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H01L23/3735

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3735Laminates or multilayers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,368,083
- Issue date Jul 22, 2025
- Denso Corporation
- Hiroshi Ukegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting base and electronic device
- Patent number 12,362,254
- Issue date Jul 15, 2025
- Kyocera Corporation
- Kouichirou Sugai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a substrate arrangement, having p...
- Patent number 12,362,312
- Issue date Jul 15, 2025
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, semiconductor apparatus, and vehicle
- Patent number 12,362,257
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Masahide Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,332
- Issue date Jul 15, 2025
- Mitsubishi Electric Corporation
- Ryoya Shirahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 12,354,930
- Issue date Jul 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with external power sensor
- Patent number RE50485
- Issue date Jul 8, 2025
- Infineon Technologies AG
- Juergen Hoegerl
Information Patent Grant
Method for manufacturing bonded body and method for manufacturing i...
- Patent number 12,356,554
- Issue date Jul 8, 2025
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body including titanium alloy at bonding boundary
- Patent number 12,347,744
- Issue date Jul 1, 2025
- Kabushiki Kaisha Toshiba
- Seiichi Suenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,347,813
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,348,157
- Issue date Jul 1, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for multiple output integrated gate driver for...
- Patent number 12,341,454
- Issue date Jun 24, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for galvanic isolation for inverter for electri...
- Patent number 12,328,083
- Issue date Jun 10, 2025
- BorgWarner US Technologies LLC
- Srikanth Vijaykumar
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module
- Patent number 12,327,771
- Issue date Jun 10, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC with heat dissipation structure and warpage control
- Patent number 12,322,673
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Switching device and electronic circuit
- Patent number 12,316,307
- Issue date May 27, 2025
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooling type power module
- Patent number 12,308,300
- Issue date May 20, 2025
- Hyundai Motor Company
- Jun Hee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and bonded body
- Patent number 12,308,301
- Issue date May 20, 2025
- Kabushiki Kaisha Toshiba
- Yumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,308,349
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Takamasa Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies with power electronic devices and three-dime...
- Patent number 12,300,653
- Issue date May 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates and related methods
- Patent number 12,300,558
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 12,300,512
- Issue date May 13, 2025
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250233116
- Publication date Jul 17, 2025
- DIODES INCORPORATED
- Shu-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR ELECTRONIC DEVICE
- Publication number 20250233031
- Publication date Jul 17, 2025
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE
- Publication number 20250233032
- Publication date Jul 17, 2025
- Power Master Semiconductor Co., Ltd.
- Ki-Myung YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES
- Publication number 20250226284
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED POWER ELECTRONIC DEVICE, IN PARTICULAR BRIDGE CIRCUIT COMP...
- Publication number 20250227895
- Publication date Jul 10, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226276
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS
- Publication number 20250226301
- Publication date Jul 10, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...
- Publication number 20250219554
- Publication date Jul 3, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...
- Publication number 20250218986
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE SUPPORT AND ASSEMBLY COMPRISING A THERMALLY CO...
- Publication number 20250218921
- Publication date Jul 3, 2025
- STMicroelectronics International N.V.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210489
- Publication date Jun 26, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250210446
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250210424
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF ELECTRONIC PACKAGES
- Publication number 20250210444
- Publication date Jun 26, 2025
- SK Hynix NAND Product Solutions Corp. (dba Solidigm)
- Jorge MARTINEZ ARAIZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID THERMAL INTERFACE MATERIAL WITH EMBEDDED METAL LAYER
- Publication number 20250201657
- Publication date Jun 19, 2025
- SANDISK TECHNOLOGIES, INC.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat-Dissipating Structures for Semiconductor Devices and Methods o...
- Publication number 20250201659
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250183117
- Publication date Jun 5, 2025
- Mitsubishi Electric Corporation
- Kazuki ARATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR DEVICE
- Publication number 20250183118
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Wai Wai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond Wafer Based Electronic Component and Method of Manufacture
- Publication number 20250174513
- Publication date May 29, 2025
- Diamond Foundary Incorporated
- Jean-Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250174515
- Publication date May 29, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND PHOTOVOLTAIC OPTIMIZER
- Publication number 20250174532
- Publication date May 29, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mize Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR SWITCHING MODULE
- Publication number 20250174514
- Publication date May 29, 2025
- NexFi Technology Inc.
- Satoshi TANIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid State Switching Power Module with Improved Current Rating
- Publication number 20250174610
- Publication date May 29, 2025
- ABB Schweiz AG
- Francisco Canales
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250162280
- Publication date May 22, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250167071
- Publication date May 22, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167163
- Publication date May 22, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS

Laminates or multilayers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for power module for inverter for electric vehicle

Semiconductor device

Electronic component mounting base and electronic device

Power semiconductor module having a substrate arrangement, having p...

Semiconductor module, semiconductor apparatus, and vehicle

Semiconductor device

Module with substrate recess for conductive-bonding component

Semiconductor module with external power sensor

Method for manufacturing bonded body and method for manufacturing i...

Bonded body including titanium alloy at bonding boundary

Semiconductor package and related methods

Systems and methods for power module for inverter for electric vehicle

Systems and methods for multiple output integrated gate driver for...

Systems and methods for galvanic isolation for inverter for electri...

Semiconductor module

Power module semiconductor device and inverter equipment, and fabri...

3DIC with heat dissipation structure and warpage control

Circuit board assembly and manufacturing method thereof

Systems and methods for data recorder for inverter for electric veh...

Systems and methods for an interlocking feature on a power module

Switching device and electronic circuit

Double-sided cooling type power module

Structure and bonded body

Semiconductor apparatus

Package for power semiconductor devices

Solid metal foam thermal interface material

Electronics assemblies with power electronic devices and three-dime...

Substrates and related methods

Metal/ceramic bonding substrate and method for producing same

Patents Applicationslast 30 patents

Electronic Device and Manufacturing Method Thereof

SUBSTRATE FOR ELECTRONIC DEVICE

DOUBLE-SIDED COOLING SEMICONDUCTOR DEVICE

THERMAL MISMATCH REDUCTION IN SEMICONDUCTOR DEVICE MODULES

PACKAGED POWER ELECTRONIC DEVICE, IN PARTICULAR BRIDGE CIRCUIT COMP...

SEMICONDUCTOR DEVICE

MULTILAYER SUBSTRATES, POWER MODULES, AND ELECTRICAL SYSTEMS

SYSTEMS AND METHODS FOR COOLING SYSTEM AND POWER MODULE FOR INVERTE...

METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...

THERMALLY CONDUCTIVE SUPPORT AND ASSEMBLY COMPRISING A THERMALLY CO...

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MONITORING OF ELECTRONIC PACKAGES

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

HYBRID THERMAL INTERFACE MATERIAL WITH EMBEDDED METAL LAYER

Heat-Dissipating Structures for Semiconductor Devices and Methods o...

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

SEMI-CONDUCTOR DEVICE

Diamond Wafer Based Electronic Component and Method of Manufacture

METHODS OF PRODUCING HIGH POWER MODULE PACKAGE STRUCTURES

POWER MODULE AND PHOTOVOLTAIC OPTIMIZER

POWER SEMICONDUCTOR SWITCHING MODULE

Solid State Switching Power Module with Improved Current Rating

ACTIVE METAL BRAZING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE