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H01L23/3735

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3735Laminates or multilayers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof, and three...
- Patent number 12,218,032
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper connected glass modules on a glass board
- Patent number 12,199,007
- Issue date Jan 14, 2025
- BROADCOM INTERNATIONAL PTE. LTD.
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation using nanoscale materials
- Patent number 12,191,228
- Issue date Jan 7, 2025
- Sanctioned Risk Solutions, Inc.
- Zachary R. Greenhill
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 12,183,689
- Issue date Dec 31, 2024
- AMOSENSE CO., LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat extraction path from a laser die using a highly conductive the...
- Patent number 12,183,650
- Issue date Dec 31, 2024
- Intel Corporation
- Aditi Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive tracks, and electronic module
- Patent number 12,183,710
- Issue date Dec 31, 2024
- Siemens Aktiengesellschaft
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate and power module using the same
- Patent number 12,183,654
- Issue date Dec 31, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct bonded copper substrates fabricated using silver sintering
- Patent number 12,170,239
- Issue date Dec 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Erik Nino Mercado Tolentino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device
- Patent number 12,165,949
- Issue date Dec 10, 2024
- Samsung Display Co., Ltd.
- Munsik Ham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Bonded substrate, and method for manufacturing bonded substrate
- Patent number 12,165,948
- Issue date Dec 10, 2024
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spaced apart containers
- Patent number 12,154,836
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Hisashi Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side cooling semiconductor packages and related methods
- Patent number 12,154,844
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR CONNECTING TWO CONNECTION PARTNERS
- Publication number 20250047049
- Publication date Feb 6, 2025
- INFINEON TECHNOLOGIES AG
- Guido Strotmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20250038064
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MA...
- Publication number 20250031349
- Publication date Jan 23, 2025
- Carbice Corporation
- Baratunde Cola
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION
- Publication number 20250031413
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250029939
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FEATURES AND RELATED METHODS OF FORMING
- Publication number 20250029844
- Publication date Jan 23, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022762
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Masayoshi NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING
- Publication number 20250022769
- Publication date Jan 16, 2025
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES
- Publication number 20250015044
- Publication date Jan 9, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hao YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...
- Publication number 20250010390
- Publication date Jan 9, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE
- Publication number 20250014964
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006648
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006622
- Publication date Jan 2, 2025
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE
- Publication number 20240429132
- Publication date Dec 26, 2024
- STMicroelectronics S.r.l.
- Agatino MINOTTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20240429143
- Publication date Dec 26, 2024
- Delta Electronics, Inc.
- Jung-Li CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421052
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240421106
- Publication date Dec 19, 2024
- Hyundai Motor Company
- Jin Myeong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER MATERIAL
- Publication number 20240409800
- Publication date Dec 12, 2024
- ARCELORMITTAL
- Cristina BLANCO ROLDAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION PLATE
- Publication number 20240413045
- Publication date Dec 12, 2024
- DENSO CORPORATION
- MASAYUKI KAMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240413044
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Koji URAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240404913
- Publication date Dec 5, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS

Laminates or multilayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Venturi-effect heat-transfer device

Electronic device

Semiconductor apparatus and manufacturing method thereof, and three...

Semiconductor device with improved performance in operation and imp...

Systems and methods for integrated gate driver for inverter for ele...

Group III nitride based depletion mode differential amplifiers and...

Submodule semiconductor package

Bonded body, power module substrate, power module, method for manuf...

Copper connected glass modules on a glass board

Systems and methods for non-overlap enforcement for inverter for el...

Silicon nitride circuit board and electronic component module

Circuit board and semiconductor device including the same

Semiconductor device including surface pressure absorbing member fo...

Silicon nitride sintered body, silicon nitride substrate, and silic...

Heat dissipation using nanoscale materials

Thermal performance improvement and stress reduction in semiconduct...

Systems and methods for single channel fault encoding for inverter...

Ceramic substrate and manufacturing method therefor

Heat extraction path from a laser die using a highly conductive the...

Thermal conductive film

Method for producing conductive tracks, and electronic module

Insulating substrate and power module using the same

Heat-dissipating circuit board, heat-dissipating member, and produc...

Direct bonded copper substrates fabricated using silver sintering

Display device

Systems and methods for phase switch timing controller for inverter...

Bonded substrate, and method for manufacturing bonded substrate

Semiconductor device with spaced apart containers

Dual-side cooling semiconductor packages and related methods

Graphene-coated heat spreader for integrated circuit device assemblies

Patents Applicationslast 30 patents

METHODS FOR CONNECTING TWO CONNECTION PARTNERS

SEMICONDUCTOR DEVICE

CHIP-ON-FILM PACKAGE

CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MA...

SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

COPPER FEATURES AND RELATED METHODS OF FORMING

POWER MODULE STRUCTURE

SEMICONDUCTOR MODULE

DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING

DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES

ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

BLOCKING ELEMENT FOR CONNECTING PINS OF SEMICONDUCTOR DICE

Power Module and Method for Assembling a Power Module

POWER MODULE STRUCTURE

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

POWER MODULE

HEAT SPREADER MATERIAL

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

ON DIE FLEXURE CONTROL DEVICE AND METHOD

SEMICONDUCTOR MODULE AND HEAT DISSIPATION PLATE

SEMICONDUCTOR DEVICE

HEAT DISSIPATION MEMBER