Finish plating of conductors, especially of copper conductors

Industry

CPC
H05K3/244

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/244Finish plating of conductors, especially of copper conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,101,879
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with solder mask on internal copper pad
- Patent number 11,910,540
- Issue date Feb 20, 2024
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible circuit board
- Patent number 11,744,014
- Issue date Aug 29, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,723,153
- Issue date Aug 8, 2023
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 11,653,454
- Issue date May 16, 2023
- Sumitomo Electric Printed Circuits, Inc.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic apparatus and manufacturing method thereof
- Patent number 11,587,879
- Issue date Feb 21, 2023
- Fuji Electric Co., Ltd.
- Naoki Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,510,318
- Issue date Nov 22, 2022
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,503,709
- Issue date Nov 15, 2022
- Ibiden Co., Ltd.
- Shota Tachibana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board module
- Patent number 11,460,015
- Issue date Oct 4, 2022
- ebm-papst St. Georgen GmbH & Co. KG
- Volker Ehlers
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Flexible printed circuit (FPC) board and method for manufacturing t...
- Patent number 11,432,404
- Issue date Aug 30, 2022
- Rui Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,419,222
- Issue date Aug 16, 2022
- Unimicron Technology Corp.
- Hsin-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 11,399,426
- Issue date Jul 26, 2022
- NGK Spark Plug Co., Ltd.
- Toshio Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 11,297,720
- Issue date Apr 5, 2022
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 11,276,610
- Issue date Mar 15, 2022
- Fujitsu Limited
- Masaru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, memory system, and method for manufacturing p...
- Patent number 11,272,610
- Issue date Mar 8, 2022
- Kioxia Corporation
- Daigo Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,246,224
- Issue date Feb 8, 2022
- Ibiden Co., Ltd.
- Yoji Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of nanowire films
- Patent number 11,240,917
- Issue date Feb 1, 2022
- TECHNOLOGY INNOVATION MOMENTUM FUND (ISRAEL) LIMITED PARTNERSHIP
- Gil Markovich
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,219,130
- Issue date Jan 4, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 11,202,367
- Issue date Dec 14, 2021
- LG Innotek Co., Ltd
- Jun Young Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20240414842
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240306292
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kyehwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT LED DISPLAY DEVICE INTEGRATED WITH SMPS AND MANUFACTURI...
- Publication number 20240234393
- Publication date Jul 11, 2024
- LEORIA Inc.
- Jun Cheol KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- Hideki MATSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20230422393
- Publication date Dec 28, 2023
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20230345632
- Publication date Oct 26, 2023
- LG Innotek Co., Ltd.
- Jun Young LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD
- Publication number 20230328896
- Publication date Oct 12, 2023
- DSBJ PTE. LTD.
- Pui Yin YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSTION FOR DEPOSITING A PALLADIUM COATING ON A SUBSTRATE
- Publication number 20230323542
- Publication date Oct 12, 2023
- Atotech Deutschland GmbH & Co. KG
- Donny LAUTAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF
- Publication number 20230319991
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- G01 - MEASURING TESTING
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20230054628
- Publication date Feb 23, 2023
- Translarity, Inc.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
Electroless Plating Process and Two-Layer Plating Film
- Publication number 20230050310
- Publication date Feb 16, 2023
- KOJIMA CHEMICALS CO., LTD.
- Hideto Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220256712
- Publication date Aug 11, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20220240390
- Publication date Jul 28, 2022
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
- Publication number 20220225502
- Publication date Jul 14, 2022
- DENSO CORPORATION
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20220167499
- Publication date May 26, 2022
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...
- Publication number 20220070998
- Publication date Mar 3, 2022
- KIOXIA Corporation
- Daigo SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210392754
- Publication date Dec 16, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210259106
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Shota TACHIBANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION PLATE
- Publication number 20210243896
- Publication date Aug 5, 2021
- TRANSLARITY, INC.
- Dominik Schmidt
- G01 - MEASURING TESTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20210243901
- Publication date Aug 5, 2021
- LG Innotek Co., Ltd.
- Yun Mi BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT SURFACE FINISH, METHOD OF USE, AND ASSEMBLIES MADE...
- Publication number 20210193346
- Publication date Jun 24, 2021
- LILOTREE, L.L.C.
- Kunal Shah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210120677
- Publication date Apr 22, 2021
- LG Innotek Co., Ltd.
- Jung Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTURED TEST PADS FOR PRINTED CIRCUIT BOARD TESTING
- Publication number 20210120667
- Publication date Apr 22, 2021
- SEAGATE TECHNOLOGY LLC
- Michael Richard Fabry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT (FPC) BOARD AND METHOD FOR MANUFACTURING T...
- Publication number 20200404788
- Publication date Dec 24, 2020
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Rui XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20200396846
- Publication date Dec 17, 2020
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Finish plating of conductors, especially of copper conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method of producing printed circuit board

Patterned article including electrically conductive elements

Flexible circuit board

Patterned conductive article

Redistribution plate

Radio frequency transmission line with finish plating on conductive...

Circuit board with solder mask on internal copper pad

Printed circuit board and method of manufacturing the same

Plated metallization structures

Flexible circuit board

Printed circuit board and method of fabricating the same

Multilayer printed wiring board and method of manufacturing the same

Printed wiring board and manufacturing method thereof

Ceramic electronic component

Ceramic electronic component

Electronic apparatus and manufacturing method thereof

Printed circuit board

Redistribution plate

Printed wiring board and method for manufacturing printed wiring board

Printed circuit board module

Flexible printed circuit (FPC) board and method for manufacturing t...

Method of manufacturing circuit board

Wiring board and method for manufacturing same

Printed circuit board and method of fabricating the same

Wiring board and method of manufacturing the same

Printed wiring board, memory system, and method for manufacturing p...

Method for manufacturing printed wiring board

Printing of nanowire films

Circuit board and manufacturing method thereof

Flexible circuit board

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PATTERNED CONDUCTIVE ARTICLE

WIRING BOARD

TRANSPARENT LED DISPLAY DEVICE INTEGRATED WITH SMPS AND MANUFACTURI...

WIRING CIRCUIT BOARD

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

WIRING BOARD

FLEXIBLE CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD

COMPOSTION FOR DEPOSITING A PALLADIUM COATING ON A SUBSTRATE

LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF

REDISTRIBUTION PLATE

Electroless Plating Process and Two-Layer Plating Film

WIRING CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD

PATTERNED CONDUCTIVE ARTICLE

PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...

PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

REDISTRIBUTION PLATE

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

PRINTED CIRCUIT SURFACE FINISH, METHOD OF USE, AND ASSEMBLIES MADE...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

TEXTURED TEST PADS FOR PRINTED CIRCUIT BOARD TESTING

FLEXIBLE PRINTED CIRCUIT (FPC) BOARD AND METHOD FOR MANUFACTURING T...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME