Claims
- 1. A carrier for a polishing apparatus, comprising:a housing; a biasing member coupled to and vertically movable relative to the housing, the biasing member including a substrate receiving surface and a first chamber to control a pressure applied by the substrate receiving surface; and a second chamber between the housing and the biasing member to control a pressure on the biasing member.
- 2. The carrier head of claim 1, wherein the biasing member is configured to apply different pressures to different regions of a substrate on the substrate receiving surface.
- 3. The carrier head of claim 2, wherein the biasing member includes a lower wall that forms a boundary of the first chamber, and the lower wall is configured to apply different pressures to different regions of a substrate positioned on the substrate surface.
- 4. The carrier head of claim 3, wherein the lower wall includes regions of different thickness.
- 5. The carrier head of claim 4, wherein the lower wall includes an inner region and an outer circumferential region, and the inner region is thinner than the outer circumferential region.
- 6. The carrier head of claim 1, wherein the biasing member includes a lower wall that forms a boundary of the first chamber.
- 7. The carrier head of claim 6, wherein the biasing member includes a film on a bottom surface of the lower wall, the film providing the substrate receiving surface.
- 8. The carrier head of claim 1, further comprising a retaining ring to maintain a substrate below the substrate receiving surface.
- 9. A carrier head for a polisher, comprising:a housing; a biasing member including a substrate receiving surface and a first chamber to control a pressure applied by the substrate receiving surface, the biasing member movable coupled to and movable relative to the housing, the biasing member configured to apply different pressures to different regions of a substrate positioned on the substrate receiving surface; and a second chamber between the housing and the biasing member to control a pressure on the biasing member.
- 10. The carrier head of claim 9, wherein the biasing member includes a lower wall that forms a boundary of the first chamber, and the lower wall is configured to apply different pressures to different regions of the substrate.
- 11. The carrier head of claim 10, wherein the lower wall includes regions of different thickness.
- 12. The carrier head of claim 11, wherein the lower wall includes an inner region that is thinner than an outer circumferential region.
- 13. The carrier head of claim 10, wherein the biasing member includes a film on a bottom surface of the lower wall, the film providing the substrate receiving surface.
- 14. The carrier head of claim 9, further comprising a retaining ring to maintain a substrate below the substrate receiving surface.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation of U.S. application Ser. No. 09/456,889; filed Dec. 7, 1999 and issued to U.S. Pat. No. 6,267,656, which is a continuation of U.S. application Ser. No. 09/090,647, filed Jun. 4, 1998 and issued as U.S. Pat. No. 6,019,671, which is a division of U.S. application Ser. No. 08/835,070, filed Apr. 4, 1997 and issued as U.S. Pat. No. 5,913,718, which is a continuation of U.S. application Ser. No. 08/205,276, filed Mar. 2, 1994 and issued as U.S. Pat. No. 5,643,053, which is a continuation-in-part of U.S. application Ser. No. 08/173,846, filed Dec. 27, 1993 and issued as U.S. Pat. No. 5,582,534.
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Continuations (3)
|
Number |
Date |
Country |
Parent |
09/456889 |
Dec 1999 |
US |
Child |
09/878004 |
|
US |
Parent |
09/090647 |
Jun 1998 |
US |
Child |
09/456889 |
|
US |
Parent |
08/205276 |
Mar 1994 |
US |
Child |
08/835070 |
|
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08/173846 |
Dec 1993 |
US |
Child |
08/205276 |
|
US |