This application is a continuation-in-part of U.S. patent application Ser. No. 08/955,393 now U.S. Pat. No. 6,165,956 entitled “Methods and Apparatus for Cleaning Semiconductor Substrates after Polishing of Copper Film”, filed Oct. 21, 1997.
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3939661 | Jun 1991 | DE |
0805484 | Nov 1997 | EP |
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Entry |
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Number | Date | Country | |
---|---|---|---|
Parent | 08/955393 | Oct 1997 | US |
Child | 09/037586 | US |