Claims
- 1. A carrier head for a chemical mechanical polishing apparatus, comprising:a substrate backing member; a first chamber to provide a first downward pressure on the substrate backing member; a retaining ring to maintain a substrate beneath the substrate backing member during polishing, the retaining ring vertically movable relative to the substrate backing member, the retaining ring including a lower portion having a bottom surface for contacting a polishing pad during polishing and made of a first material, and an upper portion made of a second, different material; and a second chamber to provide a second independently controllable downward pressure on the retaining ring.
- 2. The carrier head of claim 1, wherein the lower portion is thicker than a substrate to be polished.
- 3. The carrier head of claim 1, wherein the upper and lower portions are substantially annular in shape.
- 4. The carrier head of claim 1, wherein the first material is a plastic.
- 5. The carrier head of claim 1, wherein the first material is Delrin.
- 6. The carrier head of claim 1, wherein the second material is a metal.
- 7. The carrier head of claim 6, wherein the second material is aluminum.
- 8. The carrier head of claim 1, wherein the lower portion is secured to the upper portion by screws.
- 9. The carrier head of claim 8, wherein the lower portion is secured to the upper portion by a key and key slot arrangement.
- 10. The carrier head of claim 1, wherein the upper portion is thicker than the lower portion.
- 11. The carrier head of claim 1, further comprising a housing, and wherein the substrate backing member is movable relative to the housing.
- 12. The carrier head of claim 11, wherein the retaining ring is movable relative to the housing.
- 13. A chemical mechanical polishing system, comprising:a rotatable polishing pad; a slurry supply to dispense a slurry onto the polishing pad; and a carrier head having a substrate backing member, a first chamber to provide a first downward pressure on the substrate backing member, a retaining ring to maintain a substrate beneath the mounting surface during polishing, the retaining ring vertically movable relative to the substrate backing member, the retaining ring including a lower portion having a bottom surface for contacting a polishing pad during polishing and made of a first material, and an upper portion made of a second, different material, and a second chamber to provide a second independently controllable downward pressure on the retaining ring.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of U.S. application Ser. No. 09/892,143, filed Jun. 25, 2001, which is a continuation of U.S. application Ser. No. 09/406,027, filed Sep. 27, 1999, now U.S. Pat. No. 6,290,577, which is a continuation of U.S. application Ser. No. 08/488,921, filed Jun. 9, 1995, now U.S. Pat. No. 6,024,630, each of which are incorporated herein by reference in their entirety.
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Foreign Referenced Citations (4)
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0 747 167 |
Dec 1996 |
EP |
0 776 730 |
Jun 1997 |
EP |
0 790 100 |
Aug 1997 |
EP |
2 307 342 |
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Continuations (3)
|
Number |
Date |
Country |
Parent |
09/892143 |
Jun 2001 |
US |
Child |
10/117892 |
|
US |
Parent |
09/406027 |
Sep 1999 |
US |
Child |
09/892143 |
|
US |
Parent |
08/488921 |
Jun 1995 |
US |
Child |
09/406027 |
|
US |