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H01L2924/01006

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01006Carbon [C]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 12,140,560
- Issue date Nov 12, 2024
- Life Technologies Corporation
- Jonathan Rothberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
- Patent number 12,087,738
- Issue date Sep 10, 2024
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management device for high heat flux applications including...
- Patent number 12,080,627
- Issue date Sep 3, 2024
- University of Sharjah
- Essam Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 12,066,399
- Issue date Aug 20, 2024
- Life Technologies Corporation
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having electrode pads arranged between groups...
- Patent number 11,901,251
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kunihiro Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias and manufacturing...
- Patent number 11,817,427
- Issue date Nov 14, 2023
- LONGITUDE LICENSING LIMITED
- Ryohei Kitada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 11,817,442
- Issue date Nov 14, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid manufacturing of microeletronic assemblies with first and se...
- Patent number 11,756,886
- Issue date Sep 12, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for monitoring health of probing u-bump clu...
- Patent number 11,740,282
- Issue date Aug 29, 2023
- Intel Corporation
- Jagat Shakya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for production of semiconductor device
- Patent number 11,715,752
- Issue date Aug 1, 2023
- Sony Group Corporation
- Atsushi Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20240426775
- Publication date Dec 26, 2024
- Life Technologies Corporation
- James Bustillo
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20240421131
- Publication date Dec 19, 2024
- Lodestar Licensing Group LLC
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
- Publication number 20240404880
- Publication date Dec 5, 2024
- Lodestar Licensing Group LLC
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20240304593
- Publication date Sep 12, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT DEVICE FOR HIGH HEAT FLUX APPLICATIONS INCLUDING...
- Publication number 20240282669
- Publication date Aug 22, 2024
- University of Sharjah
- Essam MOHAMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240234228
- Publication date Jul 11, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240234235
- Publication date Jul 11, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20240222226
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING REPAIR DEVICES
- Publication number 20240222319
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE
- Publication number 20240203914
- Publication date Jun 20, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20240159702
- Publication date May 16, 2024
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...
- Publication number 20240136245
- Publication date Apr 25, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
- Publication number 20240136241
- Publication date Apr 25, 2024
- Rohm Co., Ltd.
- Kunihiro KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF
- Publication number 20240067855
- Publication date Feb 29, 2024
- COOLER MATERIALS TECHNOLOGY INC.
- Po-Wen CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
- Publication number 20240030213
- Publication date Jan 25, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
- Publication number 20230307407
- Publication date Sep 28, 2023
- Tohru YASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias to Have...
- Publication number 20230275013
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- SungSoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
- Publication number 20230197690
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20230187275
- Publication date Jun 15, 2023
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Contact Structure and Method
- Publication number 20230085696
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling assemblies for advanced device packaging and metho...

Semiconductor device and a method of manufacturing the same

Methods and apparatus for measuring analytes using large scale FET...

Multi-chip package and method of providing die-to-die interconnects...

Method for permanent connection of two metal surfaces

Packaged integrated circuit devices with through-body conductive vi...

Thermal management device for high heat flux applications including...

Semiconductor die contact structure and method

Methods and apparatus for measuring analytes using large scale FET...

Semiconductor device and method for manufacturing semiconductor device

Impedance controlled electrical interconnection employing meta-mate...

Flip chip package structure and manufacturing method thereof

Display device

Semiconductor device having electrode pads arranged between groups...

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor components having conductive vias with aligned back s...

Semiconductor device with sealed semiconductor chip

Semiconductor device with a semiconductor chip connected in a flip...

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor device having through silicon vias and manufacturing...

Hybrid manufacturing for integrated circuit devices and assemblies

Circuit board structure and method for manufacturing a circuit boar...

Method of room temperature covalent bonding

Hybrid manufacturing of microeletronic assemblies with first and se...

Semiconductor memory device structure

Apparatuses and methods for monitoring health of probing u-bump clu...

Semiconductor device and method for production of semiconductor device

Method for manufacturing an electronic module and electronic module

Methods for attachment and devices produced using the methods

Semiconductor device and method of forming interposer with opening...

Patents Applicationslast 30 patents

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

OPTOELECTRONIC SYSTEM

MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...

SEMICONDUCTOR PACKAGE

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

DIRECT BONDING METHODS AND STRUCTURES

THERMAL MANAGEMENT DEVICE FOR HIGH HEAT FLUX APPLICATIONS INCLUDING...

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

DEBONDING REPAIR DEVICES

MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE

Semiconductor Device and Method of Making a Semiconductor Package w...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

THERMALLY CONDUCTIVE SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD F...

SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...

LIQUID ALLOY THERMAL PASTE AND FABRICATION METHOD THEREOF

METHOD OF FABRICATING DISPLAY PANEL

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES

MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...

Semiconductor Device and Method of Forming Conductive Vias to Have...

PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Die Contact Structure and Method