Processing two or more printed circuits simultaneously

Industry

CPC
H05K3/0097

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0097Processing two or more printed circuits simultaneously

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fold flex circuit for LNOP
- Patent number 12,207,419
- Issue date Jan 21, 2025
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board assembly sheet
- Patent number 12,120,829
- Issue date Oct 15, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking arrays and separator bodies during processing of component...
- Patent number 11,943,874
- Issue date Mar 26, 2024
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing system for printing substrates, method for operating the p...
- Patent number 11,924,978
- Issue date Mar 5, 2024
- EKRA AUTOMATISIERUNGSSYSTEME GMBH
- Torsten Vegelahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fold flex circuit for LNOP
- Patent number 11,903,140
- Issue date Feb 13, 2024
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device, interlayer ply including an electrical device an...
- Patent number 11,812,557
- Issue date Nov 7, 2023
- Pilkington Group Limited
- Stephen Roland Day
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RFID device
- Patent number 11,769,031
- Issue date Sep 26, 2023
- ASIA SMART TAG CO., LTD.
- Lien-Feng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 11,602,055
- Issue date Mar 7, 2023
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recurring process for laser induced forward transfer and high throu...
- Patent number 11,554,549
- Issue date Jan 17, 2023
- Mycronic AB
- Torbjorn Sandstrom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,540,396
- Issue date Dec 27, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with electronic component embedded therein
- Patent number 11,490,503
- Issue date Nov 1, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal substrate and method of manufacturing the same
- Patent number 11,483,934
- Issue date Oct 25, 2022
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive coating material and production method for shielded pack...
- Patent number 11,370,926
- Issue date Jun 28, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Hiroaki Umeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring board manufacturing method
- Patent number 11,317,522
- Issue date Apr 26, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,289,400
- Issue date Mar 29, 2022
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising a via and methods of forming such ele...
- Patent number 11,284,521
- Issue date Mar 22, 2022
- 3M Innovative Properties, Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Supporting substrate, supporting substrate-attached laminate and me...
- Patent number 11,217,445
- Issue date Jan 4, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of flexible electronic device
- Patent number 11,191,166
- Issue date Nov 30, 2021
- E Ink Holdings Inc.
- Kuo-Feng Chen
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240284605
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- SANGHO JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240244756
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Chihiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240040705
- Publication date Feb 1, 2024
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLD FLEX CIRCUIT FOR LNOP
- Publication number 20230403798
- Publication date Dec 14, 2023
- MASIMO CORPORATION
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20230345640
- Publication date Oct 26, 2023
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS
- Publication number 20230209723
- Publication date Jun 29, 2023
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ASYMMETRIC BOARD
- Publication number 20230164927
- Publication date May 25, 2023
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE
- Publication number 20220399192
- Publication date Dec 15, 2022
- Hanwha Corporation
- Su Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...
- Publication number 20220223506
- Publication date Jul 14, 2022
- Huawei Technologies Co., Ltd
- Xuanwei FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLD FLEX CIRCUIT FOR LNOP
- Publication number 20220201867
- Publication date Jun 23, 2022
- MASIMO CORPORATION
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20220173010
- Publication date Jun 2, 2022
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
- Publication number 20220132715
- Publication date Apr 28, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- HIDEKI SUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071015
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN
- Publication number 20220022310
- Publication date Jan 20, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chang Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RFID DEVICE
- Publication number 20210397919
- Publication date Dec 23, 2021
- ASIA SMART TAG CO., LTD.
- LIEN-FENG LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL DEVICE, INTERLAYER PLY INCLUDING AN ELECTRICAL DEVICE AN...
- Publication number 20210329787
- Publication date Oct 21, 2021
- PILKINGTON GROUP LIMITED
- Stephen Roland DAY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD
- Publication number 20210282277
- Publication date Sep 9, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...
- Publication number 20210257207
- Publication date Aug 19, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...
- Publication number 20210243903
- Publication date Aug 5, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacking Arrays and Separator Bodies During Processing of Component...
- Publication number 20210195753
- Publication date Jun 24, 2021
- AT&S (Chongqing) Company Limited
- Amin Nickkolgh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit substrate having a recess for receiving a solder...
- Publication number 20210195734
- Publication date Jun 24, 2021
- QDOS Flexcircuits Sdn Bhd
- Poh Cheng Ang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING SYSTEM FOR PRINTING SUBSTRATES, METHOD FOR OPERATING THE P...
- Publication number 20210168941
- Publication date Jun 3, 2021
- EKRA AUTOMATISIERUNGSSYSTEME GMBH
- Torsten VEGELAHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reel-to-Reel Lamination Methods and Devices in FPC Fabrication
- Publication number 20210092853
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE
- Publication number 20210076508
- Publication date Mar 11, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...
- Publication number 20210028086
- Publication date Jan 28, 2021
- MITSUBISHI MATERIALS CORPORATION
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS
- Publication number 20200375033
- Publication date Nov 26, 2020
- Apple Inc.
- Yanfeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...
- Publication number 20200299523
- Publication date Sep 24, 2020
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Hiroaki UMEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20200221577
- Publication date Jul 9, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Processing two or more printed circuits simultaneously

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fold flex circuit for LNOP

Droplet actuator fabrication apparatus, systems, and related methods

Overmolded components having sub-flush residuals

Wiring circuit board assembly sheet

Reciprocal PCB manufacturing process

Method for manufacturing transparent circuit board

Stacking arrays and separator bodies during processing of component...

Printing system for printing substrates, method for operating the p...

Method for fabricating asymmetric board

Method of manufacturing bonded body for insulation circuit substrat...

Fold flex circuit for LNOP

Lead frame, packaged integrated circuit board, power chip, and circ...

Flexible circuit mother board and detection method thereof

Electrical device, interlayer ply including an electrical device an...

RFID device

Manufacturing method of circuit carrier board structure

Overmolded components having sub-flush residuals

Recurring process for laser induced forward transfer and high throu...

Circuit board structure and manufacturing method thereof

Reel-to-reel lamination methods and devices in FPC fabrication

Module installation on printed circuit boards with embedded trace t...

Reel-to-reel laser ablation methods and devices in FPC fabrication

Substrate with electronic component embedded therein

Metal substrate and method of manufacturing the same

Conductive coating material and production method for shielded pack...

Wiring board manufacturing method

Method of manufacturing bonded body for insulation circuit substrat...

Electronic devices comprising a via and methods of forming such ele...

Supporting substrate, supporting substrate-attached laminate and me...

Fabrication method of flexible electronic device

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ASSEMBLY SHEET

TRANSPARENT CIRCUIT BOARD

WIRING CIRCUIT BOARD ASSEMBLY SHEET

FOLD FLEX CIRCUIT FOR LNOP

WIRING CIRCUIT BOARD ASSEMBLY SHEET

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

OVERMOLDED COMPONENTS HAVING SUB-FLUSH RESIDUALS

METHOD FOR FABRICATING ASYMMETRIC BOARD

SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE

LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRC...

FOLD FLEX CIRCUIT FOR LNOP

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE WITH ELECTRONIC COMPONENT EMBEDDED THEREIN

RFID DEVICE

ELECTRICAL DEVICE, INTERLAYER PLY INCLUDING AN ELECTRICAL DEVICE AN...

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

SUPPORTING SUBSTRATE, SUPPORTING SUBSTRATE-ATTACHED LAMINATE AND ME...

ULTRA THIN DIELECTRIC PRINTED CIRCUIT BOARDS WITH THIN LAMINATES AN...

Stacking Arrays and Separator Bodies During Processing of Component...

Integrated circuit substrate having a recess for receiving a solder...

PRINTING SYSTEM FOR PRINTING SUBSTRATES, METHOD FOR OPERATING THE P...

Reel-to-Reel Lamination Methods and Devices in FPC Fabrication

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE

METHOD OF MANUFACTURING BONDED BODY FOR INSULATION CIRCUIT SUBSTRAT...

SYSTEM-IN-PACKAGE INCLUDING OPPOSING CIRCUIT BOARDS

CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACK...

ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE