Patent Application
20250062071
This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0108463 filed in the Korean Intellectual Property Office on Aug. 18, 2023, the entire contents of which is incorporated herein by reference.
The present disclosure relates to a capacitor and a method for manufacturing the same.
Electronic components used in electronic devices include capacitors, inductors, piezoelectric elements, varistors, or thermistors. A multilayer capacitor among such ceramic electronic devices may be used in various electronic devices due to the merit of small size, high capacity, and easy mounting. For example, a multilayer capacitor may be used in a condenser in the form of a chip that is mounted on a substrate of various electronic products such as an image device such as a liquid crystal display device (LCD), a plasma display device panel (PDP), an organic light emitting diode (OLED), or the like, a computer, a personal portable terminal, and a smart phone, and serves to charge or discharge electricity.
With the recent trend toward miniaturization and thinning of electronic products, demand for capacitors with higher capacity than existing multilayer capacitors is increasing.
The present disclosure attempts to provide a capacitor having a high capacity and a method for manufacturing the same.
However, the objective of the present disclosure is not limited to the aforementioned one, and may be extended in various ways within the spirit and scope of the present disclosure.
A capacitor may include a structure body including a first surface and a second surface positioned in opposite directions, where a plurality of openings are positioned on the first surface, a first internal electrode disposed on a region where the plurality of openings are positioned, a dielectric layer disposed on a partial region of the first internal electrode, a second internal electrode disposed on the dielectric layer, a first external electrode disposed on the first surface, and connected to the first internal electrode, and a second external electrode disposed on the first surface, and connected to the second internal electrode.
The structure body may include anodizing aluminum oxide.
The plurality of openings may include a first opening and a second opening, and the first external electrode may face a region where the first opening is positioned in a direction in which the first surface and the second surface are spaced apart.
The plurality of openings may include a first opening and a second opening, and the first external electrode may be connected to the first internal electrode of a region positioned adjacent to the first opening.
The first external electrode may be connected to the first internal electrode by directly contacting.
The first external electrode may include a first sub-electrode portion contacting the first internal electrode, and a first main electrode portion positioned on the first sub-electrode portion.
The plurality of openings may include a first opening and a second opening, and the second external electrode may face a region where the second opening is positioned, in a direction in which the first surface and the second surface are spaced apart.
The plurality of openings may include a first opening and a second opening, and the second external electrode may be connected to the second internal electrode of a region positioned adjacent to the second opening.
The second external electrode may be connected to the second internal electrode by directly contacting.
The second external electrode may include a second sub-electrode portion contacting the second internal electrode, and a second main electrode portion positioned on the second sub-electrode portion.
The first external electrode and the second external electrode may be provided in a plural quantity, respectively.
The dielectric layer may include one of Al2O3, ZrO2, and HfO2 or a combination thereof, or ZAZ which is a ZrO2—Al2O3—ZrO2 composite layer.
The first external electrode may cover one or more of the plurality of openings in which the second internal electrode is not disposed, and the second external electrode may cover one or more of the plurality of openings in which the second internal electrode is disposed.
A capacitor may include a structure body of anodizing aluminum oxide, including first surface and a second surface positioned in opposite directions, where a plurality of openings are positioned on the first surface, a first internal electrode disposed on the first surface in a region between the plurality of openings, and on the plurality of openings, a dielectric layer disposed on a partial region of the first internal electrode, a second internal electrode disposed on the dielectric layer, a first external electrode connected to the first internal electrode, and disposed in a direction to which the first surface of the structure body faces, and a second external electrode connected to the second internal electrode, and disposed in the direction to which the first surface of the structure body faces.
The opening may include first openings and a second opening, the dielectric layer and the second internal electrode may not exist in a region where the first openings are adjacent to each other, and the first external electrode may be connected to the first internal electrode of a region positioned adjacent to the first openings.
A filling portion may be disposed on the first internal electrode disposed in a first opening of the plurality of openings.
A method for manufacturing a capacitor may include forming a plurality of openings in a substrate, forming a first internal electrode on a region where the plurality of openings are positioned, forming a dielectric layer in a region where a second opening among the openings is positioned, excluding a region where a first opening among the openings is positioned, and forming a second internal electrode on the dielectric layer.
The method for manufacturing a capacitor may further include forming an insulation material layer on the first internal electrode of a region where the first opening is positioned, and the second internal electrode of a region where the second opening is positioned, and forming an open hole in at least a portion among the region where the first opening is positioned and the region where the second opening is positioned.
A seed layer may be formed on the open hole.
An external electrode layer may be formed on the seed layer.
According to at least one of embodiments, a capacitor having a high capacity and a method for manufacturing the same may be provided.
The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure are shown. In order to clearly describe the present disclosure, parts or portions that are irrelevant to the description are omitted, and identical or similar constituent elements throughout the specification are denoted by the same reference numerals. In addition, some constituent elements are exaggerated, omitted, or briefly illustrated in the added drawings, and sizes of the respective constituent elements do not reflect the actual sizes.
Further, the accompanying drawings are provided for helping to easily understand exemplary embodiments disclosed in the present specification, and the technical spirit disclosed in the present specification is not limited by the accompanying drawings, and it will be appreciated that the present disclosure includes all of the modifications, equivalent matters, and substitutes included in the spirit and the technical scope of the present disclosure.
Terms including ordinal numbers such as first, second, and the like will be used only to describe various components, and are not interpreted as limiting these components. The terms are only used to differentiate one component from others.
It will be understood that when an element such as a layer, film, region, area, or substrate is referred to as being “on” or “above” another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present. Further, in the specification, the word “on” or “above” means disposed on or below the object portion, and does not necessarily mean disposed on the upper side of the object portion based on a gravitational direction.
It will be further understood that terms “comprise” and “have” used in the present specification specify the presence of stated features, numerals, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, numerals, steps, operations, components, parts, or combinations thereof. In addition, unless explicitly described to the contrary, the word “comprise” and variations such as “comprises” or “comprising” will be understood to imply the inclusion of stated elements but not the exclusion of any other elements.
Further, throughout the specification, the phrase “in a plan view” or “on a plane” means viewing a target portion from the top, and the phrase “in a cross-sectional view” or “on a cross-section” means viewing a cross-section formed by vertically cutting a target portion from the side.
In addition, throughout the specification, “connected” means that two or more components are not only directly connected, but two or more components may be connected indirectly through other components, physically connected as well as being electrically connected, or it may be referred to by different names depending on the location or function, but may mean integral.
Throughout the specification, a substrate S may have a structure that is wide in a plan view and thin in a cross-sectional view, ‘the planar direction of the substrate S’ may indicate a direction parallel to the wide and flat surface of the substrate S, and the ‘thickness direction of the substrate S’ may indicate a direction that is perpendicular to a wide and flat surface of the substrate S.
Referring to
The structure body 100 includes a first surface 100a and a second surface 100b positioned in opposite directions.
The first internal electrode 210 is disposed on the opening 110. In addition, the first internal electrode 210 is disposed in a section between adjacent openings 110 on the first surface 100a of the structure body 100. Accordingly, in the first internal electrode 210, regions positioned on the openings 110 may be connected to each other by regions positioned on the first surface 100a of the structure body 100.
The opening 110 includes a first opening 110a and a second opening 110b. At least one of the plurality of openings 110 is provided as the first opening 110a, and remaining openings 110 are provided as the second opening 110b.
A filling portion 215 may be disposed on the first internal electrode 210 disposed in the first opening 110a. The filling portion 215 may be made of an insulation material. The filling portion 215 may be formed to fill the space remaining after the first internal electrode 210 is filled in the first opening 110a.
The dielectric layer 220 is disposed on a partial region of the first internal electrode 210. The dielectric layer 220 is disposed on the first internal electrode 210 of the second opening 110b. In addition, the dielectric layer 220 is disposed on the first internal electrode 210 between adjacent second openings 110b. The dielectric layer 220 is not formed on the first opening 110a, and is not formed on the first internal electrode 210 disposed in a region between adjacent first openings 110a on the first surface 100a.
The second internal electrode 230 is disposed on the dielectric layer 220. That is, the second internal electrode 230 is disposed on the dielectric layer 220 of the second opening 110b. In addition, the second internal electrode 230 is disposed on the dielectric layer 220 between the adjacent second openings 110b. Accordingly, the second internal electrode 230 faces the first internal electrode 210 interposing the dielectric layer 220, in the second openings 110b and regions between the adjacent second openings 110b. The second internal electrode 230 may be formed to fill an inner space of the second opening 110b. The second internal electrode 230 is not formed in the first opening 110a and a region between the adjacent first openings 110a in the first surface 100a.
The first external electrode 300 is connected to the first internal electrode 210. The first external electrode 300 is disposed on the first surface 100a direction of the structure body 100. The first external electrode 300 may face a region where the first opening 110a is positioned in the vertical direction.
The first external electrode 300 is connected to the first internal electrode 210 of a region positioned adjacent to the first opening 110a. Specifically, in the region positioned adjacent to the first opening 110a, the dielectric layer 220 does not exist on the first internal electrode 210. Accordingly, the first external electrode 300 is provided to directly contact the first internal electrode 210 of the region positioned adjacent to the first opening 110a, and may be connected to the first internal electrode 210.
The first external electrode 300 may include a first sub-electrode portion 301 and a first main electrode portion 302.
The first sub-electrode portion 301 is connected to the first internal electrode 210. At least a portion of the first sub-electrode portion 301 may be positioned on the first internal electrode 210 of the region positioned adjacent to the first opening 110a. At least a portion of the first sub-electrode portion 301 may directly contact the first internal electrode 210 of the region positioned adjacent to the first opening 110a.
The first main electrode portion 302 is connected to the first sub-electrode portion 301. At least a portion of the first main electrode portion 302 may be positioned on the first sub-electrode portion 301. At least a portion of the first main electrode portion 302 may directly contact the first sub-electrode portion 301. For example, the first main electrode portion 302 may directly contact the first sub-electrode portion 301, in a direction facing the structure body 100.
The second external electrode 310 is connected to the second internal electrode 230. The second external electrode 310 is disposed on the first surface 100a direction of the structure body 100. The second external electrode 310 may face at least a portion of a region where the second opening 110b is positioned in the vertical direction.
The second external electrode 310 may be provided to contact at least a portion of the second internal electrode 230 of a region positioned adjacent to the second opening 110b, and may be connected to the second internal electrode 230.
The second external electrode 310 may include a second sub-electrode portion 311 and a second main electrode portion 312.
The second sub-electrode portion 311 is connected to the second internal electrode 230. At least a portion of the second sub-electrode portion 311 may be positioned on at least a portion of the second internal electrode 230 of the region positioned adjacent to the second opening 110b. At least a portion of the second sub-electrode portion 311 may directly contact at least a portion of the second internal electrode 230 of the region positioned adjacent to the second opening 110b. The second sub-electrode portion 311 may be provided as the same material as the first sub-electrode portion 301.
The second main electrode portion 312 is connected to the second sub-electrode portion 311. At least a portion of the second main electrode portion 312 may be positioned on the second sub-electrode portion 311. At least a portion of the second main electrode portion 312 may directly contact the second sub-electrode portion 311. For example, the second main electrode portion 312 may directly contact the second sub-electrode portion 311, in a direction facing the structure body 100. The second main electrode portion 312 may be provided as the same material as the first main electrode portion 302.
In the first internal electrode 210 disposed adjacent to the first opening 110a, an insulating portion 250 may be positioned on a region other than a region contacting the first external electrode 300. The insulating portion 250 may be positioned to fill a region where a portion in the first external electrode 300 disposed apart from the first internal electrode 210 and the first internal electrode 210 face each other. In addition, the insulating portion 250 may be positioned to fill a region where a portion in the first external electrode 300 disposed apart from the first internal electrode 210 and the second external electrode 310 face each other.
In addition, in the second internal electrode 230 disposed adjacent to the second opening 110b, the insulating portion 250 may be positioned on a region other than a region contacting the second external electrode 310. The insulating portion 250 may be positioned to fill a region where a portion in the second external electrode 310 disposed apart from the second internal electrode 230 and the second internal electrode 230 face each other.
In addition, the insulating portion 250 may be positioned to fill a step positioned outside a region where the opening 110 is formed in the structure body 100. In the structure body 100, the insulating portion 250 may be positioned to surround at least a portion of outer periphery of the region where the opening 110 is formed.
The insulating portion 250 may be the same material as the filling portion 215.
Hereinafter, a manufacturing method of the capacitor 10 according to an embodiment will be described with reference to
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On the first internal electrode 210 of the region where the first opening 110a is positioned, formation of the dielectric layer 220 is prevented by the anti-deposition mask M1.
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On the first internal electrode 210 of the region where the first opening 110a is positioned, formation of the second internal electrode 230 is prevented by the anti-deposition mask M1.
Referring to
The insulation material layer IM is formed to cover the region where the opening 110 is positioned. That is, the insulation material layer IM is formed to cover the first internal electrode 210 on the region where the first opening 110a is positioned, such that the first internal electrode 210 is not externally exposed. In addition, the insulation material layer IM is formed to cover the second internal electrode 230 on the region where the second opening 110b is positioned, such that the second external electrode 310 is not externally exposed. In addition, an interior of the first opening 110a is filled with an insulation material, so as to remove a void in the interior of the first opening 110a. Accordingly, the insulation material filled in the interior of the first opening 110a may form the filling portion 215. In addition, the insulation material layer IM may be formed to fill a step formed outside the region where the opening 110 is positioned. The insulating material may be polyimide (PI) or the like.
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An etching process or the like may be used for removal of the externally exposed seed layer SL.
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Most of the first internal electrode 210 and the second internal electrode 230 are disposed on the opening 110. Although only a portion of the openings 110 are shown in
Referring to
Based on a plane crossing a direction in which the first surface 100a and the second surface 100b of the structure body 100 face each other, when the opening 110 is positioned, an area occupied by the first external electrode 300 and the second external electrode 310 may be small in comparison to an area. Accordingly, the capacitor 10a may include a plurality of first external electrodes 300. In addition, the capacitor 10a may include a plurality of second external electrodes 310.
The structure body 100 may include a plurality of regions where the first opening 110a is positioned. In the structure body 100, each of the first external electrodes 300 is disposed to face the region where the first opening 110a is positioned, and connected to the first internal electrode 210. In addition, in the structure body 100, each of the second external electrodes 310 is disposed to face a portion of the region where the second opening 110b is positioned, and connected to the second internal electrode 230. The first internal electrodes 210 disposed across the plurality of openings 110 are connected to each other. Accordingly, in the structure body 100, a position of the first opening 110a where the dielectric layer 220 and the second internal electrode 230 are not formed, and a position and quantity of the first external electrodes 300 may be adjusted. In addition, the second opening 110b is positioned except for the region where the first opening 110a is positioned. Accordingly, the second internal electrodes 230 disposed across a plurality of second openings 110b are connected to each other. Accordingly, by selecting the region where the second external electrode 310 is disposed from the region where the second opening 110b is positioned, the position and quantity of the second external electrode 310 included in the capacitor 10a may be adjusted.
While the present disclosure has been described in connection with what is presently considered to be practical embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2023-0108463 | Aug 2023 | KR | national |
