Handbook of Semiconductor Wafer Cleaning Technology, Noyes Publications, pp. 48-56, 76-85, 134-142, 390-394 and 597-598, 1993. |
S. Ojima et al., "Advanced Wet Cleaning of Wafers with Reduced Chemicals and DI Water Consumption", research report IEICE, SDM 95-86, ICD 95-95, pp. 105-112, Jul. 1995. |
M. Morita and T. Ohmi, "Current Understanding of the Native Oxides", abstract, Ultra Clean Technology, vol. 1, No. 1, pp. 22-28, 1989. |
T. Yonehara et al., "Epitaxial layer transfer by bond and etch back of porous Si," Applied Physics Letters 64 (16), Apr. 18, 1994. |
O.I. Babikov, "Ultrasonic Modular Units for Cleaning Semiconductor Structures in Deionized Water With Increased Intensity of the Piezoceramic Transducers", Elektrotekhnika, vol. 62, No. 6, pp. 74-77, 1991. |
Patent Abstracts of Japan, vol. 15, No. 130 (E-1051), Mar. 29, 1991, corresponding to JP 03-014230. |
Patent Abstracts of Japan, vol. 12, No. 049 (E-582), Feb. 13, 1988, corresponding to JP 62-198127. |
Patent Abstracts of Japan, vol. 18, No. 651 (C-1285), Dec. 9, 1994, corresponding to JP 06-254521. |
Patent Abstracts of Japan, vol. 16, No. 465 (E-1270), Sep. 28, 1992, corresponding to JP 04-165620. |
Patent Abstracts of Japan, vol. 16, No. 420 (E-1259), Sep. 4, 1992, corresponding to JP 04-144131. |
Patent Abstracts of Japan, vol. 18, No. 684 (E-1650), Dec. 22, 1994, corresponding to JP 06-275866. |
Patent Abstracts of Japan, vol. 18, No. 493 (E-1606), Sep. 14, 1994, corresponding to JP 06-168660. |