Patent Application
20100062685
The inventions described below relate to the field of polishing pads for use in chemical mechanical polishing.
In our prior U.S. Patents, Halley, Polishing Pad With Built-In Optical Sensor, U.S. Pat. No. 6,986,701 (Jan. 17, 2006) and Wolf, Polishing Pad With Built-In Optical Sensor, U.S. Pat. No. 6,485,354 (Nov. 26, 2002), we described polishing pads with built-in optical sensor assemblies for use in chemical mechanical planarization processes. The sensors assemblies included light sources and light detectors which are used to detect changes in the surface of an integrated circuit or in the thickness of films built on the wafer during polishing so that technicians involved in polishing wafers know exactly when to stop polishing. The sensor assemblies and optical sensors are embedded within the thickness of the polishing pad, and thus eliminate the need for drilling holes into the platen, as we had previously proposed in Truer, Optical View Port For Chemical Mechanical Planarization Endpoint Detection, U.S. Pat. No. 6,146,242 (Nov. 14, 2000). The incorporation of the optical sensor into the pad also eliminated the need for drilling holes through the platen as suggested in Birang, Forming A Transparent Window In A Polishing Pad For A Chemical Mechanical Polishing Apparatus, U.S. Pat. No. 5,893,796 (Apr. 13, 1999). In Birang's system, an optical sensor was placed under the platen, which required that a hole be drilled in completely through the platen, and also permitted sensing only when the hole in the plated passed over the sensor. The wafers to be polished are composite structures that include strata of different materials. Typically, the outermost stratum is polished away until its interface with an underlying stratum has been reached. At that point it is said that the end point of the polishing operation has been reached. The optical emitter/detector embedded in the pad is able to detect transitions from an oxide layer to a silicon layer as well as transitions from a metal to an oxide, or other material. The optical sensor can also be used to measure the thickness of a layer in processes intended to planarize a layer while leaving a uniformly thick film on the wafer. When a system controller (any suitable computer and appropriate interfaces to the emitter/detector) determines that the polishing process has reached a desired endpoint (complete removal of a metal layer, or reduction of a layer to a desired thickness), the system controller provides output to an operator indicating that the process endpoint has been reached, or operates the associated polishing system to cease polishing. The real-time data derived from the optical sensor enables the end-point detection without the need to disengage the wafer from the polishing equipment and interrupt the polishing process. This greatly increases the efficiency of the polishing process.
The devices and methods described below provide for a polishing pad with an embedded sensor assembly wherein the necessary cables for communication between the sensor assembly and any necessary transceiver are provided in the form of ribbon cables with a thickness corresponding to the thickness of the adhesive layer which holds the polishing pad to the platen.
In our prior patents, we have disclosed various coupling means for transmitting optical information from the sensor embedded in the pad, including a centrally located hub which was wired to the sensor and wireless communication system in which the all the power and communications circuitry resided in a small disk or puck-like assembly embedded in the pad. As described below, the transfer of data can be facilitated by placing a wireless transceiver on the edge of the pad and platen. In this position, a larger power supply and/or transmitter can be provided for the transceiver, without disrupting the balance of the platen, so that numerous polishing operations may be accomplished using a battery-operated transceiver.
A transceiver and power assembly is provided to provide power to an emitter/detector assembly disposed within the optical port 2. The transceiver and power assembly may be centrally located in the suspension arm or peripherally located on the edge of the polishing platen 17. If centrally located, the transceiver and power assembly may be provided on the suspension arm 8 which holds a non-rotating hub 9 suspended over a rotating hub 10 (which includes means for communicating signals to the transceiver and power assembly as described in our U.S. Pat. No. 6,485,354) or within the rotating hub itself. The hub 10 is fixed relative to the rotating pad, and is attached to an electrical conducting assembly located within the pad where the hub attaches, to transmit power to the optical assembly and receive signals from the optical sensors it the optical assembly. If the transceiver and power assembly is peripherally located, it is fixed on the outer edge of the platen, either on top of the platen, under the platen, or on the outer side of the platen, as illustrated by the placement of transceiver and power assembly 10p. The electrical conducting assembly can an electrically conducting ribbon, also known as a flex circuit or ribbon cable, marked as item 11. The ribbon 11 electrically connects an optical sensing mechanism, located within the optical port 2 and embedded in the pad 3, to the electronics in the electronics hub 10. The transceiver may be battery operated, and may communicate with the control system wirelessly, especially where the transceiver is placed off-center on the platen of polishing pad, as is the transceiver and power assembly 10p.
The window rotates with the polishing pad, which itself rotates on a process drive table, or platen 17, in the direction of arrow 12. The polishing heads rotate about their respective spindles 13 usually in the direction of arrows 14. The polishing heads themselves are translated back and forth over the surface of the polishing pad by the translating spindle 15, as indicated by arrow 16. Thus, the optical window 2 passes under the polishing heads while the polishing heads are both rotating and translating, swiping a complex path across the wafer surface on each rotation of the polishing pad/platen assembly.
The pad and optical sensor assembly are assembled as shown in
As shown in the cross section of
The pad and sensor assembly combination may be formed from pre-manufactured pads which are typically provided with a PSA layer and a protective film. The PSA layer is applied to a known thickness, typically 4 mil (0.004″). The assembly is made by forming the cylindrical hole in the sub-pad, and scraping or cutting away the pressure sensitive adhesive on the bottom of the sub-pad along the intended track of the ribbon cable. The typical Mylar protective layer is also removed along the cable track. This creates a groove or channel in which the ribbon cable will sit, which is substantially the same depth as the ribbon cable. Also, the oblong or oval hole is cut through the upper pad. Next, the Mylar film is removed from the top pad, and the top pad is pressed onto the sub-pad, keeping the holes in each pad aligned. Next, the sensor assembly cap (housing spacer and seal disc) is inserted into the pad stack, into the holes so that the oval riser fits snugly into the oval hole of the upper pad, and glued into this recess so that the upper surface of the sensor cap is flush with the upper surface of the pad. Next, the emitter detector assembly is inserted and secured within the riser of the sensor cap, and (if not already attached, one end of the ribbon cable is inserted into the cavity and attached to the emitter/detector assembly. The ribbon cable is glued to the sub-pad, in the track which has been previously cleared of pressure sensitive adhesive. The assembled pad is then applied to the platen, and fixed to the platen. To complete the system, the transceiver is mounted on the edge of the platen or table (preferably, though it can be placed in the center of the table) and attached to the free end of the ribbon cable. Fixed components such as the fixed receiver or transceiver which interconnects the rotating transceiver to the control system with appropriate software, if not already installed, may be installed at any point within or near the CMP tool. The various steps required to produce the pad and sensor combination may be performed in various locations, so that stock pads may be purchased and modified at the point of installation on a CMP platen, or the pad and sensor assembly combination may be assembled by a pad manufacturer and shipped to CMP facilities ready for installation on CMP platens.
When fully assembled in a CMP system for polishing a wafer, the CMP system will include a platen and a polishing pad assembly as described above, a transceiver mounted on the periphery of the platen (or near the center of the pad) which operates to receive data from the sensor assembly and transmit said data to a receiver which in turn is operable to communicate data received from the sensor assembly through the transceiver, to a control system of the polishing tool. The control system is programmed to analyze the data from the sensor assembly to determine and report the state of a wafer being polished in the CMP system, including determining when the polishing endpoint has been reached by the polishing system, and may be further programmed to communicate the attainment of the end-point to an operator, or control the CMP system to cease polishing operations when the endpoint is reached or adjust polishing parameters during polishing depending on the progress of the polishing operation as determined by analysis of the signals achieved from the sensor.
While the preferred embodiments of the devices and methods have been described in reference to the environment in which they were developed, they are merely illustrative of the principles of the inventions. Other embodiments and configurations may be devised without departing from the spirit of the inventions and the scope of the appended claims.
