right, inner, outer, side and etc., are only directions by referring to the accompanying drawings, and thus the used directional terms are used to describe and understand the present invention, but the present invention is not limited thereto.
Referring now to
The hot press 16 is mounted on the sliding block 124. The control device is electrically connected to the stepping motor 121 for controlling the stepping motor 121 to work and thus drive the screw 123 to rotate, so as to drive the hot press 16 on the sliding block 124 to move downward in a stepping manner.
The hot press 16 is further provided with a temperature sensor (not-shown) electrically connected to the control device, wherein the temperature sensor detects the temperature of the hot press 16, and immediately feeds back to the control device, so that the control device can adjust the real-time temperature of the hot press 16 into an optimized temperature value for ensuring the soldering quality.
Referring now to
(S1) positioning a to-be-soldered part A and an electronic component C having a solder material B;
(S2) driving a hot press 16 to firstly move, until the hot press 16 is in contact with the part A;
(S3) heating the solder material B by the hot press 16; and
(S4) driving the hot press 16 to secondly move to press the solder material B through the part A after the solder material B on the electronic component C is melted, so as to connect the part A to the melted solder material B on the electronic component C by soldering, such that a complete connection between the part A and the electronic component C soldered by the solder material B is carried out.
Referring now to
Referring still to
(S1) positioning the to-be-soldered part A and the electronic component C with the solder material B on the clamping tool 142, and placing the clamping tool 142 under the hot press 16 and positioning the clamping tool 142;
In the embodiment, the part A is a wire, the solder material B is a solder wire having a diameter of 0.65 mm. After a plurality of tests, the optimized distance of the secondly motion of the hot press 16 is set to 0.4 mm.
(S2) driving the hot press 16 to firstly move, until the hot press 16 is in contact with the part A;
(S3) sending a command from the control device to raise the temperature of the hot press 16 for heating the solder wire;
(S4) driving the hot press 16 to secondly move to press the solder wire through the part A after the solder wire on the electronic component C is melted, so as to connect the part A to the melted solder wire on the electronic component C by soldering, such that a complete connection between the part A and the electronic component C soldered by the solder material B is carried out; and
(S5) lowering the temperature of the hot press 16, the part A and the electronic component C with the solder material B, and then controlling the driving unit 12 by the control device, so as to drive the hot press 16 to move upward away from the part A and the electronic component C. Thus, the soldering process of the part A and the electronic component C is finished.
During the entire soldering process, the temperature sensor detects the temperature of the hot press 16 and immediately feeds back to the control device, so that the control device can adjust the real-time temperature of the hot press 16 into an optimized temperature value for ensuring the soldering quality.
As described above, when the automatic soldering apparatus and the soldering method of the present invention are used to execute a soldering process, a route of the hot press 16 can be controlled to firstly melt the solder material B and then deform the solder material B, so as to avoid the hot press 16 from impacting and damaging the part A.
The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications to the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
