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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3735Laminates or multilayers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, semiconductor system, moving body, and method...
- Patent number 12,243,789
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly, and ceramic circuit substrate and semiconductor de...
- Patent number 12,240,218
- Issue date Mar 4, 2025
- Kabushiki Kaisha Toshiba
- Shota Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a thermal interface materia...
- Patent number 12,237,242
- Issue date Feb 25, 2025
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packages with increased power handling
- Patent number 12,224,218
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Venturi-effect heat-transfer device
- Patent number 12,218,028
- Issue date Feb 4, 2025
- SAFRAN
- Toni Youssef
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,218,025
- Issue date Feb 4, 2025
- Denso Corporation
- Syuhei Miyachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof, and three...
- Patent number 12,218,032
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved performance in operation and imp...
- Patent number 12,218,029
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Group III nitride based depletion mode differential amplifiers and...
- Patent number 12,212,289
- Issue date Jan 28, 2025
- MACOM Technology Solutions Holdings, Inc.
- Jeremy Fisher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, power module substrate, power module, method for manuf...
- Patent number 12,199,006
- Issue date Jan 14, 2025
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper connected glass modules on a glass board
- Patent number 12,199,007
- Issue date Jan 14, 2025
- BROADCOM INTERNATIONAL PTE. LTD.
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Silicon nitride circuit board and electronic component module
- Patent number 12,199,005
- Issue date Jan 14, 2025
- DENKA COMPANY LIMITED
- Seiji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including surface pressure absorbing member fo...
- Patent number 12,191,218
- Issue date Jan 7, 2025
- Mitsubishi Electric Corporation
- Arata Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation using nanoscale materials
- Patent number 12,191,228
- Issue date Jan 7, 2025
- Sanctioned Risk Solutions, Inc.
- Zachary R. Greenhill
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermal performance improvement and stress reduction in semiconduct...
- Patent number 12,191,264
- Issue date Jan 7, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method therefor
- Patent number 12,183,689
- Issue date Dec 31, 2024
- AMOSENSE CO., LTD.
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat extraction path from a laser die using a highly conductive the...
- Patent number 12,183,650
- Issue date Dec 31, 2024
- Intel Corporation
- Aditi Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive film
- Patent number 12,183,653
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing conductive tracks, and electronic module
- Patent number 12,183,710
- Issue date Dec 31, 2024
- Siemens Aktiengesellschaft
- Alexander Hensel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating substrate and power module using the same
- Patent number 12,183,654
- Issue date Dec 31, 2024
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION
- Publication number 20250079258
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250079274
- Publication date Mar 6, 2025
- Hyundai Motor Company
- Han Jin DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE AND ASSEMBLY METHOD
- Publication number 20250079407
- Publication date Mar 6, 2025
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...
- Publication number 20250073826
- Publication date Mar 6, 2025
- Kabushiki Kaisha Toshiba
- Shota YAMAMOTO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...
- Publication number 20250079353
- Publication date Mar 6, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY
- Publication number 20250069984
- Publication date Feb 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069986
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- So TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL
- Publication number 20250069985
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20250069992
- Publication date Feb 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062180
- Publication date Feb 20, 2025
- DENSO CORPORATION
- Hiroshi UKEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20250062271
- Publication date Feb 20, 2025
- Fuji Electric Co., Ltd.
- Yoko NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...
- Publication number 20250054830
- Publication date Feb 13, 2025
- Mitsubishi Electric Corporation
- Riki KAJIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING AN IRON SLURRY IN SEMICONDUCTOR ASSEMBLY
- Publication number 20250054835
- Publication date Feb 13, 2025
- LENOVO (SINGAPORE) PTE. LTD.
- Mark Summerville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCI...
- Publication number 20250054832
- Publication date Feb 13, 2025
- Rogers Germany GmbH
- Vitalij GIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHODS FOR CONNECTING TWO CONNECTION PARTNERS
- Publication number 20250047049
- Publication date Feb 6, 2025
- INFINEON TECHNOLOGIES AG
- Guido Strotmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038146
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20250038064
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MA...
- Publication number 20250031349
- Publication date Jan 23, 2025
- Carbice Corporation
- Baratunde Cola
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION
- Publication number 20250031413
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250029939
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FEATURES AND RELATED METHODS OF FORMING
- Publication number 20250029844
- Publication date Jan 23, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20250022770
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Fu-Yuan SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250022762
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Masayoshi NAKAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING
- Publication number 20250022769
- Publication date Jan 16, 2025
- MTS IP Holdings Ltd
- Luke Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES
- Publication number 20250015044
- Publication date Jan 9, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hao YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...
- Publication number 20250010390
- Publication date Jan 9, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE
- Publication number 20250014964
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS

Laminates or multilayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, semiconductor system, moving body, and method...

Bonded assembly, and ceramic circuit substrate and semiconductor de...

Semiconductor device package comprising a thermal interface materia...

Chip-on-film package and display apparatus including the same

Semiconductor package and related methods

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

Semiconductor packages with increased power handling

Venturi-effect heat-transfer device

Electronic device

Semiconductor apparatus and manufacturing method thereof, and three...

Semiconductor device with improved performance in operation and imp...

Systems and methods for integrated gate driver for inverter for ele...

Group III nitride based depletion mode differential amplifiers and...

Submodule semiconductor package

Bonded body, power module substrate, power module, method for manuf...

Copper connected glass modules on a glass board

Systems and methods for non-overlap enforcement for inverter for el...

Silicon nitride circuit board and electronic component module

Circuit board and semiconductor device including the same

Semiconductor device including surface pressure absorbing member fo...

Silicon nitride sintered body, silicon nitride substrate, and silic...

Heat dissipation using nanoscale materials

Thermal performance improvement and stress reduction in semiconduct...

Ceramic substrate and manufacturing method therefor

Systems and methods for single channel fault encoding for inverter...

Heat extraction path from a laser die using a highly conductive the...

Thermal conductive film

Method for producing conductive tracks, and electronic module

Insulating substrate and power module using the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURES FOR EFFICIENT HEAT DISSIPATION

POWER MODULE

POWER MODULE AND POWER CONVERSION APPARATUS

POWER ELECTRONICS MODULE AND ASSEMBLY METHOD

METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAM...

POWER CONVERTER, EMBEDDED INTEGRATED DEVICE UNIT, HIGH-HEAT-DISSIPA...

POWER SEMICONDUCTOR DEVICE AND POWER ELECTRONICS ASSEMBLY

SEMICONDUCTOR DEVICE

3DIC WITH HEAT DISSIPATION STRUCTURE AND WARPAGE CONTROL

DUAL-SIDE COOLING SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFA...

CONTROLLING AN IRON SLURRY IN SEMICONDUCTOR ASSEMBLY

CARRIER SUBSTRATE FOR ELECTRICAL COMPONENTS, AND METHOD FOR PRODUCI...

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

METHODS FOR CONNECTING TWO CONNECTION PARTNERS

SEMICONDUCTOR DEVICE

CHIP-ON-FILM PACKAGE

CARBON NANOTUBE-BASED THERMAL INTERFACE MATERIALS AND METHODS OF MA...

SEMICONDUCTOR DEVICE AND METHOD FOR THERMAL DISSIPATION

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

COPPER FEATURES AND RELATED METHODS OF FORMING

POWER MODULE STRUCTURE

SEMICONDUCTOR MODULE

DIRECT TO CHIP APPLICATION OF BOILING ENHANCEMENT COATING

DIE-SUBSTRATE INTERFACE INCLUDING LOCKING FEATURES

ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...