Patent Application
20210204437
The technical field relates to a server system, in particular, to a chassis internal connection structure for a server.
Presently, a server system includes a plurality of chassis installed inside the cabinet, and each chassis is installed with electronic devices of an independent motherboard, a backboard, a plurality of data processing units and power supply etc. in order to facilitate the maintenance and expansion of each chassis.
Furthermore, the internal of chassis of conventional server systems are mostly installed with a computation zone and a data link zone. The computation zone is installed with a motherboard, and the data link zone is installed with a backboard and a plurality of data processing units. In addition, the backboard is connected to the motherboard via an adapter card, and the data processing units are connected to the backboard via a plurality of wires such that these data processing units are able to form electrical connection with the motherboard, thereby achieving signal or power transmission. Nevertheless, since the size of the aforementioned backboard is large and occupies the internal space of the chassis, it hinders the installation of other mechanical parts and electronic elements, and it also causes the increase of the overall cost. Consequently, there is a need for improvement of such drawback.
In view of above, the inventor seeks to overcome the aforementioned drawback associated with the currently existing technology after years of research and development along with the utilization of academic theories, which is also the objective of the development of the present invention.
An objective of the present invention is to provide a chassis internal connection structure for a server capable of simplifying the chassis internal connection structure and reducing the overall cost.
To achieve the aforementioned objective, the present invention provides a chassis internal connection structure for a server, comprising a casing, a motherboard, a plurality of data processing units and a bus assembly. The casing includes an accommodating space comprising a computation zone and a data link zone. The motherboard is installed in the computation zone and having a first central processor arranged thereon and a first connection port electrically connected to the first central processor. The plurality of data processing units is arranged in the data link zone. The bus assembly comprises a flexible bus cable and a plurality of connector connected to the flexible bus cable. The connectors comprise a motherboard connector singularly arranged on one end of the flexible bus cable and a plurality of data processing unit connectors arranged on another end of the flexible bus cable. The motherboard connector is electrically connected to the first connection port. The data processing unit connectors are correspondingly connected to the data processing units respectively. Each one of the data processing units is connected to the first central processor via the bus assembly.
Another objective of the present invention is to provide a chassis internal connection structure for a server, wherein the chassis internal connection structure further comprises a PCI-e interface card, a PCI-e bus assembly and a function expansion slot. One end of the PCI-e bus assembly is inserted into the function expansion slot and another end thereof is connected to the busy assembly connection portion, thereby achieving the objective of function expansion.
Still another objective of the present invention is to provide a chassis internal connection structure for a server, further comprising a circuit bus assembly. The circuit bus assembly comprises a plurality of PCI-e circuits arranged thereon and a plurality of circuit connectors, and it is directly installed on the PCI-e interface card, thereby achieving the objective of fast, large volume or instant transmission.
Still another objective of the present invention is to provide a chassis internal connection structure for a server, further comprising a PCI-e adapter card and an adaptor bus assembly. One end of the adapter bus assembly is inserted into the PCI-e adapter card and another end thereof is connected to the motherboard, thereby achieving the objective of function expansion.
In comparison to the prior art, in the chassis internal connection structure of the present invention, the data processing units and the motherboard are not using the traditional backboard element for electrical connection. On the contrary, the electrical connection between the data processing units of the present invention and the motherboard is achieved directly via the bus assembly. In addition, the bus assembly comprises a flexible bus cable and connectors, wherein the connectors comprise a motherboard connector singularly arranged on one end of the flexible bus cable and a plurality of data processing unit connectors arranged on another end of the flexible bus cable. Furthermore, the motherboard connector is electrically connected to the first connection port, and the data processing unit connectors are correspondingly connected to the data processing units respectively. Each one of the data processing units is connected to the first central processor via the bus assembly. Accordingly, the chassis internal connection structure is simplified and the overall cost is reduced, such that the practicability of the present invention is enhanced.
The following provides a detailed technical content of the present invention along with the accompanied drawings. However, the accompanied drawings are provided for reference and illustrative purpose only such that they shall not be used to limit the scope of the present invention.
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The casing 10 includes an accommodating space 11, and the accommodating space 11 comprises a computation zone 12 and a data link zone 13. In addition, the motherboard 20 is installed in the computation zone 12, and the plurality of data processing units 30 is arranged in the data link zone 13. In addition, the motherboard 20 includes a first central processor 21 arranged thereon and a first connection port 22 electrically connected to the first central processor 21.
Furthermore, the bus assembly 40 comprises a flexible bus cable 41 and a plurality of connectors 42 connected to the flexible bus cable 41. The plurality of connectors 42 comprises a motherboard connector 421 singularly arranged on one end of the flexible bus cable 41 and a plurality of data processing unit connectors 422 arranged on another end of the flexible bus cable 41. Moreover, the motherboard connector 421 is electrically connected to the first connection port 22. The plurality of data processing unit connectors 422 is correspondingly connected to the data processing units 30 respectively. Each one of the data processing units 30 is connected to the first central processor 21 via the bus assembly 40.
It shall be noted that in an exemplary embodiment, the data processing unit 30 can configured to be an Enterprise Datacenter Small Form Factor (EDSFF) or an Advance Input Output Module (AIOM). In addition, the Enterprise Datacenter Small Form Factor can be a data storage element, such as a Solid-State Drive (SSD) etc.
In addition, it shall also be noted that the flexible bus cable 41 includes a plurality of metal wires, signal wires and power wires (not shown in the drawings) embedded therein; however, the present invention is not limited to such configuration only in real practice.
In an exemplary embodiment of the present invention, the motherboard 20 includes a second central processor 23 and a second connection port 24 electrically connected to the second central processor 23. Preferably, the second central processor 23 is aligned linearly with the first central processor 21, and the second connection port 24 is arranged in parallel with the first connection port 22.
Accordingly, the chassis internal connection structure 1 further comprises a second bus assembly 50 and a plurality of second data processing units 60 arranged in the data link zone 13. One end of the second bus assembly 50 is electrically connected to the second connection port 24 and another end thereof is correspondingly connected to each one of the second data processing units 60 respectively. Each one of the second data processing units 60 is connected to the second central processor 23 via the second bus assembly 50.
To more specific, the second bus assembly 50 comprises a second flexible bus cable 51 and a plurality of second connectors 52 connected to the second flexible bus cable 51. The plurality of second connectors 52 comprises a second motherboard connector 521 singularly arranged on one end of the second flexible bus cable 51 and a plurality of data processing unit connectors 522 arranged on another end of the second flexible bus cable 51. The second motherboard connector 521 is electrically connected to the second connection port 24. The plurality of second data processing unit connectors 522 is correspondingly connected to the second data processing units 60 respectively.
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It shall be noted that the connection method between the PCI-e interface card 70 and the gold finger connection portion 72 and the motherboard 20 is known, such that details thereof is omitted hereafter.
Furthermore, it shall be noted that in an exemplary embodiment of the present invention, the chassis internal connection structure 1 further comprises a circuit bus assembly 90. The circuit bus assembly 90 comprises a circuit flexible bus cable 91 having a plurality of PCI-e circuits (not shown in the drawings) arranged thereon and a plurality of circuit connectors 92 connected to the circuit flexible bus cable 91. Moreover, two ends of the plurality of circuit connectors 92 are electrically connected to the PCI-e interface card 70 respectively. Accordingly, when the user requires larger transmission volume or faster transmission speed, the wire layout originally arranged on the PCI-e interface card 70 can be changed to be directly arranged on the circuit bus assembly 90 in order to achieve the demand for fast and instant transmission.
In addition, when the motherboard 20 has sufficient space, the chassis internal connection structure 1 can further comprise a PCI-e adapter card 100 and an adaptor bus assembly 110. Preferably, the PCI-e adapter card 100 and the PCI-e interface card 70 are spaced apart from each other and are arranged on one side edge of the motherboard 20.
In an exemplary embodiment of the present invention, the PCI-e adapter card 100 includes an adapter card main body 101 and an adapter slot 102 arranged on the adapter main body 101. Furthermore, one end of the adapter bus assembly 110 is inserted into the adapter slot 102 and another end thereof is connected to the motherboard 20. Accordingly, the present invention is able to achieve the objective of function expansion through the configuration of the PCI-e adapter card 100 and the adapter bus assembly 110.
The above describes the preferable and feasible exemplary embodiments of the present invention for illustrative purposes only, which shall not be treated as limitations of the scope of the present invention. Any equivalent changes and modifications made in accordance with the scope of the claims of the present invention shall be considered to be within the scope of the claim of the present invention.
