TREA

Insulating between turns or between winding layers

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  • H01F41/122
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HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

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H01F41/122Insulating between turns or between winding layers
Industries

Patents Grantslast 30 patents

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    Dual-mode wireless charging device
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    Coil component
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    • Issue date Jun 3, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ji Young Park
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  • Information Patent Grant

    Method of manufacturing an embedded magnetic component device
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    • Scott Andrew Parish
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    Multilayer resin substrate and method of manufacturing multilayer r...
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    Method for producing a spiral-shaped body with a compressed spiral
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    • Cyntec Co., Ltd.
    • Yi-Cheng Lin
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    Coil component
    • Patent number 12,230,431
    • Issue date Feb 18, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
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    Electronic component
    • Patent number 12,224,104
    • Issue date Feb 11, 2025
    • TDK Corporation
    • Shinichi Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,745
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
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    Magnetic coupling coil component
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    • Issue date Jan 21, 2025
    • Taiyo Yuden Co., Ltd.
    • Akihisa Matsuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,747
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Kang Wook Bong
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  • Information Patent Grant

    Multilayer coil component
    • Patent number 12,159,750
    • Issue date Dec 3, 2024
    • Murata Manufacturing Co., Ltd.
    • Ryouji Mizobata
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    Method of fabrication of composite monolithic structures
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    Method for manufacturing a passive electronic component
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    • Issue date Oct 15, 2024
    • Taiyo Yuden Co., Ltd.
    • Ryuichi Kondo
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  • Information Patent Grant

    Coil component
    • Patent number 12,106,885
    • Issue date Oct 1, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Mo Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,057,253
    • Issue date Aug 6, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Do Young Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and its manufacturing method
    • Patent number 12,051,531
    • Issue date Jul 30, 2024
    • TDK Corporation
    • Nobuya Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS
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    • Kota Nomura
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    Electrically insulated electric conductor strip, in particular for...
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    • ALANOD GmbH & Co. KG
    • Stefan Ziegler
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    Inductor component
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    Electronic component
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    • Issue date Mar 26, 2024
    • Murata Manufacturing Co., Ltd.
    • Masayuki Yoneda
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  • Information Patent Grant

    Coil component
    • Patent number 11,942,264
    • Issue date Mar 26, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
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    2D and 3D inductors fabricating photoactive substrates
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    • 3D GLASS SOLUTIONS, INC.
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  • Information Patent Grant

    Method of manufacturing an embedded magnetic component device
    • Patent number 11,894,176
    • Issue date Feb 6, 2024
    • Murata Manufacturing Co., Ltd.
    • Scott Andrew Parish
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  • Information Patent Grant

    Coil component
    • Patent number 11,881,345
    • Issue date Jan 23, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Gun Woo Koo
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  • Information Patent Grant

    Coil component
    • Patent number 11,837,388
    • Issue date Dec 5, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Byung Soo Kang
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    Coil electronic component
    • Patent number 11,830,653
    • Issue date Nov 28, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
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  • Information Patent Grant

    Coil electronic component
    • Patent number 11,830,660
    • Issue date Nov 28, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Hyung Sang Jeon
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Patents Applicationslast 30 patents