Claims
- 1. A method of inverting a plurality of plate-like materials, said method comprising:supporting the plurality of plate-like materials in an orientation such that the plate-like materials are substantially parallel to each other in a first orientation; engaging portions of each plate-like material to retain the plate-like materials in the substantially parallel orientation to each other; and simultaneously inverting the plate-like materials to a second orientation.
- 2. The method of claim 1 wherein said engaging portions comprises engaging opposing edges of each plate-like material.
- 3. The method of claim 1 wherein said simultaneously inverting comprises simultaneously rotating all of the plate-like materials about a pivot axis.
- 4. A method of inverting a plurality of plate-like materials supported within a cassette, said method comprising:restraining each plate-like material within the cassette; and rotating the cassette about a pivot axis.
- 5. The method of claim 4 wherein said restraining comprises engaging portions of each plate-like material.
- 6. The method of claim 5 wherein said engaging portions comprises simultaneously engaging opposing edges of each plate-like material.
- 7. A method of simultaneously inverting plate-like materials, said method comprising:forming a stack of plate-like materials; engaging portions of each plate-like material within the stack; and rotating the stack about a pivot axis.
- 8. The method of claim 7 wherein said forming a stack comprises supporting each plate-like material in parallel relationship to each other.
- 9. The method of claim 8 further comprising clamping the stack between two surfaces prior to said engaging.
- 10. A method for applying a surface treatment to semiconductor wafers comprising:forming a stack of semiconductor wafers separately supported at their respective edges; retaining the semiconductor wafers within the stack; inverting the stack of semiconductor wafers; removing a semiconductor wafer from the stack; and applying a surface treatment to the semiconductor wafer.
Parent Case Info
This is a divisional application of U.S. patent application Ser. No. 09/130,262, filed Aug. 6, 1998, and issued as U.S. Pat. No. 6,254,682 on Jul. 3, 2001 and which is a continuation of U.S. patent application Ser. No. 08/603,879, filed on Feb. 22, 1996, and issued as U.S. Pat. No. 5,858,459 on Jan. 12, 1999.
US Referenced Citations (12)
Continuations (1)
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Number |
Date |
Country |
Parent |
08/603879 |
Feb 1996 |
US |
Child |
09/130262 |
|
US |