Claims
- 1. A process for metallizing a non-conductor substrate by electroless metal deposition comprising the steps of:
- (1) contacting said substrate with a colloidal composition, wherein said colloidal composition comprises colloidal copper-stannic oxide product derived from the redox reaction between copper ions and stannous ions in an alkaline pH, and
- (2) contacting the treated substrate with a compatible electroless plating bath.
- 2. The process according to claim 1 wherein said electroless metal deposition is copper.
- 3. The process according to claim 1 wherein said copper ions are copper(II) ions.
- 4. The process according to claim 1 wherein said colloidal composition further contains tin(IV) resulting from said redox reaction.
- 5. The process according to claim 1 wherein said substrate is ABS.
- 6. The process according to claim 1 wherein said substrate is for a printed circuitry array.
- 7. The process according to claim 6 wherein said substrate contains through-holes to be metallized.
- 8. The process according to claim 1 wherein said substrate is etched prior to the step of contacting said substrate with said colloidal dispersion.
- 9. The process according to claim 1 further containing the step of activation and wherein said activation step takes place prior to the step of electroless plating however subsequent to the step of contacting said substrate with said colloidal dispersion.
- 10. The process according to claim 1 wherein said colloidal dispersion is aqueous based.
- 11. The process according to claim 1 wherein said copper ions are heated above room temperature.
Parent Case Info
This application is a division of application Ser. No. 938,890 filed Aug. 31, 1978 now U.S. Pat. No. 4,265, 942 which is a continuation-in-part of U.S. application Ser. No. 672,044 filed Mar. 30, 1976 now abandoned which is a division of application Ser. No. 607,506 filed Aug. 26, 1975 now U.S. Pat. No. 3,993,799 which is a continuation-in-part of application Ser. No. 512,224 filed Oct. 4, 1974 now abandoned.
US Referenced Citations (3)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1426462 |
Feb 1976 |
GBX |
Non-Patent Literature Citations (1)
Entry |
Weiser, "Inorganic Colloid Chemistry", vol. 1, pp. 1-5, 137-143, John Wiley & Sons, .COPYRGT.1933. |
Divisions (2)
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Number |
Date |
Country |
Parent |
938890 |
Aug 1978 |
|
Parent |
607506 |
Aug 1975 |
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Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
672044 |
Mar 1976 |
|
Parent |
512224 |
Oct 1974 |
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