Number | Date | Country | Kind |
---|---|---|---|
8-231513 | Aug 1996 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4825809 | Mieno | May 1989 | |
4854263 | Chang et al. | Aug 1989 | |
5108792 | Anderson et al. | Apr 1992 | |
5200232 | Tappan et al. | Apr 1993 | |
5264040 | Geyling | Nov 1993 | |
5536319 | Wary et al. | Jul 1996 |
Number | Date | Country |
---|---|---|
61-193453 | Aug 1986 | JPX |
Entry |
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High Purification of Cu Thin Films by Oxygen Addition . . . ; 1995 Dry Process Symposium; A. Kajita, H. Kaneko et al.; pp. 123-128. |
Advanced Metalization and Interconnect Systems For Ulsi Applications; Oct. 1-3, 1996 Boston, Massachusetts, pp. 54-55. |
The Deposition Rate Cu-CVD with Cu(hfac)(tmvs) A. Kobayashi et al.; presented Jan. 10, 1997. |
Three-dimensional Equipment Modeling . . . ; J. Vac.Sci.Tech. A14(3); May/Jun. 1996. |