Bell jar extraction tool method and apparatus for thin film photovoltaic materials

Information

  • Patent Grant
  • 8809096
  • Patent Number
    8,809,096
  • Date Filed
    Thursday, October 21, 2010
    14 years ago
  • Date Issued
    Tuesday, August 19, 2014
    10 years ago
Abstract
An apparatus for extracting a bell jar chamber from a processing station of a thin film photovoltaic material is provided. The apparatus includes a rack fixture coupled to a robot loader. The rack fixture is configured to support the bell jar chamber to be moved using the robot loader in a horizontal direction and in a vertical direction. The apparatus further includes at least two support members configured within a vicinity of an upper region of the rack fixture.
Description
CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Provisional Patent Application No. 61/254,194, filed Oct. 22, 2009, entitled “BELL JAR EXTRACTION TOOL METHOD AND APPARATUS” by inventor Paul Alexander, commonly assigned and incorporated by reference herein for all purposes.


BACKGROUND OF THE INVENTION

The present invention relates generally to the manufacture of thin-film photovoltaic modules. More particularly, the present invention provides a method and tool for extracting a supersized chamber used for the manufacture of thin film photovoltaic modules. Merely by way of example, the present invention provides a tool for lifting and extracting a supersized bell jar chamber against gravity load without causing stress-related failure.


Solar energy technology generally converts electromagnetic radiation from the sun to other useful forms of energy. These other forms of energy include thermal energy and electrical power. For electrical power applications, solar cells are often used. Although solar energy is environmentally clean and has been successful to a point, many limitations remain to be resolved before it becomes widely used throughout the world. As an example, one type of solar cell uses crystalline materials, which are derived from semiconductor material ingots. These crystalline materials can be used to fabricate optoelectronic devices that include photovoltaic and photodiode devices that convert electromagnetic radiation into electrical power. However, crystalline materials are often costly and difficult to make on a large scale. Additionally, devices made from such crystalline materials often have low energy conversion efficiencies. Other types of solar cells use “thin film” technology to form a thin film of photosensitive material to be used to convert electromagnetic radiation into electrical power. One advantage of the use of thin film technology in making solar cells is to form modules direct on large sized glass substrates. That requires, at the same time, supersized processing system for treating the thin film cells associated with the large sized glass substrates. Additionally, the processing system is subjected to routing maintenance for maintain thin-film process reliability for enhancing solar cell efficiency depending on applications. Often, conventional tools for handing the supersized processing system are either not available or unfit for newly developed system.


From the above, it is seen that improved apparatus and method for handling new supersized processing system for the manufacture of thin-film solar modules are desired.


BRIEF SUMMARY OF THE INVENTION

The present invention relates generally to the manufacture of thin-film photovoltaic modules. More particularly, the present invention provides a method and tool for handling a supersized processing chamber used for the manufacture of thin film photovoltaic modules. Merely by way of example, the present invention provides a tool for lifting and extracting a supersized bell jar chamber against gravity load without causing stress-related failure.


In a specific embodiment, the present invention provides an apparatus for extracting a bell jar chamber from a processing station of a thin film photovoltaic material. The apparatus includes a rack fixture coupled to a robot loader. The rack fixture is configured to support the bell jar chamber to be moved using the robot loader in a horizontal direction and in a vertical direction. The horizontal direction is normal to the vertical direction. The apparatus further includes at least two support members configured within a vicinity of an upper region of the rack fixture. The two support members have respective arc length regions. The respective arc length regions support at least respective upper inner regions of the bell jar chamber. The rack fixture is in a lifting configuration having the at least two support members to form an intimate contact via a soften material with the upper inner region of the bell jar chamber against all external load. The lifting configuration is associated with a stress indicator of the bell jar chamber to be greater than an intrinsic factor of safety.


In an alternative embodiment, the present invention provides a method for extracting a bell jar chamber with a brittle mechanical characteristic. The method includes providing a rack fixture having at least two support members. Each support member includes an upper edge region. The method further includes inserting the rack fixture including the at least two support members from an open end horizontally into a bell jar chamber along an axial direction of the bell jar chamber. Furthermore, the method includes moving the rack fixture to use the at least two support members to lift the bell jar chamber against a gravitational force for extracting the bell jar chamber from a processing station.


In yet another alternative embodiment, the present invention provides a method for handling a chamber for manufacturing a photovoltaic device. The method includes providing a rack fixture having at least two support members. The method further includes inserting the rack fixture including the at least two support members from an open end into the chamber along an axial direction. Additionally, the method includes raising the rack fixture to form a contact region between each of the two support members and an upper inner region of the chamber. The method further includes lifting the chamber against gravity load and disposing the chamber to a processing station. The processing station includes at least one or more heaters. Furthermore, the method included transferring a substrate bearing a thin-film precursor material into the chamber and sealing the open end of the chamber to create a vacuum condition. The method further includes filling a work gas in the chamber to maintain a predetermined gaseous environment. Moreover, the method includes performing a reactive thermal treatment to the thin-film precursor material in the gaseous environment by supplying thermal energy from the one or more heaters based on a predetermined temperature profile. Through the reactive thermal treatment the thin-film precursor material is transformed to a photovoltaic absorber.


The invention provides the benefit of safely handling a supersized bell jar process chamber of brittle material. The process chamber then can be removed from a manufacturing system for maintenance and replaced by a redundant chamber for substantial saving in process time.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a schematic perspective view of a tool for extracting a bell jar chamber according to an embodiment of the present invention.



FIG. 2 is a partial cross-sectional view of a support member with an O-ring in a Dovetail groove according to one or more embodiments of the present invention.



FIG. 3 is a simplified diagram illustrating a method for extracting a bell jar chamber using a tool according to an embodiment of the present invention.



FIG. 4 is a simplified perspective view of a bell jar chamber lifted using the tool according to an embodiment of the present invention.



FIG. 5 is a simplified cross-sectional view of a lifted bell jar chamber under stressed deflection according to an embodiment of the present invention.



FIG. 6 is a perspective view of a worst case example of lifting the bell jar chamber by contact at concentrated points according to an embodiment of the present invention.



FIG. 7 is a simplified flow diagram of a method for handling a chamber for manufacturing a photovoltaic device according to an embodiment of the present invention.





DETAILED DESCRIPTION OF THE INVENTION

The present invention relates generally to the manufacture of thin-film photovoltaic modules. More particularly, the present invention provides a method and tool for handling a supersized processing chamber used for the manufacture of thin film photovoltaic modules. The invention provides a tool for lifting and extracting a supersized bell jar chamber against gravity load without causing stress-related failure.



FIG. 1 is a schematic perspective view of a tool for extracting a bell jar chamber according to an embodiment of the present invention. This diagram is merely an example, which should not unduly limit the claims herein. One of ordinary skilled should recognize many variations, alternatives, and modifications in geometric shape, elemental configuration, and material selection. As shown, the tool is schematically illustrated by an elongated rack fixture 110, designated for handling a bell jar chamber (not shown) which for example has an essentially tubular shape with an open end and a close end. The elongated rack fixture 110 is shown to have a long length along x-direction which may be used to handle the bell jar chamber along its tubular length. Further, two or more support members 120 can be mounted on an upper region of the elongated rack fixture 110 with a proper spatial distance to each other. Each support member 120 has an upper edge region configured to have a spatial spread for forming an area contact with a corresponding upper inner region of the bell jar chamber when performing an extracting or lifting process. In a specific embodiment, to adapt an axial symmetry of the tubular shaped chamber, the upper edge region of the support member 120 is preferred to have the spatial spread mainly across the elongated rack fixture. In an example, the upper edge region bears the spatial spread along an arc length in a y-z plane substantially perpendicular to x-direction. One advantage of the proper spatial spread and the shape of the upper edge region is to provide much reduced stress load when the support member 120 of the elongated rack fixture 110 is used for making contact with the bell jar chamber or other target super sized process system made by a brittle material. Additionally, a softened polymeric material 130 can be installed to the upper edge and aligned along the arc length for further reducing contact stress applied to the target.



FIG. 2 is a partial cross-sectional view of a support member with an O-ring in a Dovetail groove according to one or more embodiments of the present invention. This diagram is merely an example, which should not unduly limit the claims herein. One of ordinary skilled should recognize many variations, alternatives, and modifications. A portion of the support member 120 is shown along a cross-sectional plane in parallel to the x-direction (or perpendicular to the y-z plane) of FIG. 1. As shown, a groove region 125 is formed into the upper edge region 120. In particular, the groove is a Dovetail groove. In the example, the softened polymeric material 130 installed inside the groove region is a rubber material. In another example, a kind of partial elastic material may be used. For example, Delrin Acetal material may be used. In a specific example, an O-ring (rubber) with a proper diameter (e.g., 0.75 inches) larger than a depth of the groove region is installed so that a portion of the softened material 130 stays outside the groove region 125. The shape of Dovetail groove can keep the installed O-ring material 130 fairly firm in places. The depth of the groove and the elasticity of the O-ring material 130 can be selected to ensure it is at least partially stayed between the upper edge region 120 and any target surface region it is against. In certain example, a small triangular shaped elongated element 126 may be added to each side of the groove 125 along the arc length (perpendicular to the cross-section plane) to prevent all the O-ring material to be squeezed into the groove 125. In a specific embodiment, the groove 125 is aligned in perpendicular direction relative to the x-direction, even though the upper edge region of the support member can be an arbitrary shape depending on applications.


Referring to FIG. 3, a simplified diagram illustrates a method for extracting a bell jar chamber using a tool according to an embodiment of the present invention. This diagram is merely an example, which should not unduly limit the claims herein. One of ordinary skilled should recognize many variations, alternatives, and modifications. As shown, the method includes using the tool described in FIGS. 1 and 2 for lifting and extracting a bell jar chamber 300 having an elongated tubular shape with an open end 301. The tool including a rack fixture 310 with at least two support members 320 is inserted through the open end 301 into an inner spatial region of the bell jar chamber 300. In particular, taking advantage of the symmetric geometric shape, the rack fixture 310 is inserted substantially in parallel to an axial direction (x) of the bell jar chamber 300. The rack fixture 310 has its length substantially within the whole inner spatial region as shown, although this is not required because it can be made much longer than the length of the bell jar chamber 300. Not shown in the FIG. 3, the rack fixture 310 is coupled to a robot loader which can be configured to move linearly along the x-direction to perform the insert operation of the rack fixture 310 including all the support members 320 mounted on an upper side of the rack fixture 310. In an embodiment the bell jar chamber 300 is disposed with its axial direction (x) aligned horizontally, although other orientations can be used.


In a specific embodiment, each of the two support members 320 spread its upper edge to an arc length 321 across the rack fixture 310. In a specific embodiment, the bell jar chamber 300 is made of quartz material to take advantage of its property as a good thermal conductor and an excellent chemical inert matter to be used as a furnace chamber in an application for conducting a reactive thermal process therein. In an implementation, the bell jar chamber 300 is removably installed within a processing station of a thin-film photovoltaic device manufacture system. For example, the tubular shaped bell jar chamber is wholly surrounded by one or more heating elements or cooling elements mounted on an outer shell body. The bell jar chamber is sealed by a cover member engaged with the open end 301. In an example, the bell jar chamber 300 is used for forming a gaseous environment for chemically treating a precursor material on large glass substrates loaded therein to form a thin-film photovoltaic absorber. In order to maintain a large scale manufacture processing within a controlled manner, the bell jar chamber 300, after certain process runs, may be extracted out of the process system for cleaning and other maintenance works while replaced with another cleaned chamber for conducting the manufacture process in the mean time. The quartz material is relatively brittle and may be breakable if the tool for extracting the bell jar chamber 300 causes an internal stress level over certain ranges defined by a minimum factor of safety. In a specific embodiment, the support members for handling the chamber are configured to provide support the bell jar chamber against all external load without causing internal stress level to be near the ranges having high failure (breaking) probability.


In the example shown in FIG. 3, each of the two support members 320 uses its full arc length 321 to engage with an upper inner region of the bell jar chamber 300. In particular, the support member 320 is substantially aligned to a (y-z) plane perpendicular to the rack fixture in x-direction (along axial direction of the bell jar chamber) so that the arc length 321 can be configured to match with the curvature of the corresponding upper inner region of the bell jar chamber. Therefore, when the support member 320 lifts the chamber (upward along y-direction), the contact area is spread to the whole arc length 321 instead of one or two isolated points, substantially reducing the stress it causes to contact area of the chamber around the upper inner region. The orientation of the spread arc length 321 takes advantage of the geometric symmetry to a target structure such as the tubular shape of the bell jar chamber. Of course, for certain variation of the target structure, the support member 320 can be aligned in one or more alternative orientation. In a specific embodiment, the arc length 321 is made to be larger than a certain range, depending on the size of the target structure, for achieving enough reduction in stress relief. As shown in FIG. 3, the arc length 321 has a corresponding included angle 332. The included angle 332 is a good indicator for a relative arc length 321 of a specific support member 320 designated for handling certain target structure. In the example, shown in FIG. 3, the included angle 332 is about 90 degrees or greater. Theoretically, the included angle 332 can be as large as 180 degrees to cover all upper half of the inner wall, but the arc length may be too long for causing inconvenience in handling of the tool itself as a whole apparatus during its application.


Additionally, the two support members 320 are disposed with a spatial gap 322 between each other. As the tool (or specifically the rack fixture 310) is inserted into the bell jar chamber 300, it should be reached to a preferred position so that when the rack fixture moves up to let the support members 320 to lift the chamber 300 the two support members 320 are respectively located substantially in a vicinity of a balanced position relative to a center of gravity 303 of the bell jar chamber 300. In an embodiment, the value of the spatial gap 322 can be relative flexible within a certain range but correspondingly the preferred position to dispose the rack fixture 310 inside the bell jar chamber must be restricted to a certain spatial range accordingly.


Referring to FIG. 3, a soften material 330 can be inserted between an upper edge of the support member 320 to cover the whole arc length 321 so that when the engagement between the support member 320 and the inner wall region occurs the soften material 330 can provide further reduction of contact stress. The soften material 330, in one or more embodiments, can be selected from one material consisting of a rubber material or other partial elastic material, for example, O-rings, or Delrin Acetal material, for lowering stress concentration in the vicinity of the contact area. As mentioned in an example shown in FIG. 2, 0.75 inches diameter O-ring cushions is used as the stress reduction soften material and installed in a Dovetail groove formed along the whole arc length of the upper edge of the support member.



FIG. 4 is a simplified perspective view of a bell jar chamber lifted using the tool according to an embodiment of the present invention. This diagram is merely an example, which should not unduly limit the claims herein. One of ordinary skilled should recognize many variations, alternatives, and modifications. As shown, two support members 320 each with a lateral spread having a curved arc length are used for lifting the target tubular shaped structure 300 against its weight. One support member is located at a front tip of an elongated rack fixture 310 inserted deep into an interior space from an open end 301 and the other one is spaced away closer to the open end 301. In an embodiment, the support member 320 is the same as that described in earlier paragraphs and FIGS. 1-3. The tubular shaped structure 300 has a substantial circular inner wall. The upper edge of the support member 320 is also configured to have an arc shape with substantially the same curvature as the circular inner wall and an arc length corresponding to a 90-degree included angle. Therefore, the upper edge region of each support member 320 forms an intimate contact with a corresponding inner wall region. As shown, the only load applied to the target tubular shaped structure is its gravity. In the contact region along the upper edge with a spread arc length, tensile forces 401, 403, 404, 405, and 406, applied to the inner wall are schematically marked for several points. A belt region 400 of the inner wall extended beyond the arc length (FIG. 4) is selected to be a target region for finite element stress analysis. For example, the force 401 on the support member at the back position is primarily pointed to y-direction with a tensile stress value of about 218 lb and x- and z-element of the force 401 is substantially small, 0.00012 lb and 0.0012 lb, respectively. Because the chamber has a closed front end and an opened back end (as shown in FIG. 4), the support member at the front tip position may apply a bigger force to the corresponding region of the target structure than one applied by the back support member for a balanced lifting of the structure. For example, force 411 has a tensile stress value of about 330 lb in y-direction and two very small compressive stress values respectively in x- and z-direction.


The tool as described in above configuration for handling an exemplary bell jar chamber is modeled using a Solidworks™ Simulation software with a simplification of linear force calculation. In this model, the bell jar chamber is selected to be made by quartz material having a density of 2.05 kg/m3. The length of the bell jar chamber is set to be 80 inches and the inner diameter of the tube is set to be 40 inches with a shell thickness of about 18 mm and greater. Based on the material properties as proposed, the model yields an estimation of a tensile strength σT for the specific quartz bell jar chamber to be about 4800 psi and a compressive strength σC to be about 72520 psi. These estimations are comparable with values from Heraeus Brochure: tensile strength σT 40 N/mm2 and compressive strength σC 500 N/mm2, respectively. In order to determine whether the tool is able to handle the target structure without causing any stress related material or structural failure, an internal friction theory, also known as Mohr-Coulomb theory, is applied. Using Mohr-Coulomb theory, a stress-related material failure criterion is defined as:

σ1T3C<1.  (1)

Where σ1 and σ3 are respectively the tensile load and compressive load applied to the target structure. This criterion is used for brittle material with different tensile and compressive properties. Brittle materials do not have specific yield point and hence the yield strength is not recommended for defining limit stresses in this criterion. For designing a reliable tool for handling target structure, a design load (both tensile and compressive) for the target structure is given to provide a safe margin of stress level away from the material limit values. A factor of safety (FOS) can be defined as:

FOS=(σ1dT3dC)−1  (2)

Here σ1d and σ3d are respectively the design tensile load and design compressive load applied to the target structure. For the bell jar chamber in quartz material a design load is given as 830 psi. This yields a FOS=7.0. In current model, a first principle tensile stress is estimated without considering compressive term and a finite element stress analysis is performed so that the FOS value can be mapped throughout the body of the target structure (though usually only a smaller region is selected for saving in calculation time). In a specific example, two support members 320 are respectively disposed at a position 13 inches and 73 inches from the open end 301; a soften material is also installed in a groove region of the upper edge region of each support member for providing reduction of contact force. A Delrin “O-rings” (which has a linear force deflection characteristic) is used in the model for simplifying the calculation to avoid non-linear solver. The simulation yields a minimum FOS value for this lifting configuration is 18, well above (safer) the minimum FOS 7.0 for quartz material.



FIG. 5 is a simplified cross-sectional view of a lifted bell jar chamber under stressed deflection according to an embodiment of the present invention. This diagram is merely an example, which should not unduly limit the claims herein. One of ordinary skilled should recognize many variations, alternatives, and modifications. As shown is a view of a lifted bell jar chamber 300A from the open end direction. In a specific embodiment, the tool for lifting the bell jar chamber 300A in y-direction (up as indicated by the arrow) includes a rack fixture 310 in axial direction (into the paper plane) of the bell jar chamber and support members 320 spread laterally at least an arc length 330 in a perpendicular plane (within the paper plane). The tool is substantially the same as one used in FIG. 4 and two support members are assumed to lift at respectively 13 inches and 73 inches distances from the open end. The lifting is substantially against the gravitational force (the weight of the bell jar chamber) only. Depending on the extent of the lateral spread of the support member, the contact region only is a limited part of upper inner wall of the bell jar chamber. The weight of the bell jar chamber can cause internal stress and effectively lead to a downward chamber deflection, turning a circular shaped bell jar 300B before lifting into an oval shaped bell jar 300A after in cross sectional view. Specifically in this example, the bottom part shifted the most by about 0.01 inches. The deflection of the bell jar 300A also causes a higher contact force near two end points of the support member against the inner wall. For example, the contact force is about 137 lb at the end point associated with the front support member and about 319 lb at the end point associated with the back support member near the open end. The estimation of these contact forces is based on a tool configuration mentioned above (FIGS. 4 and 5) and has Delrin O-rings installed in the contact region 330. In an implementation, the Delrin O-rings can be replaced by rubber O-rings, the gravitational force induced contact force at the end point is expected to be lower.



FIG. 6 is a perspective view of a worst case example of lifting the bell jar chamber by two contact points according to an embodiment of the present invention. This diagram shows an extreme case using concentrated points of contact. As shown, the support member with lateral spread is simply removed and the rack fixture 310 is inserted along an axial direction of a bell jar chamber 300 from an open end 301 to use two protruded points on its upper edge directly for lifting the bell jar chamber. In this configuration, the same simulation model based on a Solidworks™ software is applied to calculate the stress distribution throughout the body of the chamber 300. Regional finite element analysis yields an estimated minimum FOS value of 3.9 by Mohr-Coulomb theory. Certainly this value is smaller than FOS value 7.0 for quartz. In other words, this indicates that the simplified tool as shown in FIG. 6 may not be a safe tool for lifting the target bell jar chamber. The bell jar chamber 300 can be broken by lifting from an upper inner region with such two concentrated contact points along a narrowed bar along axial direction of the rack fixture 310. Specifically, a maximum tensile stress 603 is obtained at the inner contact point with an estimated value to be 2903 psi. It is well above the design load for this target structure and a half of the tensile strength for quartz material.


Also note that, in an alternative example, the open end 301 of the bell jar chamber 300 has a geometric asymmetric stress effect induced by gravity. The two support members not only should be disposed separately with a proper distance from the center of gravity of the bell jar chamber, but also should be disposed at least a certain preferred distance away from the open end 301 so that the stress level for any local contact region would not surpass the intrinsic tensile/compressive strength of the material. An exemplary analysis shows that with a contact point associated with the back support member at 12 inches closer to the open end 301, the stress at the contact point can be as large as 10000 psi due to the change of the load distribution. This is well above the tensile strength of 5800 psi and most likely will result in tube breaking.



FIG. 7 is a simplified flow diagram of a method for handling a chamber for manufacturing a photovoltaic device according to an embodiment of the present invention. As shown in FIG. 7, the present method is described below.

    • 1. Start;
    • 2. Provide a rack fixture having at least two support members;
    • 3. Insert the rack fixture from an open end into the chamber along an axial direction;
    • 4. Lift the chamber by using the two support members against respective upper inner regions of the chamber;
    • 5. Dispose the chamber to a processing station;
    • 6. Transfer a precursor material into the chamber;
    • 7. Seal the open end of the chamber;
    • 8. Filling a work gas in chamber;
    • 9. Perform a reactive thermal treatment to the precursor material to form a photovoltaic absorber; and
    • 10. Stop.


As shown, the above method provides a way of handling a chamber for the manufacture of a photovoltaic device according to an embodiment of the present invention. In a preferred embodiment, the method uses a chamber made by quartz material that is inert to the reactive chemical and good in thermal conduction for conducting the desired thermal reactive process therein for forming a photovoltaic absorber material. The chamber can be a tubular bell jar shape and can be also a rectangular cubic shape or other geometries. The chamber can have large size of about 2 meters or greater in length and 1 meter or greater in diameter with about 18 mm or greater in shell thickness.


As shown in FIG. 7, the method 700 starts with a start step 701. The present method provides a method for safely handling a chamber (having a particularly large size) made by brittle material and disposing in a processing station of a thin-film photovoltaic device manufacture system. The chamber and its disposition are designed specifically for large scale reactive thermal processing of thin-film photovoltaic materials. According to an embodiment, the chamber is a removable module of a furnace system so that the chamber can be extracted out for maintenance and disposed with a ready-to-use replacement chamber, all handled by a tool designed according to embodiments of the present invention. In regards to the chamber extraction and re-disposition using the tool, factor of safety of the design of the tool itself and associated configuration can play a role within overall manufacture processes. Here, the method begins with an implementation of a tool at a target structure, such as the one noted above, as well as others.


The tool includes a rack fixture having at least two support members provided in step 710. The rack fixture can be associated with a robot loader that is capable of moving linearly, for example, along x-direction horizontally in parallel to an axial direction associated with a tubular shaped target structure. In an embodiment, the rack fixture is an elongated bar structure with a first support member being spaced from a second support member.


The tool further includes the at least two support members on an upper region of the rack fixture. In an embodiment, the rack fixture has a length selected based on the target structure, for example, a tubular shaped bell jar chamber. The length of the rack fixture is at least no shorter than 75% of the length of the bell jar chamber. In another embodiment, one of support members is mounted on a front end of the rack fixture and at least another one is mounted at a position with a predetermined distance from the front end. Depending on target structure geometric shape and material property, the mounting position of the support members can be within a range of distances relative to the target structure. The support member can be in different orientations relative to the elongated rack fixture. In a specific embodiment, the support member is aligned substantially in a plane perpendicular to the length direction of the rack fixture.


Through an open end of the target bell jar chamber, the rack fixture including the at least two support members can be inserted within an inner diameter along an axial direction, as shown in step 720. In an embodiment, the tool is coupled to a robot loader. The robot loader is configured to move horizontally to insert the whole rack fixture into the bell jar chamber which is set on a base support with the bell jar axial direction (e.g, x-direction) in a horizontal direction.


Further, the method 700 includes a step 730 to lift the chamber by using the two support members against respective upper inner regions of the chamber. In a specific embodiment, the same robot loader is used to raise the whole rack fixture upward (e.g., in a y-direction which is normal to the x-direction) such that each support member forms a contact region with the bell jar chamber. In another specific embodiment, the support member is configured to have its upper region being spread laterally with a curved length that is configured to be substantially matched in curvature with the upper inner region of the chamber. Additionally, the upper region of the support member can include a soften material so that the contact region becomes cushioned for reducing stress or at least unidirectional contact forces. For example, a rubber material such as that for O-rings can be installed in a groove region formed in the upper region. This feature may be critical in stress reduction especially between a hard material (the tool) and a brittle material (the chamber). In yet another specific embodiment, the contact region for each support member is within a preferred location range so that lifting the target structure (the chamber) by the two support members would be balanced against the whole external load, which is only a gravitational force for the present implementation. Overall, the lifting of the chamber by the configured tool can be monitored through a stress indicator so that the handling of the chamber by the tool in a specific configuration has a factor of safety substantially higher than a minimum factor of safety associated with intrinsic material property. Therefore, once the lifting step is completed, the chamber is under a stress level that is safe and substantially small in risk of breakage or stress-related failure.


Once the chamber is lifted, the method performs a next step 740 to dispose the lifted chamber into a processing station of a manufacture system for treating thin-film photovoltaic materials. In particular, the processing station is an apparatus for holding the chamber and providing controlled thermal energy to the chamber so that a reactive thermal treatment can be performed to one or more thin-film materials on substrates loaded inside the chamber. This step can be further carried out by using the robot loader to move the bell jar chamber lifted by the two support members of the rack fixture. The bell jar chamber is moved into the processing station which is configured to be surrounded by one or more heaters mounted in a shell structure. The process station also can be equipped with one or more cooling devices for maintaining a balanced thermal energy control. The combined heaters and cooling devices are designed to supply thermal energy to the bell jar chamber and additionally to control chamber temperature following a predetermined temperature profile designated for treating thin-film photovoltaic materials on a plurality of substrates. After disposing the bell jar chamber in the processing station, the tool can be retracted out of the chamber, again controlled by the robot loader in both vertical and horizontal directions.


The method 700 additionally includes step 750 to transfer one or more substrates bearing one or more thin-film precursor materials into the bell jar chamber through the open end. In a specific embodiment, the one or more thin-film precursor materials include copper indium (or gallium) mixture (or alloy) materials pre-deposited on glass substrates. These precursor materials are examples of many material elements used for forming thin-film photovoltaic solar cells.


Referring to FIG. 7, the method 700 further applies step 760 to seal the chamber by using a cover member engaged with the open end of the bell jar chamber. The step 760 further includes pumping down the chamber to achieve a desired vacuum condition. The cover member includes a vacuumed edge ring to ensure tightly close of the open end. In an embodiment, the pump outlet is built on the cover member and the vacuum is monitored by one or more pressure sensors.


The method 700 further includes filling the chamber with a work gas up to a desired pressure level in step 770. The work gas is designed for react with the precursor material for forming a desired end material product. For example, the work gas includes hydrogen selenide gas mixed with pure nitrogen gas for treating a copper-indium-gallium based precursor thin-film material. The gas filling inlet can be built in the cover member mentioned before.


Furthermore, the method 700 can start step 780 to perform a reactive thermal treatment of the precursor material loaded in the chamber using thermal energy supplied by the one or more heaters following a predetermined temperature profile. The process includes temperature ramping stages and temperature dwelling stages so that the precursor material on the substrates can react with the work gas in the gaseous environment formed inside the heated bell jar chamber. For example, a dwelling stage is set to be at 425° C. for 10-80 minutes. The method 700 may end with step 799 after the precursor material is transformed into a photovoltaic absorber material by the reactive thermal treatment inside the bell jar chamber.


The above sequence of processes or steps provides a handling method for a chamber used for processing a thin-film photovoltaic material according to an embodiment of the present invention. As shown, the method uses a combination of steps including providing a specific tool for safely handling a target structure which is a shaped chamber made by a relative brittle material, disposing the shaped chamber in process system, transferring precursor materials in the shaped chamber, and performing reactive thermal treatment of the precursor materials for the manufacture of the thin-film solar cells.


Although the above has been illustrated according to specific embodiments, there can be other modifications, alternatives, and variations. It is understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this application and scope of the appended claims.

Claims
  • 1. An apparatus for extracting a bell jar chamber from a processing station of a thin film photovoltaic material, the apparatus comprising: a rack fixture coupled to a robot loader, the rack fixture being configured to support the bell jar chamber to be moved using the robot loader in a horizontal direction and in a vertical direction, the horizontal direction being normal to the vertical direction; andat least two support members configured within a vicinity of an upper region of the rack fixture, the two support members having respective arc length regions, the respective arc length regions supporting at least respective upper inner regions of the bell jar chamber.
  • 2. The apparatus of claim 1 further comprising polymeric material overlying each of the two support members, the polymeric material being configured to cushion the arc length regions of the support members; wherein the bell jar chamber comprises a quartz material, the bell jar chamber having an axial length of about 200 cm and greater from an open end to a closed end, a diameter of 100 cm and greater, and a shell thickness of about 1.8 cm and greater, the bell jar chamber being characterized by an intrinsic factor of safety of about 7.0 based on Mohr-Coulomb failure theory applied for the quartz material.
  • 3. The apparatus of claim 2 wherein the polymeric material is selected from one material consisting of a rubber material, an O-ring, or a Delrin Acetal material.
  • 4. The apparatus of claim 2 wherein each of the at least two support members is no closer to the open end of the bell jar chamber than a distance of 15% of an axial length of the bell jar chamber.
  • 5. The apparatus of claim 1 wherein each support member comprises a groove region formed from a first end to a second end along the arc length region, the arc length region being configured with a curvature substantially fitted with the upper inner region of the bell jar chamber; wherein each of the support members comprising an annular rubber member coupled within the groove region to cushion the support member from the upper inner region of the bell jar chamber.
  • 6. The apparatus of claim 5 wherein the groove region comprises a dovetail structure.
  • 7. The apparatus of claim 5 wherein the first end and the second end of the arc length region comprises an corresponding included angle of about 90 degrees and greater.
  • 8. The apparatus of claim 1 wherein the two support members comprising a first support member spaced from a second support member to balance the bell jar chamber around a center of gravity of the bell jar chamber.
  • 9. The apparatus of claim 1 wherein the processing station comprises an apparatus configured for holding the bell jar chamber and providing thermal energy to the bell jar chamber for thermally treating photovoltaic materials on a plurality of substrates loaded inside the bell jar chamber.
  • 10. The apparatus of claim 1 wherein the rack fixture is configured to support the bell jar chamber to maintain a stress level of the bell jar chamber to below a breakage stress of the bell jar chamber by a factor of safety, the factor of safety being defined as an inverse sum of a first ratio of an applied tensile stress over a tensile strength of chamber material and a second ratio of an applied compressive stress over a compressive strength of chamber material.
  • 11. The apparatus of claim 1 wherein the bell jar chamber is subjected to only a stress associated with a gravitational force.
  • 12. A method for extracting a bell jar chamber with a brittle mechanical characteristic, the method comprising: providing a rack fixture having at least two support members, each support member comprising an upper edge region;inserting the rack fixture including the at least two support members from an open end horizontally into a bell jar chamber along an axial direction of the bell jar chamber; andmoving the rack fixture to use the at least two support members to lift the bell jar chamber against a gravitational force for extracting the bell jar chamber from a processing station.
  • 13. The method of claim 12 wherein the providing the rack fixture comprises coupling the rack fixture to a robot loader configured to move horizontally and vertically.
  • 14. The method of claim 12 wherein the providing the rack fixture having at least two support members comprises disposing a first two support member spaced from a second support member by a predetermined distance related at least to a center of gravity of the bell jar chamber.
  • 15. The method of claim 12 wherein each of the at least two support members comprises a groove region formed from a first end to a second end along the upper edge region, the groove region being configured to hold a soften material for reducing stress level of the bell jar chamber around a contact region between the upper edge region of the two support members and an upper inner region of the bell jar chamber.
  • 16. The method of claim 12 wherein the moving the rack fixture comprises positioning the two support members to respective positions that are substantially balanced relative to a center of gravity of the bell jar chamber and at least a predetermined distance away from the open end of the bell jar chamber.
  • 17. The method of claim 16 wherein the predetermined distance comprises about 15% of an axial length of the bell jar chamber.
  • 18. The method of claim 12 wherein the using the two support members to lift the bell jar chamber comprises raising and moving the bell jar chamber without causing a stress level of the bell jar chamber to surpass a factor of safety defined by Mohr-Coulomb failure theory for a brittle material.
  • 19. A method for handling a chamber for manufacturing a photovoltaic device, the method comprising: providing a rack fixture having at least two support members;inserting the rack fixture including the at least two support members from an open end into the chamber along an axial direction;raising the rack fixture to form a contact region between each of the two support members and an upper inner region of the chamber;lifting the chamber against a gravitational force;disposing the chamber to a processing station including at least one or more heaters;transferring a substrate bearing a thin-film precursor material into the chamber;sealing the open end of the chamber to create an vacuum condition;filling a work gas in the chamber to maintain a predetermined gaseous environment; andperforming a reactive thermal treatment to the thin-film precursor material in the gaseous environment by supplying thermal energy from the one or more heaters based on a predetermined temperature profile, the thin-film precursor material being transformed to a photovoltaic absorber.
  • 20. The method of claim 19 wherein the chamber comprises a quartz bell jar having a tubular shape with an open end and a closed end.
  • 21. The method of claim 20 wherein each of the two support members is configured to have the contact region spread laterally with an arc length following the tubular shape of an inner region of the bell jar, the arc length corresponding to an included angle of 90 degrees and greater.
  • 22. The method of claim 21 wherein the inner region of the bell jar is subjected to a contact force substantially smaller than an intrinsic stress strength of the quartz bell jar.
US Referenced Citations (272)
Number Name Date Kind
3520732 Nakayama et al. Jul 1970 A
3828722 Reuter et al. Aug 1974 A
3975211 Shirland Aug 1976 A
4062038 Cuomo et al. Dec 1977 A
4263336 Thompson et al. Apr 1981 A
4332974 Fraas Jun 1982 A
4335266 Mickelsen et al. Jun 1982 A
4441113 Madan Apr 1984 A
4442310 Carlson et al. Apr 1984 A
4461922 Gay et al. Jul 1984 A
4465575 Love et al. Aug 1984 A
4471155 Mohr et al. Sep 1984 A
4499658 Lewis Feb 1985 A
4507181 Nath et al. Mar 1985 A
4517403 Morel et al. May 1985 A
4518855 Malak May 1985 A
4542255 Tanner et al. Sep 1985 A
4581108 Kapur et al. Apr 1986 A
4589194 Roy May 1986 A
4598306 Nath et al. Jul 1986 A
4599154 Bender et al. Jul 1986 A
4611091 Choudary et al. Sep 1986 A
4623601 Lewis et al. Nov 1986 A
4625070 Berman et al. Nov 1986 A
4638111 Gay Jan 1987 A
4661370 Tarrant Apr 1987 A
4663495 Berman et al. May 1987 A
4705912 Nakashima et al. Nov 1987 A
4724011 Turner et al. Feb 1988 A
4727047 Bozler et al. Feb 1988 A
4751149 Vijayakumar et al. Jun 1988 A
4775425 Guha et al. Oct 1988 A
4793283 Sarkozy Dec 1988 A
4798660 Ermer et al. Jan 1989 A
4816082 Guha et al. Mar 1989 A
4816420 Bozler et al. Mar 1989 A
4865999 Xi et al. Sep 1989 A
4873118 Elias et al. Oct 1989 A
4915745 Pollock et al. Apr 1990 A
4950615 Basol et al. Aug 1990 A
4968354 Nishiura et al. Nov 1990 A
4996108 Divigalpitiya et al. Feb 1991 A
5008062 Anderson et al. Apr 1991 A
5011565 Dube et al. Apr 1991 A
5028274 Basol et al. Jul 1991 A
5039353 Schmitt Aug 1991 A
5045409 Eberspacher et al. Sep 1991 A
5069727 Kouzuma et al. Dec 1991 A
5078803 Pier et al. Jan 1992 A
5125984 Kruehler et al. Jun 1992 A
5133809 Sichanugrist et al. Jul 1992 A
5137835 Karg Aug 1992 A
5154777 Blackmom et al. Oct 1992 A
5180686 Banerjee et al. Jan 1993 A
5211824 Knapp May 1993 A
5217564 Bozler et al. Jun 1993 A
5231047 Ovshinsky et al. Jul 1993 A
5248345 Sichanugrist et al. Sep 1993 A
5259883 Yamabe et al. Nov 1993 A
5261968 Jordan Nov 1993 A
5298086 Guha et al. Mar 1994 A
5336381 Dalzell, Jr. et al. Aug 1994 A
5336623 Sichanugrist et al. Aug 1994 A
5346853 Guha et al. Sep 1994 A
5397401 Toma et al. Mar 1995 A
5399504 Ohsawa Mar 1995 A
5436204 Albin et al. Jul 1995 A
5445847 Wada Aug 1995 A
5474939 Pollock et al. Dec 1995 A
5501744 Albright et al. Mar 1996 A
5512107 van den Berg Apr 1996 A
5518549 Hellwig May 1996 A
5528397 Zavracky et al. Jun 1996 A
5536333 Foote et al. Jul 1996 A
5578103 Araujo et al. Nov 1996 A
5578503 Karg et al. Nov 1996 A
5622634 Noma et al. Apr 1997 A
5626688 Probst et al. May 1997 A
5665175 Safir Sep 1997 A
5676766 Probst et al. Oct 1997 A
5698496 Fastnacht et al. Dec 1997 A
5726065 Szlufcik et al. Mar 1998 A
5738731 Shindo et al. Apr 1998 A
5858819 Miyasaka Jan 1999 A
5868869 Albright et al. Feb 1999 A
5925228 Panitz et al. Jul 1999 A
5977476 Guha et al. Nov 1999 A
5981868 Kushiya et al. Nov 1999 A
5985691 Basol et al. Nov 1999 A
6040521 Kushiya et al. Mar 2000 A
6048442 Kushiya et al. Apr 2000 A
6092669 Kushiya et al. Jul 2000 A
6107562 Hashimoto et al. Aug 2000 A
6127202 Kapur et al. Oct 2000 A
6160215 Curtin Dec 2000 A
6166319 Matsuyama Dec 2000 A
6172297 Hezel et al. Jan 2001 B1
6258620 Morel et al. Jul 2001 B1
6284312 Chandra et al. Sep 2001 B1
6288325 Jansen et al. Sep 2001 B1
6294274 Kawazoe et al. Sep 2001 B1
6307148 Takeuchi et al. Oct 2001 B1
6310281 Wendt et al. Oct 2001 B1
6323417 Gillespie et al. Nov 2001 B1
6328871 Ding et al. Dec 2001 B1
RE37512 Szlufcik et al. Jan 2002 E
6361718 Shinmo et al. Mar 2002 B1
6365225 Chandra et al. Apr 2002 B1
6372538 Wendt et al. Apr 2002 B1
6423565 Barth et al. Jul 2002 B1
6632113 Noma et al. Oct 2003 B1
6635307 Huang et al. Oct 2003 B2
6653701 Yamazaki et al. Nov 2003 B1
6667492 Kendall Dec 2003 B1
6690041 Armstrong et al. Feb 2004 B2
6692820 Forrest et al. Feb 2004 B2
6784492 Morishita Aug 2004 B1
6852920 Sager et al. Feb 2005 B2
6878871 Scher et al. Apr 2005 B2
6974976 Hollars Dec 2005 B2
7122398 Pichler Oct 2006 B1
7179677 Ramanathan et al. Feb 2007 B2
7194197 Wendt et al. Mar 2007 B1
7220321 Barth et al. May 2007 B2
7235736 Buller et al. Jun 2007 B1
7252923 Kobayashi Aug 2007 B2
7265037 Yang et al. Sep 2007 B2
7319190 Tuttle Jan 2008 B2
7364808 Sato et al. Apr 2008 B2
7441413 Bae et al. Oct 2008 B2
7442413 Zwaap et al. Oct 2008 B2
7544884 Hollars Jun 2009 B2
7736755 Igarashi et al. Jun 2010 B2
7741560 Yonezawa Jun 2010 B2
7855089 Farris, III et al. Dec 2010 B2
7863074 Wieting Jan 2011 B2
7910399 Wieting Mar 2011 B1
7955891 Wieting Jun 2011 B2
7960204 Lee Jun 2011 B2
7993954 Wieting Aug 2011 B2
7993955 Wieting Aug 2011 B2
7998762 Lee et al. Aug 2011 B1
8003430 Lee Aug 2011 B1
8008110 Lee Aug 2011 B1
8008111 Lee Aug 2011 B1
8008112 Lee Aug 2011 B1
8017860 Lee Sep 2011 B2
8026122 Lee Sep 2011 B1
8142521 Wieting Mar 2012 B2
8168463 Wieting May 2012 B2
8178370 Lee et al. May 2012 B2
8183066 Lee et al. May 2012 B2
8217261 Wieting Jul 2012 B2
8263494 Patterson Sep 2012 B2
8287942 Huang et al. Oct 2012 B1
20020002992 Kariya et al. Jan 2002 A1
20020004302 Fukumoto et al. Jan 2002 A1
20020061361 Nakahara et al. May 2002 A1
20020063065 Sonoda et al. May 2002 A1
20030075717 Kondo et al. Apr 2003 A1
20030089899 Lieber et al. May 2003 A1
20030188777 Gaudiana et al. Oct 2003 A1
20030230338 Menezes Dec 2003 A1
20040063320 Hollars Apr 2004 A1
20040084080 Sager et al. May 2004 A1
20040095658 Buretea et al. May 2004 A1
20040110393 Munzer et al. Jun 2004 A1
20040161539 Miyakawa Aug 2004 A1
20040187917 Pichler Sep 2004 A1
20040245912 Thurk et al. Dec 2004 A1
20040252488 Thurk Dec 2004 A1
20040256001 Mitra et al. Dec 2004 A1
20050074915 Tuttle et al. Apr 2005 A1
20050098205 Roscheisen et al. May 2005 A1
20050109392 Hollars May 2005 A1
20050164432 Lieber et al. Jul 2005 A1
20050194036 Basol Sep 2005 A1
20050287717 Heald et al. Dec 2005 A1
20060034065 Thurk Feb 2006 A1
20060040103 Whiteford et al. Feb 2006 A1
20060051505 Kortshagen et al. Mar 2006 A1
20060096536 Tuttle May 2006 A1
20060096537 Tuttle May 2006 A1
20060096635 Tuttle May 2006 A1
20060102230 Tuttle May 2006 A1
20060112983 Parce et al. Jun 2006 A1
20060130890 Hantschel et al. Jun 2006 A1
20060160261 Sheats et al. Jul 2006 A1
20060173113 Yabuta et al. Aug 2006 A1
20060174932 Usui et al. Aug 2006 A1
20060219288 Tuttle Oct 2006 A1
20060219547 Tuttle Oct 2006 A1
20060220059 Satoh et al. Oct 2006 A1
20060249202 Yoo et al. Nov 2006 A1
20060267054 Martin et al. Nov 2006 A1
20070006914 Lee Jan 2007 A1
20070089782 Scheuten et al. Apr 2007 A1
20070116892 Zwaap May 2007 A1
20070116893 Zwaap May 2007 A1
20070151596 Nasuno et al. Jul 2007 A1
20070163643 Van Duren et al. Jul 2007 A1
20070169810 Van Duren et al. Jul 2007 A1
20070193623 Krasnov Aug 2007 A1
20070209700 Yonezawa et al. Sep 2007 A1
20070264488 Lee Nov 2007 A1
20070283998 Kuriyagawa et al. Dec 2007 A1
20070289624 Kuriyagawa et al. Dec 2007 A1
20080029154 Mishtein et al. Feb 2008 A1
20080032044 Kuriyagawa et al. Feb 2008 A1
20080041446 Wu et al. Feb 2008 A1
20080057616 Robinson et al. Mar 2008 A1
20080092945 Munteanu et al. Apr 2008 A1
20080092953 Lee Apr 2008 A1
20080092954 Choi Apr 2008 A1
20080105294 Kushiya et al. May 2008 A1
20080110491 Buller et al. May 2008 A1
20080110495 Onodera et al. May 2008 A1
20080121264 Chen et al. May 2008 A1
20080121277 Robinson et al. May 2008 A1
20080204696 Kamijima Aug 2008 A1
20080210303 Lu et al. Sep 2008 A1
20080280030 Van Duren et al. Nov 2008 A1
20080283389 Aoki Nov 2008 A1
20090021157 Kim et al. Jan 2009 A1
20090058295 Auday et al. Mar 2009 A1
20090087940 Kushiya Apr 2009 A1
20090087942 Meyers Apr 2009 A1
20090145746 Hollars Jun 2009 A1
20090217969 Matsushima et al. Sep 2009 A1
20090234987 Lee et al. Sep 2009 A1
20090235983 Girt et al. Sep 2009 A1
20090235987 Akhtar et al. Sep 2009 A1
20090293945 Peter Dec 2009 A1
20100081230 Lee Apr 2010 A1
20100087016 Britt et al. Apr 2010 A1
20100087026 Winkeler et al. Apr 2010 A1
20100096007 Mattmann et al. Apr 2010 A1
20100101648 Morooka et al. Apr 2010 A1
20100101649 Huignard et al. Apr 2010 A1
20100122726 Lee May 2010 A1
20100197051 Schlezinger et al. Aug 2010 A1
20100210064 Hakuma et al. Aug 2010 A1
20100233386 Krause et al. Sep 2010 A1
20100258179 Wieting Oct 2010 A1
20100267190 Hakuma et al. Oct 2010 A1
20110018103 Wieting Jan 2011 A1
20110020980 Wieting Jan 2011 A1
20110070682 Wieting Mar 2011 A1
20110070683 Wieting Mar 2011 A1
20110070684 Wieting Mar 2011 A1
20110070685 Wieting Mar 2011 A1
20110070686 Wieting Mar 2011 A1
20110070687 Wieting Mar 2011 A1
20110070688 Wieting Mar 2011 A1
20110070689 Wieting Mar 2011 A1
20110070690 Wieting Mar 2011 A1
20110071659 Farris, III et al. Mar 2011 A1
20110073181 Wieting Mar 2011 A1
20110203634 Wieting Aug 2011 A1
20110212565 Wieting Sep 2011 A1
20110259395 Wieting et al. Oct 2011 A1
20110259413 Wieting et al. Oct 2011 A1
20110269260 Buquing Nov 2011 A1
20110277836 Lee Nov 2011 A1
20120003789 Doering et al. Jan 2012 A1
20120018828 Shao Jan 2012 A1
20120021552 Alexander et al. Jan 2012 A1
20120094432 Wieting Apr 2012 A1
20120122304 Wieting May 2012 A1
20120186975 Lee et al. Jul 2012 A1
20120240989 Ramanathan et al. Sep 2012 A1
20120270341 Lee et al. Oct 2012 A1
Foreign Referenced Citations (20)
Number Date Country
199878651 Feb 1999 AU
200140599 Aug 2001 AU
3314197 Nov 1983 DE
10104726 Aug 2002 DE
102005062977 Sep 2007 DE
2646560 Nov 1990 FR
2124826 Feb 1984 GB
2000173969 Jun 2000 JP
2000219512 Aug 2000 JP
2002167695 Jun 2002 JP
2002270871 Sep 2002 JP
2002299670 Oct 2002 JP
2004332043 Nov 2004 JP
2005311292 Nov 2005 JP
0157932 Aug 2001 WO
2005011002 Feb 2005 WO
2006126598 Nov 2006 WO
2007022221 Feb 2007 WO
2007077171 Jul 2007 WO
2008025326 Mar 2008 WO
Non-Patent Literature Citations (20)
Entry
Baumann, A., et al., Photovoltaic Technology Review, presentation Dec. 6, 2004, 18 pages.
Chopra et al., “Thin-Film Solar Cells: An Overview”, 2004, Progress in Photovoltaics: Research and Applications, 2004, vol. 12, pp. 69-92.
Ellmer et al., Copper Indium Disulfide Solar Cell Absorbers Prepared in a One-Step Process by Reactive Magnetron Sputtering from Copper and Indium Targets; Elsevier Science B.V; Thin Solid Films 413 (2002) pp. 92-97.
Guillen C., “CuInS2 Thin Films Grown Sequentially from Binary Sulfides as Compared to Layers Evaporated Directly from the Elements”, Semiconductor Science and Technology, vol. 21, No. 5, May 2006, pp. 709-712.
Huang et al., Photoluminescence and Electroluminescence of ZnS:Cu Nanocrystals in Polymeric Networks, Applied Physics, Lett. 70 (18), May 5, 1997, pp. 2335-2337.
Huang et al., Preparation of ZnxCd1-xS Nanocomposites in Polymer Matrices and their Photophysical Properties, Langmuir 1998, 14, pp. 4342-4344.
International Solar Electric Technology, Inc. (ISET) “Thin Film CIGS”, Retrieved from http://www.isetinc.com/cigs.html on Oct. 1, 2008, 4 pages.
Kapur et al., “Fabrication of CIGS Solar Cells via Printing of Nanoparticle Precursor Inks”, DOE Solar Program Review Meeting 2004, DOE/GO-102005-2067, p. 135-136.
Kapur et al., “Non-Vacuum Printing Process for CIGS Solar Cells on Rigid and Flexible Substrates”, 29th IEEE Photovoltaic Specialists Conf., New Orleans, LA, IEEE, 2002, pp. 688-691.
Kapur et al., “Non-Vacuum Processing of CIGS Solar Cells on Flexible Polymer Substrates”, Proceedings of the Third World Conference on Photovoltaic Energy Conversion, Osaka, Japan, 2P-D3-43, 2003.
Kapur et al., “Non-Vacuum Processing of CuIn1-xGaxSe2 Solar Cells on Rigid and Flexible Substrates using Nanoparticle Precursor Inks”, Thin Solid Films, 2003, vol. 431-432, pp. 53-57.
Kapur et al., “Fabrication of Light Weight Flexible CIGS Solar Cells for Space Power Applications”, Materials Research Society, Proceedings vol. 668, (2001) pp. H3.5.1-H3.5.6.
Kapur et al., “Nanoparticle Oxides Precursor Inks for Thin Film Copper Indium Gallium Selenide (CIGS) Solar Cells”, Materials Research Society Proceedings, vol. 668, (2001) pp. H2.6.1-H2.6.7.
Mehta et al., “A graded diameter and oriented nanorod-thin film structure for solar cell application: a device proposal”, Solar Energy Materials & Solar Cells, 2005, vol. 85, pp. 107-113.
Onuma et al., Preparation and Characterization of CuInS2 Thin Films Solar Cells with Large Grain, Elsevier Science B.V; Solar Energy Materials & Solar Cells 69 (2001) pp. 261-269.
Salvador, “Hole diffusion length in n-TiO2 single crystals and sintered electrodes: photoelectrochemical determination and comparative analysis,” Journal of Applied Physics, vol. 55, No. 8, pp. 2977-2985, Apr. 15, 1984.
Srikant V., et al., “On the Optical Band Gap of Zinc Oxide”, Journal of Applied Physics, vol. 83, No. 10, May 15, 1998, pp. 5447-5451.
Yang et al., “Preparation, Characterization and Electroluminescence of ZnS Nanocrystals in a Polymer Matrix”, Journal Material Chem., 1997, vol. 7, No. 1, pp. 131-133.
Yang et al., “Electroluminescence from ZnS/CdS Nanocrystals/Polymer Composite”, Synthetic Metals 1997, vol. 91, pp. 347-349.
Yang et al., “Fabrication and Characteristics of ZnS Nanocrystals/Polymer Composite Doped with Tetraphenylbenzidine Single Layer Structure Light-emitting Diode”, Applied Physics Letters, vol. 69, No. 3, Jul. 15, 1996, pp. 377-379.
Provisional Applications (1)
Number Date Country
61254194 Oct 2009 US