Coated heat sink

Abstract

A coated heat sink includes: a copper base seat, an aluminum heat-dissipating seat, a plurality of heat pipes, a solder, a heat-conducting adhesive glue, and a plurality of heat-dissipating fins. The aluminum heat-dissipating seat disposes on top of the copper base seat. The heat pipes dispose on the top of the copper base seat. The solder respectively forms on contact surfaces among the copper base seat and the heat pipes for joining the copper base seat and the heat pipes together. The glue respectively forms on contact surfaces between the copper base seat and the aluminum heat-dissipating seat and among the aluminum heat-dissipating seat and the heat pipes for joining the copper base seat and the aluminum heat-dissipating seat together, and the aluminum heat-dissipating seat and the heat pipes together. The fins dispose over the aluminum heat-dissipating seat, and the fins stack together and compactly joint with the heat pipes.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:

FIG. 1 is a front, schematic view of a heat sink of the prior art;

FIG. 2 is a bottom, schematic view of a heat sink of the prior art;

FIG. 3 is a front, schematic view of a coated heat sink according to the first embodiment of the present invention; and

FIG. 4 is a front, schematic view of a coated heat sink according to the second embodiment of the present invention.

Claims

1. A coated heat sink, comprising: a copper base seat;an aluminum heat-dissipating seat disposed on a top portion of the copper base seat;a plurality of heat pipes respectively disposed on the top portion of the copper base seat;a solder respectively formed on contact surfaces among the copper base seat and the heat pipes for compactly joining the copper base seat and the heat pipes together;a heat-conducting adhesive glue respectively formed on contact surfaces between the copper base seat and the aluminum heat-dissipating seat and among the aluminum heat-dissipating seat and the heat pipes for compactly joining the copper base seat and the aluminum heat-dissipating seat together, and the aluminum heat-dissipating seat and the heat pipes together, respectively; anda plurality of heat-dissipating fins disposed over the aluminum heat-dissipating seat, wherein the heat-dissipating fins are stacked together and compactly jointed with the heat pipes.

2. The coated heat sink as claimed in claim 1, wherein the heat pipes penetrate the heat-dissipating fins.

3. The coated heat sink as claimed in claim 1, wherein the heat-conducting adhesive glue is an epoxy.

4. The coated heat sink as claimed in claim 1, wherein the viscosity of the heat-conducting adhesive glue is between 1000 and 10000 cps/25□.

5. The coated heat sink as claimed in claim 1, wherein the thermal conductivity of the heat-conducting adhesive glue is between 0.84 and 2.7 W/m·K.

6. A coated heat sink, comprising: a copper base seat;a heat-conducting unit having an aluminum heat-dissipating seat disposed on a top portion of the copper base seat and a plurality of fins disposed on a top side of the aluminum heat-dissipating seat;a plurality of heat pipes respectively disposed on the top portion of the copper base seat and compactly joining the fins together;a solder respectively formed on contact surfaces among the copper base seat and the heat pipes for compactly joining the copper base seat and the heat pipes together; anda heat-conducting adhesive glue respectively formed on contact surfaces between the copper base seat and the aluminum heat-dissipating seat and among the aluminum heat-dissipating seat and the heat pipes for compactly joining the copper base seat and the aluminum heat-dissipating seat together, and the aluminum heat-dissipating seat and the heat pipes together, respectively.

7. The coated heat sink as claimed in claim 6, wherein the heat pipes penetrate the heat-dissipating fins.

8. The coated heat sink as claimed in claim 6, wherein the heat-conducting adhesive glue is an epoxy.

9. The coated heat sink as claimed in claim 6, wherein the viscosity of the heat-conducting adhesive glue is between 1000 and 10000 cps/25□.

10. The coated heat sink as claimed in claim 6, wherein the thermal conductivity of the heat-conducting adhesive glue is between 0.84 and 2.7 W/m·K.