One or more single auxiliary printed circuits mounted on a main printed circuit

Industry

CPC
H05K1/141

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer resin substrate and electronic component
- Patent number 12,289,826
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Motherboard comprising a planar transformer equipped with component...
- Patent number 12,243,674
- Issue date Mar 4, 2025
- MBDA FRANCE
- Charlotte Gazzano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure
- Patent number 12,232,288
- Issue date Feb 18, 2025
- Delta Electronics, Inc.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light module aperture for printed circuit board integration
- Patent number 12,207,406
- Issue date Jan 21, 2025
- Electronic Theatre Controls, Inc.
- Sunya Nimityongskul
- F21 - LIGHTING
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cell balancing module
- Patent number 12,156,332
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Joo Young Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voice-controlled electronic device
- Patent number 12,147,610
- Issue date Nov 19, 2024
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device including thermosetting bonding sheet
- Patent number 12,144,115
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic control of a compressor, compressor and cooling equipment
- Patent number 12,144,153
- Issue date Nov 12, 2024
- NIDEC GLOBAL APPLIANCE BRASIL LTDA.
- Felipe Guilherme Stein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory system
- Patent number 12,131,062
- Issue date Oct 29, 2024
- Kioxia Corporation
- Fuminori Kimura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic shelf label and method for assembling the same
- Patent number 12,131,670
- Issue date Oct 29, 2024
- BOE Technology Group Co., Ltd.
- Xinxin Yang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Circuit board interconnection device and circuit board assembly
- Patent number 12,127,344
- Issue date Oct 22, 2024
- BorgWarner Inc.
- Sisay Tadele
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion device
- Patent number 12,119,756
- Issue date Oct 15, 2024
- Hitachi Industrial Equipment Systems Co., Ltd.
- Fumihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Modular card cage accessories
- Patent number 12,114,462
- Issue date Oct 8, 2024
- National Instruments Corporation
- Richard G. Baldwin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backlight driving board, backlight module, display apparatus and me...
- Patent number 12,112,712
- Issue date Oct 8, 2024
- Beijing Boe Display Technology Co., Ltd.
- Lijin Zhao
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board mounted active component assembly
- Patent number 12,078,847
- Issue date Sep 3, 2024
- CommScope Technologies LLC
- Joseph Christopher Coffey
- G02 - OPTICS
Information Patent Grant
Optical sensor and optical sensor module
- Patent number 12,078,561
- Issue date Sep 3, 2024
- Sony Group Corporation
- Tomoko Katsuhara
- G01 - MEASURING TESTING
Information Patent Grant
Circuit assemblies and components thereof for packaging
- Patent number 12,035,473
- Issue date Jul 9, 2024
- WestRock MWV, LLC
- Ronald Binshtok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and printed circuit board including structure for...
- Patent number 12,035,462
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Hongkyu Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device
- Patent number 12,028,977
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masato Tobinaga
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Data processing systems including optical communication modules
- Patent number 12,029,004
- Issue date Jul 2, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interposer and electronic device including the same
- Patent number 12,022,614
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu Min
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible tube-based detection and packaging structure and in-vivo d...
- Patent number 12,016,535
- Issue date Jun 25, 2024
- Innovex Medical Co., Ltd.
- Hang Yan
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor module
- Patent number 12,021,323
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Mayumi Shiohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server
- Patent number 12,016,149
- Issue date Jun 18, 2024
- CMOTION TECHNOLOGIES LIMITED
- Hao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-capacity computer modules
- Patent number 12,016,123
- Issue date Jun 18, 2024
- Apple Inc.
- Brett W. Degner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD SYSTEM
- Publication number 20250133658
- Publication date Apr 24, 2025
- Harman Becker Automotive Systems GmbH
- Andreas KUSKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DENSELY PACKED ELECTRONIC SYSTEMS
- Publication number 20250120018
- Publication date Apr 10, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ASSEMBLY STRUCTURE
- Publication number 20250113454
- Publication date Apr 3, 2025
- DELTA ELECTRONICS,INC.
- Haoyi YE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDERING BOARD ARRANGEMENT
- Publication number 20250113436
- Publication date Apr 3, 2025
- PHYTEC Messtechnik GmbH
- Bodo HUBER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFORMATION PROCESSING APPARATUS
- Publication number 20250098069
- Publication date Mar 20, 2025
- Toshiba Tec Kabushiki Kaisha
- Takahiro OGISU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS WITH A TWO-WAY CABLE CONNECTION CONSTRUCTION,...
- Publication number 20250089195
- Publication date Mar 13, 2025
- MOXA INC.
- Chen-Kai Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING NODE AND COMPUTING DEVICE
- Publication number 20250089169
- Publication date Mar 13, 2025
- xFusion Digital Technologies Co., Ltd
- Guoqiang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20250081346
- Publication date Mar 6, 2025
- Hyundai Motor Company
- Se Yoon JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION DEVICE
- Publication number 20250081347
- Publication date Mar 6, 2025
- Industrial Technology Research Institute
- Chung-Wei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER WITH INTEGRATED CONNECTORS
- Publication number 20250079276
- Publication date Mar 6, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SYSTEM AND METHOD FOR RADAR, LIDAR, OR CAMERA SYSTEMS
- Publication number 20250056724
- Publication date Feb 13, 2025
- HELLA GmbH & Co. KGaA
- Andreas VON RHEIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOICE-CONTROLLED ELECTRONIC DEVICE
- Publication number 20250044879
- Publication date Feb 6, 2025
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20250031336
- Publication date Jan 23, 2025
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE AUTOMOTIVE GRADE LIGHT SOURCE
- Publication number 20250024597
- Publication date Jan 16, 2025
- Lumileds LLC
- Christian KLEIJNEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOURCE AND LASER PROJECTION APPARATUS
- Publication number 20250023322
- Publication date Jan 16, 2025
- HISENSE LASER DISPLAY CO., LTD.
- Xianglai PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20250024606
- Publication date Jan 16, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES
- Publication number 20240418943
- Publication date Dec 19, 2024
- Nubis Communications, Inc.
- Peter Johannes Winzer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXING ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20240402770
- Publication date Dec 5, 2024
- ASUSTek COMPUTER INC.
- Kunsu Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240397623
- Publication date Nov 28, 2024
- KYOCERA CORPORATION
- Keizou SAKURAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND EXPANSION CARD MODULE
- Publication number 20240381532
- Publication date Nov 14, 2024
- PEGATRON CORPORATION
- PING-MU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLIES AND COMPONENTS THEREOF FOR PACKAGING
- Publication number 20240365471
- Publication date Oct 31, 2024
- WestRock MWV, LLC
- Ronald J. BINSHTOK
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE
- Publication number 20240365470
- Publication date Oct 31, 2024
- CTCELLS, INC.
- Seung Hoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240314960
- Publication date Sep 19, 2024
- ASUSTek COMPUTER INC.
- Wei-Chia Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD
- Publication number 20240292539
- Publication date Aug 29, 2024
- Intel Corporation
- Juha Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REUSABLE MEMBER FOR RETAINING ELECTRONIC CARD
- Publication number 20240268050
- Publication date Aug 8, 2024
- Amphenol Commercial Products (ChengDu) Co., LTD.
- Peng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLLESS COMPRESSION ATTACHED MEMORY MODULE INSTALLATION IN INFORMA...
- Publication number 20240258725
- Publication date Aug 1, 2024
- Dell Products L.P.
- Glenn Chiappe
- H01 - BASIC ELECTRIC ELEMENTS

One or more single auxiliary printed circuits mounted on a main printed circuit

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer resin substrate and electronic component

Sensor interposer employing castellated through-vias

Motherboard comprising a planar transformer equipped with component...

Assembly structure

Conductive ink interconnected devices

Light module aperture for printed circuit board integration

Substrate for mounting electronic element, electronic device, and e...

Cell balancing module

Method and configuration for stacking multiple printed circuit boards

Voice-controlled electronic device

Electronic device including thermosetting bonding sheet

Electronic control of a compressor, compressor and cooling equipment

Memory system

Electronic shelf label and method for assembling the same

Circuit board interconnection device and circuit board assembly

Power conversion device

Modular card cage accessories

Backlight driving board, backlight module, display apparatus and me...

Semiconductor device, printed circuit board (PCB), and method of in...

Board mounted active component assembly

Optical sensor and optical sensor module

Circuit assemblies and components thereof for packaging

Electronic device and printed circuit board including structure for...

Electronic device

Data processing systems including optical communication modules

Interposer and electronic device including the same

Flexible tube-based detection and packaging structure and in-vivo d...

Semiconductor module

Server

High-capacity computer modules

Patents Applicationslast 30 patents

CIRCUIT BOARD SYSTEM

DENSELY PACKED ELECTRONIC SYSTEMS

ASSEMBLY STRUCTURE

SOLDERING BOARD ARRANGEMENT

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

INFORMATION PROCESSING APPARATUS

ELECTRONIC APPARATUS WITH A TWO-WAY CABLE CONNECTION CONSTRUCTION,...

COMPUTING NODE AND COMPUTING DEVICE

POWER MODULE

ELECTRICAL CONNECTION DEVICE

STIFFENER WITH INTEGRATED CONNECTORS

CIRCUIT SYSTEM AND METHOD FOR RADAR, LIDAR, OR CAMERA SYSTEMS

VOICE-CONTROLLED ELECTRONIC DEVICE

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

FLEXIBLE AUTOMOTIVE GRADE LIGHT SOURCE

LASER SOURCE AND LASER PROJECTION APPARATUS

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

DATA PROCESSING SYSTEMS INCLUDING OPTICAL COMMUNICATION MODULES

FIXING ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

WIRING BOARD

ELECTRONIC DEVICE AND EXPANSION CARD MODULE

CIRCUIT ASSEMBLIES AND COMPONENTS THEREOF FOR PACKAGING

TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

CIRCUIT BOARD

CIRCUIT BOARD INTERCONNECT INTERPOSER AND METHOD

REUSABLE MEMBER FOR RETAINING ELECTRONIC CARD

TOOLLESS COMPRESSION ATTACHED MEMORY MODULE INSTALLATION IN INFORMA...