Process for coatings or optical elements

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H01L27/14685

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14685Process for coatings or optical elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Image sensor with high quantum efficiency
- Patent number 12,243,898
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal grid, backside-illuminated image sensor and...
- Patent number 12,243,905
- Issue date Mar 4, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing process thereof
- Patent number 12,243,890
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ping Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising a pixel array including first pixel groups...
- Patent number 12,243,883
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Junghyung Pyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element having partition wall disposed between...
- Patent number 12,237,352
- Issue date Feb 25, 2025
- FUJIFILM Corporation
- Masahiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with integrated optical die and method forming same
- Patent number 12,228,776
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a pixel separation structure
- Patent number 12,224,296
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hongki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 12,218,159
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and solid-state image sensor including pixel s...
- Patent number 12,218,169
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yosuke Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method of manufacturing the same
- Patent number 12,218,165
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color and multi-spectral image sensor based on 3D engineered material
- Patent number 12,216,290
- Issue date Feb 4, 2025
- California Institute of Technology
- Philip Camayd-Munoz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel sensor including a layer stack to reduce and/or block the eff...
- Patent number 12,218,160
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image acquisition device
- Patent number 12,218,163
- Issue date Feb 4, 2025
- STMicroelectronics (Crolles 2) SAS
- Mickael Fourel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image-sensing structure and method for forming the same
- Patent number 12,218,164
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSI with controllable isolation structure and methods of manufactur...
- Patent number 12,218,166
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor, method for manufacturing fingerprint sensor, an...
- Patent number 12,211,870
- Issue date Jan 28, 2025
- Samsung Display Co., Ltd.
- Si Kwang Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor with scattering structure
- Patent number 12,211,871
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical crosstalk mitigation for a detector array in an optical rec...
- Patent number 12,211,868
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Wojciech Kudla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,974
- Issue date Jan 21, 2025
- Innolux Corporation
- Chandra Lius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical nanostructure rejecter for an integrated device and related...
- Patent number 12,203,853
- Issue date Jan 21, 2025
- Quantum-Si Incorporated
- Ali Kabiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor pixel with deep trench isolation structure
- Patent number 12,205,970
- Issue date Jan 21, 2025
- MAGVISION SEMICONDUCTOR (BEIJING) INC.
- Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal shielding structure to reduce crosstalk in a pixel array
- Patent number 12,205,969
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Ching Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wavelength tunable narrow band filter
- Patent number 12,199,128
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side illuminated image sensor
- Patent number 12,199,131
- Issue date Jan 14, 2025
- STMicroelectronics (Crolles 2) SAS
- Laurent Gay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of integrated analytical devices
- Patent number 12,196,677
- Issue date Jan 14, 2025
- Pacific Biosciences of California, Inc.
- Annette Grot
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with buffer layer and method of forming
- Patent number 12,191,334
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and imaging system
- Patent number 12,192,665
- Issue date Jan 7, 2025
- Canon Kabushiki Kaisha
- Masahiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of manufacturing the same
- Patent number 12,191,335
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sang-Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of making
- Patent number 12,183,753
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR DEVICE AND METHOD
- Publication number 20250072135
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE WITH DEEP TRENCH ISOLATION STRUCTURES
- Publication number 20250072149
- Publication date Feb 27, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- PING ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSOR
- Publication number 20250072131
- Publication date Feb 27, 2025
- STMicroelectronics International N.V.
- Jean SCHOLLHAMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR AND FORMING METHOD THEREOF
- Publication number 20250072133
- Publication date Feb 27, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuqing ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DESIGNING METALENS USED FOR IMAGE SENSOR
- Publication number 20250063841
- Publication date Feb 20, 2025
- SHENZHEN METALENX TECHNOLOGY CO.,LTD
- Wen JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS
- Publication number 20250063837
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR A SEMICONDUCTOR P...
- Publication number 20250063834
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS
- Publication number 20250056909
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Bomi KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MAKING
- Publication number 20250048764
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Po-Han CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION
- Publication number 20250048763
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT RECEIVING DEVICE AND ELECTRONIC DEVICE
- Publication number 20250048767
- Publication date Feb 6, 2025
- Sony Semiconductor Solutions Corporation
- TOMOHIKO BABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20250048761
- Publication date Feb 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250040279
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minkwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EYE GESTURE TRACKING
- Publication number 20250036200
- Publication date Jan 30, 2025
- Artilux, Inc.
- Yun-Chung Na
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR
- Publication number 20250040277
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Juntaek LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LENS ARRAYS AND METHODS OF FORMATION THEREOF
- Publication number 20250040281
- Publication date Jan 30, 2025
- STMicroelectronics LTD
- Yu-Tsung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-ABSORBING STRUCTURE AND PHOTODETECTOR HAVING THE SAME
- Publication number 20250031469
- Publication date Jan 23, 2025
- National Taiwan University
- Ching-Fuh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250015113
- Publication date Jan 9, 2025
- TOPPAN Holdings Inc.
- Shungo TOMIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING APPARATUS AND METHOD OF PRODUCING A SOLID-STATE...
- Publication number 20250015110
- Publication date Jan 9, 2025
- Sony Semiconductor Solutions Corporation
- TAKUSHI SHIGETOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE
- Publication number 20250015102
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PADS FOR IMAGE SENSORS AND RELATED METHODS
- Publication number 20250015117
- Publication date Jan 9, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-SCATTERING NANOSTRUCTURES OF SILICON PIXEL IMAGE SENSORS
- Publication number 20250006759
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING MODULE MANUFACTURING METHOD
- Publication number 20250006756
- Publication date Jan 2, 2025
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS
- Publication number 20250006772
- Publication date Jan 2, 2025
- Dexerials Corporation
- Yuina KOKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20250006757
- Publication date Jan 2, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR STRUCTURE
- Publication number 20250006760
- Publication date Jan 2, 2025
- Arvin EMADI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240429254
- Publication date Dec 26, 2024
- Sony Semiconductor Solutions Corporation
- SHINICHIRO NOUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240429255
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...
- Publication number 20240429261
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ChunHao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND ME...
- Publication number 20240429256
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Gwangho CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Process for coatings or optical elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image sensor with high quantum efficiency

Method of forming metal grid, backside-illuminated image sensor and...

Semiconductor device structure and manufacturing process thereof

Image sensor comprising a pixel array including first pixel groups...

Solid-state imaging element having partition wall disposed between...

Package with integrated optical die and method forming same

Semiconductor device and method of forming micro interconnect struc...

Image sensor including a pixel separation structure

Image sensor and manufacturing method thereof

Semiconductor device and solid-state image sensor including pixel s...

Semiconductor image sensor and method of manufacturing the same

Color and multi-spectral image sensor based on 3D engineered material

Pixel sensor including a layer stack to reduce and/or block the eff...

Image acquisition device

Semiconductor image-sensing structure and method for forming the same

CSI with controllable isolation structure and methods of manufactur...

Fingerprint sensor, method for manufacturing fingerprint sensor, an...

Image sensor with scattering structure

Optical crosstalk mitigation for a detector array in an optical rec...

Electronic device

Optical nanostructure rejecter for an integrated device and related...

Image sensor pixel with deep trench isolation structure

Metal shielding structure to reduce crosstalk in a pixel array

Wavelength tunable narrow band filter

Back-side illuminated image sensor

Arrays of integrated analytical devices

Semiconductor device with buffer layer and method of forming

Solid-state imaging device and imaging system

Image sensor and method of manufacturing the same

Image sensor and method of making

Patents Applicationslast 30 patents

IMAGE SENSOR DEVICE AND METHOD

PHOTODIODE WITH DEEP TRENCH ISOLATION STRUCTURES

LIGHT SENSOR

PHOTODETECTOR AND FORMING METHOD THEREOF

METHOD FOR DESIGNING METALENS USED FOR IMAGE SENSOR

PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS

FULL BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR A SEMICONDUCTOR P...

IMAGE SENSORS

IMAGE SENSOR AND METHOD OF MAKING

IMAGE SENSOR WITH PASSIVATION LAYER FOR DARK CURRENT REDUCTION

LIGHT RECEIVING DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

IMAGE SENSOR

EYE GESTURE TRACKING

IMAGE SENSOR

MICRO LENS ARRAYS AND METHODS OF FORMATION THEREOF

LIGHT-ABSORBING STRUCTURE AND PHOTODETECTOR HAVING THE SAME

SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SAME

SOLID-STATE IMAGING APPARATUS AND METHOD OF PRODUCING A SOLID-STATE...

MULTIPLE WAVELENGTH BAND LIGHT SENSOR DEVICE

PADS FOR IMAGE SENSORS AND RELATED METHODS

NON-SCATTERING NANOSTRUCTURES OF SILICON PIXEL IMAGE SENSORS

IMAGE SENSING MODULE MANUFACTURING METHOD

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND COVER GLASS

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR STRUCTURE

IMAGING DEVICE

ANTI-FLARE SEMICONDUCTOR PACKAGES AND RELATED METHODS

NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...

SHIELDING STRUCTURE FOR REDUCING CROSSTALK OF OPTICAL SENSOR AND ME...