Claims
- 1. A circuit board comprising:
a terminal portion connected with an external terminal formed in an external circuit, said terminal portion provided with a nickel plating layer and a soldering bump; wherein a thickness of said nickel plating layer is within a range of 1.0 to 4.0 μm.
- 2. A circuit board according to claim 1, wherein said soldering bump contains tin and at least one of silver and copper.
- 3. A circuit board according to claim 1, wherein said soldering bump contains tin, silver and copper.
- 4. A circuit board according to claim 1, wherein said circuit board is a circuit-provided suspension substrate.
- 5. A connection structure for connecting a terminal portion. of a circuit board with an external terminal formed in an external circuit, wherein said terminal portion is provided with a nickel plating layer and a soldering bump provided on said terminal portion and a thickness of said nickel plating layer is within a range of 1.0 to 4.0 μm.
Priority Claims (1)
Number |
Date |
Country |
Kind |
P. 2000-317416 |
Oct 2000 |
JP |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] The present application is based on Japanese patent application No. 2000-317416, which is incorporated herein by reference.