Patent Grant
10121590
1. Field of the Invention
The present invention relates to a method for producing a coil sheet used for production of a coil, and to a method for producing a coil.
2. Description of the Related Art
A conventional coil is formed by winding a plate member including an elongated, electrically conductive plate and an insulating layer bonded to the plate (for example, see Japanese Patent No. 4022181).
The present inventors have devised a coil sheet including the aforementioned plate member (including the conductor layer and the insulating layer) bonded to a base layer with an adhesive layer. Also, the present inventors have devised to cut the plate member and the adhesive layer of the coil sheet into a predetermined shape in advance. This coil sheet allows formation of a coil by releasing the plate member and the adhesive layer, each having the predetermined shape, from the base layer and then winding them into a coil shape.
However, there is a possibility that when the plate member and the adhesive layer are cut, the properties of the adhesive layer change, and the releasability between the base layer and the adhesive layer is impaired.
The present invention has been conceived to solve the aforementioned problems, and an object of the present invention is to provide a method for producing a coil sheet which can prevent impairment of the releasability between the base layer and the adhesive layer of the coil sheet. Another object of the present invention is to provide a method for producing a coil.
Aspects of the present invention for solving the aforementioned problems, and actions and effects thereof will be described below.
One aspect of the present invention provides a method of producing a coil sheet from an initial coil sheet in which a conductor layer, a thermally resistant insulating layer, a thermosetting, uncured adhesive layer, and a base layer are stacked in this order, the method being characterized by comprising: a first cutting step of cutting the conductor layer into a predetermined shape through etching; and a second cutting step of cutting, after the first cutting step, the insulating layer and the adhesive layer into the predetermined shape through etching.
According the above-described steps, the conductor layer, the insulating layer, and the adhesive layer are cut into the predetermined shape through etching. Therefore, these layers can be cut at a temperature lower than a temperature (thermal curing temperature) at which the adhesive layer is thermally cured. In contrast, if the insulating layer and the adhesive layer are cut by means of burning with a laser, the resultant heat may cause thermal curing of the thermosetting adhesive layer, resulting in impaired releasability between the base layer and the adhesive layer. According to the aforementioned steps, the thermal curing of the thermosetting adhesive layer can be prevented, whereby impairment of the releasability between the base layer and the adhesive layer can be prevented.
According to one aspect of the present invention, the initial sheet may be prepared by successively performing a step of applying a composition solution for forming the insulating layer to one surface of the conductor layer and drying and solidifying the composition solution to thereby provide the insulating layer on the one surface of the conductor layer; a step of providing the thermosetting, uncured adhesive layer on a surface of the insulating layer opposite the conductor layer; and a step of providing the base layer on a surface of the adhesive layer opposite the insulating layer at a temperature lower than a temperature at which the adhesive layer is thermally cured.
According to the above-described steps, the insulating layer is provided through application of a composition solution for forming the insulating layer to one surface of the conductor layer, and subsequent drying and solidification of the composition. Thus, the insulating layer can adhere to the conductor layer. Since the adhesive layer is not provided during the drying and solidification of the insulating layer, the thermal curing of the thermosetting adhesive layer can be prevented during the drying and solidification of the insulating layer. Since the base layer is formed on the surface of the adhesive layer opposite the insulating layer at a temperature lower than the temperature at which the adhesive layer is thermally cured, the thermal curing of the thermosetting adhesive layer can be prevented during the formation of the base layer.
According to one aspect of the present invention, the insulating layer may be mainly formed of polyimide; and the second cutting step includes a step of etching the insulating layer with an etchant which dissolves the polyimide without dissolving the conductor layer and the base layer. According to the above-described step, the insulating layer is mainly formed of polyimide. Therefore, the insulating layer exhibits excellent thermal resistance and insulating property. The second cutting step involves a step of etching the insulating layer with an etchant that does not dissolve the conductor layer and the base layer but dissolves polyimide. Therefore, the insulating layer can be cut by etching while the conductor layer and the base layer are prevented from being dissolved in the etchant.
According to one aspect of the present invention, an aqueous alkaline solution containing both organic and inorganic bases may be used as the etchant.
According to one aspect of the present invention, the adhesive layer may be mainly formed of an epoxy resin, a curing agent therefor, and an acrylic elastomer; and the second cutting step includes a step of etching the adhesive layer with an etchant which dissolves the epoxy resin and the curing agent therefor without dissolving the conductor layer and the base layer.
According to the above-described step, since the adhesive layer is mainly formed of an epoxy resin, a curing agent therefor, and an acrylic elastomer, the adhesive layer may exhibit thermosetting and adhesive properties. The second cutting step involves a step of etching the adhesive layer with an etchant that does not dissolve the conductor layer and the base layer but dissolves the epoxy resin and the curing agent therefor. Therefore, the adhesive layer can be cut by etching while the conductor layer and the base layer are prevented from being dissolved in the etchant.
According to one aspect of the present invention, the etchant may contain, as a component for dissolving the epoxy resin, the curing agent therefor, and the acrylic elastomer, at least one species selected from the group consisting of organic solvents and organic bases.
According to one aspect of the present invention, the second cutting step may include a step of cutting the insulating layer and the adhesive layer into the predetermined shape through etching by using, as a mask, the conductor layer cut into the predetermined shape by the first cutting step. Since the insulating layer and the adhesive layer are etched into the predetermined shape by using, as a mask, the conductor layer cut into the predetermined shape, a step of forming a mask for etching of the insulating layer and the adhesive layer can be omitted.
Another aspect of the present invention provides a method for producing a coil characterized by use of the coil sheet production method according to any one of the above-discussed aspects.
An embodiment of the present invention will be described with reference to the drawings. The present embodiment embodies a cooling structure for a coil used in in an electromagnetic actuator. The electromagnetic actuator (e.g., a solenoid valve) may include the cooling structure of the coil according to the present embodiment.
As illustrated in
The body 20 is, for example, a body or housing of an electromagnetic actuator. The body 20 is formed of, for example, stainless steel or aluminum and has a plate-like (rectangular parallelepiped) shape.
The coil 30 includes a cylindrical winding 31 formed by winding a strip-like copper foil (conductor) around the circular columnar stationary iron core 38 a plurality of times. The circular columnar stationary iron core 38 is formed of a ferromagnet, such as iron. The axial lower end (first end) of the coil 30 is bonded to the body 20 with an adhesive 45. The adhesive 45 is, for example, an epoxy adhesive. The axis of the stationary iron core 38 and the axis of the coil 30 correspond to a specific axis.
The cooling plate 41 is attached to the axial upper end (second end) of the coil 30 through an alumina layer 39 and an adhesive 40. The structures of the alumina layer 39 and the adhesive 40 and attachment of the cooling plate 41 will be described below.
The cooling plate 41 is mainly formed of alumina. The cooling plate 41 includes therein a flow passage 41a for cooling water (cooling medium). The flow passage 41a extends in an in-plane direction of the cooling plate 41. Cooling water flows through the flow passage 41a.
In the aforementioned configuration, when electric current flows through the coil 30, a magnetic flux is generated at the stationary iron core 38. The generated magnetic flux moves a movable part (e.g., a valve) of the electromagnetic actuator. When electric current flows through the coil 30, the winding 31 generates heat. The heat generated through energization of the strip-like copper foil forming the winding 31 is efficiently transferred in the width direction of the copper foil; i.e., in the axial direction of the winding 31 (coil 30) (vertical direction in
The heat from the winding 31 is also transferred through the axial lower end surface of the winding 31 to the body 20 via the adhesive 45. A portion of the heat from the winding 31 is transferred through the inner wall surface of the winding 31 and the stationary iron core 38 to the body 20 and the cooling plate 41. The heat transferred to the body 20 is then transferred to another member or released to air.
Next will be described a method for producing a coil sheet used for the production of the coil 30.
Step 1 involves the pretreatment (wet blasting) of the surface of a copper foil 32 (conductor layer) for disposing an insulating layer 33 on the upper surface (one surface) of the copper foil 32. The surface of the copper foil 32 is somewhat roughened by wet blasting (roughening treatment) with a liquid such as an acid. This treatment can improve the adhesion between the copper foil 32 and the insulating layer 33. Both surfaces of the copper foil 32 are subjected to wet blasting.
Step 2 involves the formation of the insulating layer 33 (organic insulating layer) on the upper surface of the copper foil 32. Specifically, a composition solution for forming the insulating layer 33 is applied to the upper surface of the copper foil 32. The composition solution is preferably an alkoxy-containing silane-modified polyimide prepared through reaction between polyamic acid and/or polyimide and partially condensed alkoxysilane (refer to, for example, Japanese Patent Application Laid-Open (kokai) No. 2003-200527). The alkoxy-containing silane-modified polyimide is a polyimide-silica hybrid material and is prepared by dissolving, in an organic solvent, a polymer prepared through chemical bonding between polyamic acid (polyimide precursor) and an alkoxysilane compound. Subsequently, the organic solvent is removed from the applied solution by drying, and the solidified component is cured by heating. Thus, polyamic acid is converted into polyimide through ring-closing reaction, and the alkoxysilane compound is converted into silica through curing. The insulating layer 33 (cured film) is formed through dispersion of silica nanoparticles and chemical bonding (crosslinking) between polyimide and silica. That is, the insulating layer 33 is formed of a polyimide-silica hybrid. The copper foil 32 has a linear expansion coefficient (thermal expansion coefficient) approximately equal to that of the insulating layer 33. Specifically, the copper foil 32 (copper) has a linear expansion coefficient of 17 ppm/° C. (μm/° C./m), and the insulating layer 33 has a linear expansion coefficient of 10 to 24 ppm/° C.
Step 3 involves the formation of a thermosetting, uncured adhesive layer 34 on the upper surface of the insulating layer 33 (i.e., the surface of the insulating layer 33 opposite the copper foil 32). Specifically, a composition solution for forming the adhesive layer 34 is applied to the upper surface of the insulating layer 33. The composition solution is preferably a solution of an epoxy resin, a curing agent therefor, and an acrylic elastomer in an organic solvent (refer to, for example, Japanese Patent Application Laid-Open (kokai) No. H10-335768 and 2005-179408). Subsequently, the organic solvent is removed from the applied solution by drying, thereby solidifying the epoxy resin and the curing agent therefor. Thus, the adhesive layer 34 is in a B-stage state; i.e., the adhesive layer has not yet been fully cured, but has been apparently solidified; for example, the adhesive layer has been semi-cured, or the solvent has been evaporated from the layer.
Step 4 involves the attachment of a cover film 35 (base layer) on the upper surface of the adhesive layer 34 (i.e., the surface of the adhesive layer 34 opposite the insulating layer 33) at a temperature lower than the temperature at which the adhesive layer 34 is thermally cured. The cover film 35 is formed of polyethylene terephthalate (PET). Specifically, the adhesive layer 34, which is in a B-stage state, exhibits a specific tackiness (adhesive force). Thus, the cover film 35 is bonded to the upper surface of the adhesive layer 34 by bringing the cover film 35 into close contact with the upper surface of the adhesive layer 34. That is, the cover film 35 is bonded to the insulating layer 33 with the adhesive layer 34. As described above, as a result of performance of steps 1 to 4, there is prepared an initial sheet 37a (coil sheet) including the copper foil 32, the insulating layer 33, the adhesive layer 34, and the cover film 35 stacked in this order. The copper foil 32, the insulating layer 33, and the adhesive layer 34 of the initial sheet 37a (i.e., other than the cover film 35) will be collectively referred to as a “laminate sheet 36.”
Step 5 involves the formation of a mask M on the surface of the copper foil 32 (i.e., the surface of the copper foil 32 opposite the insulating layer 33) for cutting the copper foil 32 into a predetermined shape. The mask M is formed through, for example, attachment of a resist film on the copper foil 32 and subsequent exposure and development of the film performed such that the mask M has a predetermined shape. Alternatively, the mask M having a predetermined shape may be formed by use of a resist solution through, for example, screen printing.
Step 6 involves the etching of the copper foil 32 with an etchant, such as an acid. Through this step, a portion of the copper foil 32 that is not covered with the mask M is dissolved, so that the copper foil 32 is cut into a predetermined shape. As a result, copper foil patterns 32a each having a predetermined shape are formed. At that time, the insulating layer 33, the adhesive layer 34, and the cover film 35 are not etched with the etchant for the copper foil 32. Steps 5 and 6 correspond to a first cutting step.
Step 7 involves the removal of the mask M. Specifically, the mask M formed of the resist is removed with a solution for peeling (dissolving) the mask M. At that time, the insulating layer 33, the adhesive layer 34, and the cover film 35 are not dissolved in the peeling solution for the mask M. The insulating layer 33 and the adhesive layer 34 may be slightly dissolved in the peeling solution for the mask M.
Step 8 involves the cutting of the insulating layer 33 into a predetermined shape through etching performed by using the copper foil 32 cut into the predetermined shape (copper foil patterns 32a) as a mask. As a result, insulating layer patterns 33a each having a predetermined shape are formed. Specifically, the insulating layer 33 is etched with an etchant that does not dissolve the copper foil 32 or the cover film 35 but dissolves polyimide (refer to, for example, Japanese Patent Application Laid-Open (kokai) No. 2001-305750). Specifically, the etchant for the insulating layer 33 is an aqueous alkaline solution containing both organic and inorganic bases. The adhesive layer 34 may be slightly dissolved in the etchant for the insulating layer 33.
Step 9 involves the cutting of the adhesive layer 34 into a predetermined shape through etching performed by using the copper foil 32 cut into the predetermined pattern (copper foil patterns 32a) as a mask. As a result, adhesive layer patterns 34a each having a predetermined shape are formed. Specifically, the adhesive layer 34 is etched with an etchant that does not dissolve the copper foil 32 or the cover film 35 but dissolves the epoxy resin and the curing agent therefor. The etchant for the adhesive layer 34 contains a component for dissolving the epoxy resin and the curing agent therefor; specifically, at least one species selected from the group consisting of organic solvents and organic bases. Steps 8 and 9 are carried out at a temperature lower than the temperature at which the adhesive layer 34 is thermally cured. Steps 8 and 9 correspond to a second cutting step.
Step 10 involves the washing of the resultant coil sheet 37 with, for example, pure water for removing the remaining etchant. Thus, a plurality of laminate sheet patterns 36a each having a predetermined shape are formed on one surface of the cover film 35.
Next will be described a step of forming a winding 31 of the laminate sheet pattern 36a (laminate sheet 36) by use of the coil sheet roll 37A (coil sheet 37) with reference to
The roll core 51A of the coil sheet roll 37A is attached to a first rotary shaft, and a winding roll core 51B is attached to a second rotary shaft. The stationary iron core 38 of the coil 30 is attached to a third rotary shaft. A tension roller TR for applying a specific tension to the sheet is disposed between the first rotary shaft and the third rotary shaft. In place of the stationary iron core 38, a core for forming a winding may be attached to the third rotary shaft.
While the first rotary shaft is rotated clockwise, one laminate sheet pattern 36a is released from the cover film 35 of the coil sheet roll 37A (releasing step). Specifically, the adhesive layer pattern 34a of the laminate sheet pattern 36a is released from the cover film 35. Since the thermosetting adhesive layer pattern 34a is in a B-stage state, the cover film 35 does not strongly adhere to the adhesive layer pattern 34a; i.e., the releasability between the cover film 35 and the adhesive layer pattern 34a can be maintained.
In parallel with the aforementioned releasing step, the released laminate sheet pattern 36a is wound around the stationary iron core 38 while the third rotary shaft is rotated clockwise (winding forming step). Specifically, the laminate sheet pattern 36a, which includes the copper foil pattern 32a, the insulating layer pattern 33a, and the adhesive layer pattern 34a, is wound around the axis (specific axis) of the stationary iron core 38 a plurality of times, thereby forming a winding 31. During this step, a specific tension is applied to the laminate sheet pattern 36a by means of the tension roller TR. End portions, in the width direction, of the laminate sheet pattern 36a are detected by a sensor S. On the basis of the results of detection of the end portions by the sensor S, the axial position of the third rotary shaft (the stationary iron core 38 or winding core) is adjusted so as to prevent the misalignment between end portions of radially adjacent portions of the laminate sheet pattern in the axial direction of the stationary iron core 38. Thus, in the laminate sheet pattern 36a wound around the stationary iron core 38 a plurality of times, the amount of misalignment between end portions of radially adjacent portions of the laminate sheet pattern 36a in the axial direction of the stationary iron core 38 is adjusted to 2% or less the width of the laminate sheet pattern 36a.
In the winding 31, the laminate sheet pattern 36a is wound such that portions of the laminate sheet pattern 36a are overlaid in the radial direction of the winding 31. Therefore, the copper foil pattern 32a of one of two portions of the laminate sheet pattern 36a located adjacent to each other in the radial direction of the winding 31 adheres to the adhesive layer pattern 34a of the other of the two portions. Thus, the portions of the laminate sheet pattern 36a located adjacent to each other in the radial direction of the winding 31 are bonded together by the adhesive force of the adhesive layer pattern 34a.
In parallel with the aforementioned releasing step and winding forming step, the coil sheet 37 from which one laminate sheet pattern 36a has been released is rewound around a roll core 51B while the second rotary shaft is rotated clockwise (rewinding step), thereby preparing a coil sheet roll 37B.
One laminate sheet pattern 36a is released from the coil sheet roll 37A and wound around the stationary iron core 38 until the end of the pattern, thereby completing the winding 31. Thereafter, the coil sheet roll 37A is exchanged with the coil sheet roll 37B, and a new stationary iron core 38 is attached to the third rotary shaft. The aforementioned steps are then repeated until all the six laminate sheet patterns 36a of the coil sheet 37 are consumed, thereby producing six windings 31. Instead of exchanging the coil sheet roll 37A with the coil sheet roll 37B, the coil sheet roll 37A and the coil sheet roll 37B may be rotated counterclockwise, and one laminate sheet pattern 36a may be released from the cover film 35 of the coil sheet roll 37B and wound around the stationary iron core 38.
Next will be described a step of thermally curing the thermosetting adhesive layer pattern 34a of the winding 31 with reference to
In the winding 31 formed through the steps illustrated in
Next will be described, with reference to
At the axial end surface (in the vertical direction of
Subsequently, an adhesive 40 is applied to the surface of the alumina layer 39 to have a specific thickness, and a cooling plate 41 is bonded to the alumina layer 39. The surface of the cooling plate 41 is also finished to have a specific smoothness. The adhesive 40 is electrically insulating and formed mainly of a heat-resistant resin. The adhesive 40 contains a silicone resin as a main component and has a thickness of about 10 μm.
An adhesive containing a silicone resin as a main component may generate low-molecular-weight siloxane through heating. Low-molecular-weight siloxane is composed of about 3 to 20 siloxane monomers. Low-molecular-weight siloxane may cause poor electrical conduction in an electrically conductive part or fogging in an optical system. The method described in, for example, Japanese Patent Application Laid-Open (kokai) No. H07-330905 is preferably used for reducing the amount of low-molecular-weight siloxane. The aforementioned problems can be avoided by adjusting the total amount of low-molecular-weight siloxane contained in the adhesive 40 to 50 ppm or less.
The comparison between the graphs of
Thus, a reduction in thickness of the adhesive 40 can prevent an increase in temperature of the coil 30. However, during energization of the coil 30, the temperature of the copper foil pattern 32a increases, leading to thermal expansion thereof. Accordingly, the alumina layer 39 also thermally expands through transfer of heat from the copper foil pattern 32a. Since the cooling plate 41 is cooled by cooling water, an increase in temperature of the cooling plate 41 is suppressed as compared with the alumina layer 39, resulting in reduced thermal expansion of the cooling plate 41. This causes a difference in thermal expansion between the alumina layer 39 and the cooling plate 41, leading to occurrence of thermal stress in the alumina layer 39 and the cooling plate 41.
Since the copper foil pattern 32a has a linear expansion coefficient (thermal expansion coefficient) approximately equal to that of the insulating layer pattern 33a, a difference in expansion can be reduced between the copper foil pattern 32a and the insulating layer pattern 33a even if the copper foil pattern 32a and the insulating layer pattern 33a thermally expand during energization of the coil 30.
Since the adhesive 40 contains a silicone resin as a main component and exhibits elasticity, the adhesive 40 is elastically deformed depending on the difference in thermal expansion between the alumina layer 39 and the cooling plate 41. If the thickness of the adhesive 40 is excessively small, the elastic deformation of the adhesive 40 may fail to follow the difference in thermal expansion during energization of the copper foil pattern 32a, resulting in separation of the adhesive 40 from the alumina layer 39 or the cooling plate 41. In the present embodiment, the adhesive 40 is formed to have such a thickness that the adhesive 40 does not separate from the alumina layer 39 or the cooling plate 41 through elastic deformation during energization of the copper foil pattern 32a and exhibits thermal resistance lower than a specific value. Specifically, according to the experiments performed by the present inventors, the thickness of the adhesive 40 is preferably more than 5 μm and less than 30 μm, most preferably 10 μm.
Advantages
The present embodiment described above in detail has the following advantages.
The above-described embodiments can be modified as follows.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014-250816 | Dec 2014 | JP | national |
This application is a Continuation of International Patent Application No. PCT/JP2015/084694, filed on Dec. 10, 2015, which claims priority to Japanese Patent Application No. 2014-250816, filed on Dec. 11, 2014, each of which is hereby incorporated by reference.
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| Number | Date | Country | |
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| Parent | PCT/JP2015/084694 | Dec 2015 | US |
| Child | 15619268 | US |
