1. Field of the Invention
The present invention relates to a burn-in socket, and more particularly to a burn-in socket mounted on a printed circuit board (PCB) for testing an IC package. The burn-in socket has socket body including a base and a sliding plate assembled to the base, and the sliding plate closely abuts against the base by a plurality of protruding portions disposed between the sliding plate and the base.
2. Description of Prior Art
Central Processing Unit (CPU) and other electrical package, generally referred to as IC package, are undergone a test simulating its real working environment so as to make sure its functions from all intended ranges.
A conventional burn-in socket typically comprises a base, a plurality of contacts disposed on the base, latches, a sliding plate for driving the contacts, and an actuator for actuating the latches and the sliding plate. The contact each has a pair of arms inserted into the sliding plate, and one is stationary, the other is moveable.
The sliding plate is assembled within the base and abuts against the base at a peripheral thereof, however, a gap is defined between the center part of the sliding plate and the base. When a plurality of contacts are assembled into the base and the sliding plate, may cause the sliding plate distorted and bowed, and make the center part of the sliding plate sink and the four sides rise up, that causes a head portion of the contacting arm of the contact assembled in the center part of the sliding plate excessively exposed from a top surface of the sliding plate, while other contacting arms assembled in the peripheral of the sliding plate are hidden in holes of the sliding plate. Thus, the contacts can not reliably contact with the IC package.
Thus, there is a need to provide an improved burn-in socket to overcome the above-mentioned problems.
An object of the present invention is to provide a burin-in socket, which can prevent a sliding plate thereof from distorting.
In order to achieve the object set forth, a burn-in socket made in accordance with the present invention comprises a base, a sliding plate mounted to the base, and a plurality of contacts retained in the base and the sliding plate. The base has a plurality of protruding portions on a top surface thereof, the sliding plate is formed with a plurality of projecting portions on a bottom surface thereof, the protruding portions of the base abut against the bottom surface of the sliding plate, and the projecting portions of the sliding plate abut against the top surface of the base.
Other objects, advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
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When the sliding plate 21 is assembled on the base 20, the protruding portions 2101 of the sliding plate 21 abut against the top surface of the base 20, and the projecting portions 2001 of the base 20 abut against the bottom surface of the sliding plate 21, the protruding portions 2101 and corresponding projecting portions 2001 are located in a beeline. By such arrangement, the projecting portions 2001 and the protruding portion 2101 are filled in a distance between the top surface of the base 20 and the sliding plate 21, the sliding plate 21 is reliably supported, and a configuration of the socket body 2 is reinforced, thus the sliding plate 21 will not easily bow when assembling the contacts 4.
The actuator 3 has four posts 30 extending downwardly engaging with the recesses 201 of the base 20, an actuating portion 31 extending downwardly for driving the bearing section 214 of the sliding plate 21 and two pair of latches 33 for positioning the actuator 3 on the base 20.
When using, the actuator 3 is forced to a lower position, where the moving and stationary arms 41, 42 are spaced from each other, in this situation, the IC package is easily placed into the socket body 2 or to be taken out of the socket body 2. When the actuator 3 returns to an original position, the moving and stationary arms 41, 42 move closer to each other and jointly hold the solder ball (not shown) of the IC package. Besides, a spring 202 is provided between the actuator 3 and the socket body 2 so as to reset the actuator 3 after its downward movement.
Although the present invention has been described with reference to particular embodiments, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
Number | Date | Country | Kind |
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200920303896.5 | Jun 2009 | CN | national |