This application is based upon and claims the benefit of priority from prior Japanese Patent Application No. 2011-136353, filed Jun. 20, 2011, the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a backside illumination solid-state image pickup device.
In recent years, backside illumination solid-state image pickup devices have been researched. In a backside illumination solid-state image pickup device, signal processing circuits such as a logic circuit, an analog circuit, and a pixel scanning circuit is formed on a front surface side of a silicon substrate. A photoelectric conversion area and color filters, microlenses, and the like are formed on a back surface side of the silicon substrate.
Light delivered to the back surface of the silicon substrate is converted inside the silicon substrate in a photoelectric manner. The converted light is subjected to signal processing on the front surface side of the substrate. The processed light is then output. Scanning transistors and wires conventionally arranged in pixels are absent from the back surface side, thus allowing an aperture ratio of 100% to be achieved per pixel. Furthermore, the color filters and the microlenses can be reduced in profile, allowing light to be more properly condensed and reducing mixture of colors.
On the other hand, for alignment of the color filters and the microlenses, in a conventional solid-state image pickup device in which light is incident on the surface of the substrate, apertures through which light enters the substrate are defined by wires, and thus the color filters are formed in alignment with the wires. Since the wires are metal, even color filters for RGB, that is, red, green, and blue, for example, can be easily aligned with the wires.
However, the backside illumination solid-state image pickup device has the following problems.
The apertures through which light enters the silicon substrate are active areas partitioned by isolation layers formed on the front surface of the silicon substrate. The active area includes a photoelectric layer. Thus, to be aligned with the photoelectric layer, the position of the color filter needs to be aligned with a step of the isolation layer formed on the surface of the silicon substrate.
However, in the backside illumination solid-state image pickup device, the step needs to be detected across the thickness of the silicon substrate, which is 3 to 7 μm. Hence, the wavelength of a normal stepper fails to allow the color filter to be aligned with the isolation layer (or active area) on the surface of the silicon substrate. Thus, according to the conventional art, the color filter is aligned with the photoelectric layer by, for example, pre-forming a mark that penetrates the silicon substrate or cutting the silicon in the step portion of the isolation layer to expose the step.
However, the use of the mark penetrating the silicon substrate increases the number of steps required and results in indirect alignment with the isolation layer. Furthermore, the method of digging the silicon in the step portion of the isolation layer causes striation during the formation of the color filters. This makes acquisition of proper images difficult.
A solid-state image pickup device according to embodiments will be described with reference to the drawings. In the following description, components with the same functions and configurations are denoted by the same reference numerals, and duplicate descriptions are given only when needed.
In general, according to one embodiment, a solid-state image pickup device includes a semiconductor substrate, a first photoelectric conversion layer, a second photoelectric conversion layer, a circuit, a first color filter and a second color filter. The semiconductor substrate includes a first principal surface and a second principal surface lying opposite the first principal surface. The first photoelectric conversion layer and the second photoelectric conversion layer is formed both in the semiconductor substrate to convert incident light into an electric signal. The circuit is formed on the first principal surface to process the electric signals output by the first and second photoelectric conversion layers. The first color filter is arranged on the second principal surface to correspond to the first photoelectric conversion layer and includes a first bottom surface lying on the second principal surface side and a first top surface lying opposite the first bottom surface. The second color filter is arranged on the second principal surface to correspond to the second photoelectric conversion layer and includes a second bottom surface lying on the second principal surface side and a second top surface lying opposite the second bottom surface. The first color filter includes a spectroscopic filter configured to allow light having passed through the semiconductor substrate to pass through. In a cross section perpendicular to the second principal surface, the first bottom surface is longer than the first top surface, and the second bottom surface is shorter than the second top surface.
As shown in
On a semiconductor substrate (for example, a silicon single-crystal substrate) 10 with an epitaxial layer, a P well layer 11 is formed in the analog area B, and an N well layer 12 is formed in the logic area C. For example, N channel transistors 13 and P channel transistors 14 are formed in each well layer. A first principal surface of the semiconductor substrate 10 on which the transistors 13 and 14 are formed is hereinafter referred to as a front surface. A principal surface of the semiconductor substrate 10 which lies opposite the front surface is hereinafter referred to as a back surface.
In the pixel area A, photoelectric conversion layers 15 and photoelectric conversion isolation layers 16 are formed; the photoelectric conversion layers 15 include photo diodes, and the photoelectric isolation layers 16 isolate the photoelectric layers 15 from one another.
An interlayer insulating film 17 and metal wires 18 are formed on the front surface of the semiconductor substrate 10, that is, on the transistors 13 and 14, on the photoelectric conversion layers 15, and on the photoelectric conversion isolation layers 16. The metal wires 18 are stacked in the interlayer insulating film 17 in layers via the insulating film.
On the interlayer insulating film 17, a support substrate 20 is formed via an adhesive layer 19. In other words, the interlayer insulating film 17 is joined to the support substrate 20 by the adhesive layer 19. Thus, the semiconductor substrate 10 is fixed by the support substrate 20.
The back surface of the semiconductor substrate 10 includes cut portions, and a metal sputter layer 21 is formed in the cut portions of the back surface of the semiconductor substrate 10, which portions correspond to the analog area B and logic area C. A flattening layer 22 is formed on the back surface of the semiconductor substrate 10 and on the metal sputter layer 21.
Color filters 23 are formed in the pixel area A on the flattening layer 22 to correspond to the respective photoelectric conversion layers 15. A protect layer 24 is formed on the flattening layer 22 and on the color filters 23. Moreover, microlenses 25 are formed on the protect layer 24 to correspond to the respective color filters 23.
The color filters 23 are formed of red color filters, green color filters, and blue color filters. The red color filter is hereinafter referred to as the red filter. The green color filter is hereinafter referred to as the green filter. The blue color filter is hereinafter referred to as the blue filter. The red filter allows red light to pass through. The green filter allows green light to pass through. The blue filter allows blue light to pass through. The structure of the color filters 23 will be described below in detail.
Light entering the microlens 25 passes through the microlens 25 and the corresponding color filter 23 into the corresponding photoelectric conversion layer 15. The photoelectric conversion layer 15 converts the incident light into an electric signal. Circuits formed in the analog area B and the logic area C process the electric signal output by the photoelectric conversion layer 15.
Furthermore, the dicing line area D at the terminal of the chip has the following structure.
The interlayer insulating film 17 is formed on the front surface of the semiconductor substrate 10. The support substrate 20 is formed on the interlayer insulting film 17 via the adhesive layer 19. Alignment marks 26 formed of color filters are provided on the back surface of the semiconductor substrate 10. The alignment marks 26 include a red filter mark formed of a red filter, a green filter mark formed of a green filter, and a blue filter mark formed of a blue filter.
Moreover, the protect layer 24 is formed on the back surface of the semiconductor substrate 10 and on the alignment mark 26.
Now, the structure of the color filters 23 formed on the back surface of the semiconductor substrate 10 will be described with reference to
As shown in the plan view in
The sectional structure of the color filers is as follows.
As shown in
Furthermore, as shown in
The above-described structure shown in
The first embodiment allows formation of color filters that are less misaligned with the photoelectric conversion layers including the photo diodes. This enables the reduction of mixture of colors resulting from the misalignment of the color filters, thus providing images with improved color reproducibility.
As a method for manufacturing a solid-state image pickup device, a method for manufacturing color filters that are a characteristic portion will be described below.
First, as shown in
Moreover, simultaneously with the formation of the red filters 23R in alignment with the active area 15A, the film 23RR, serving as the red filters, is patterned to form a red filter mark 26R as shown in
In the step of forming the red filters 23R, light with a long wavelength such as red (R light) is used for alignment. This enables the active area 15A on the front surface side of the semiconductor substrate 10 to be detected, allowing the red filters 23R to be aligned with the active area 15A. Although the red light passes through the semiconductor substrate 10 and enables the active area 15A on the front surface side of the semiconductor substrate 10 to be detected, light with a short wavelength such as green or blue fails to allow the active area 15A on the front surface side of the semiconductor substrate 10 to be detected.
Then, as shown in
Moreover, simultaneously with the formation of the green filters 23G in alignment with the red filters 23R, the film 23GG, serving as the green filters, is patterned to form a green filter mark 26G as shown in
In the step of forming the green filters 23G, light with a short wavelength such as green (G light) is used. This precludes the active area 15A on the front surface side of the semiconductor substrate 10 from being detected. Thus, the green filters 23G are formed in alignment with the red filter mark 26R formed on the back surface of the semiconductor substrate 10.
Then, as shown in
Moreover, simultaneously with the formation of the blue filters 23B in alignment with the red filters 23R, the film 23BB, serving as the blue filters, is patterned to form a blue filter mark 26B as shown in FIG. BB and
In the step of forming the blue filters 23B, light with a short wavelength such as blue (B light) is used. This precludes the active area 15A on the front surface side of the semiconductor substrate 10 from being detected. Thus, the blue filters 23B are formed in alignment with the red filter mark 26R formed on the back surface of the semiconductor substrate 10.
Subsequently, the microlenses 25 are formed, as shown in
According to the present embodiment, when a plurality of color filters are formed, the red filter, allowing the red light, which has a long wavelength, to pass through, is the first to be formed. This enables the active area positioned deeper than the interface at the back surface to be detected. Thus, the positions of the color filters can be aligned with the active area including a photo diode.
Furthermore, the above-described method for manufacturing eliminates the need to form a dedicated mark on the back surface of the semiconductor substrate. For example, no trench needs to be formed in the back surface of the semiconductor substrate or the silicon substrate need not be dug in the area in which the active area is formed. Thus, even in the backside illumination solid-state image pickup device, the color filters can be accurately aligned with the active area including the photo diode, without any increase in the number of steps required.
According to a second embodiment, red filters are formed, and blue filters are then formed in alignment with the red filters. Finally, green filters are formed in alignment with the red filters. Moreover, each of the red and blue filters is about 80 or 90% of the green filter in area. That is, the green filter is slightly larger than each of the red and green filters in area. The manufacturing steps according to the first embodiment may be used for the second embodiment, for example, by interchanging the orders of the step of forming the green filters and the step of forming the blue filters.
The present embodiment sets the green filter larger than each of the red and blue filters in area. Thus, the green filters allow the transmission of light that most affects a photosensitivity characteristic, thus enabling the photosensitivity characteristic of the photoelectric conversion layers to be improved. The other configurations and effects are similar to those in the first embodiment.
According to the present embodiment, the green filers are formed before the blue filters are formed. However, the following procedure is possible: after the red filters are formed, the green filters are formed to be larger than the red filters by 10 or 20 percents, and then the blue filters are formed. This formation procedure also allows the photosensitivity characteristic of the photoelectric conversion layers to be similarly improved.
As described above, the embodiments can form color filters and microlenses with reduced misalignment with respect to photo diodes without the need for a special step exclusive to the backside illumination solid-state image pickup device or formation of a mark also exclusive to the backside illumination solid-state image pickup device. This enables the reduction of mixture of colors resulting from the misalignment of the color filters, thus providing images with improved color reproducibility.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2011-136353 | Jun 2011 | JP | national |