Inorganic insulating substrates

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CPC
H05K1/0306

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0306Inorganic insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal component and ceramic substrate
- Patent number 12,207,400
- Issue date Jan 21, 2025
- Shinko Electric Industries Co., Ltd.
- Ayako Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,200,859
- Issue date Jan 14, 2025
- TOPPAN INC.
- Jun Onohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and manufacturing method thereof
- Patent number 12,199,027
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metallization for through-glass vias on thin glass
- Patent number 12,200,875
- Issue date Jan 14, 2025
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back solid state lighting devices and associated methods
- Patent number 12,191,298
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin laminated glass assembly with electric circuitry
- Patent number 12,185,460
- Issue date Dec 31, 2024
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Foldable cover and display for an electronic device
- Patent number 12,174,671
- Issue date Dec 24, 2024
- Apple Inc.
- Christopher D. Jones
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Support substrate and method for producing a support substrate
- Patent number 12,177,970
- Issue date Dec 24, 2024
- Rogers Germany GmbH
- Tilo Welker
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package, electronic device, and electr...
- Patent number 12,177,983
- Issue date Dec 24, 2024
- Kyocera Corporation
- Yoshitomo Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded body, ceramic copper circuit board, method for manufacturing...
- Patent number 12,160,959
- Issue date Dec 3, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
ESD protection of chip scale package LEDS
- Patent number 12,140,297
- Issue date Nov 12, 2024
- SIGNIFY HOLDING, B.V.
- Christian Tenhumberg
- F21 - LIGHTING
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable mounting substrate
- Patent number 12,127,339
- Issue date Oct 22, 2024
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body, ceramic copper circuit substrate, and semiconductor de...
- Patent number 12,115,603
- Issue date Oct 15, 2024
- Kabushiki Kaisha Toshiba
- Maki Yonetsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-roughened electrodeposited copper foil and copper clad laminate
- Patent number 12,120,816
- Issue date Oct 15, 2024
- CO-TECH DEVELOPMENT CORP.
- Yun-Hsing Sung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, method for manufacturing substrate, and electronic device
- Patent number 12,114,433
- Issue date Oct 8, 2024
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Hiroshi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive vias and methods for producing same
- Patent number 12,100,647
- Issue date Sep 24, 2024
- Samtec, Inc.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING SAME
- Publication number 20250040047
- Publication date Jan 30, 2025
- Kyocera Corporation
- Masashi OHMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
- Publication number 20250031319
- Publication date Jan 23, 2025
- Panasonic Holdings Corporation
- HIROKI KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250031304
- Publication date Jan 23, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Min AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME
- Publication number 20250014983
- Publication date Jan 9, 2025
- SAMTEC, INC.
- Alan D. Nolet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...
- Publication number 20250016919
- Publication date Jan 9, 2025
- Mitsubishi Electric Corporation
- Motoki MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250008659
- Publication date Jan 2, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20250008660
- Publication date Jan 2, 2025
- KYOCERA CORPORATION
- Yoshio KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
- Publication number 20240431027
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240431023
- Publication date Dec 26, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413072
- Publication date Dec 12, 2024
- Dyi-Chung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CLOTH, PREPREG AND PRINTED WIRING BOARD
- Publication number 20240414840
- Publication date Dec 12, 2024
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
DEVICE COMPRISING A LOW DIELECTRIC LOSS BOROSILICATE GLASS SUBSTRAT...
- Publication number 20240400438
- Publication date Dec 5, 2024
- The Penn State Research Foundation
- Michael T. Lanagan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICA GLASS SUBSTRATE
- Publication number 20240407089
- Publication date Dec 5, 2024
- AGC Inc.
- Kent SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
- Publication number 20240407096
- Publication date Dec 5, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Ihab KHOURY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240407099
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
- Publication number 20240407107
- Publication date Dec 5, 2024
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240365467
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILANOL-BASED COMPOSITE COMPOSITION
- Publication number 20240351950
- Publication date Oct 24, 2024
- ROBERT BOSCH GmbH
- Stefan Henneck
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Inorganic insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Glass carrier having protection structure and manufacturing method...

Metal component and ceramic substrate

Beveled overburden for vias and method of making the same

Circuit board

Substrate and manufacturing method thereof

Copper metallization for through-glass vias on thin glass

Substrate for mounting electronic element, electronic device, and e...

Silicon nitride sintered body, silicon nitride substrate, and silic...

Back-to-back solid state lighting devices and associated methods

Ultra-thin laminated glass assembly with electric circuitry

Foldable cover and display for an electronic device

Support substrate and method for producing a support substrate

High powered RF part for improved manufacturability

Electronic component housing package, electronic device, and electr...

Method for manufacturing a ceramic copper circuit board

Printed circuit board

Bonded body, ceramic copper circuit board, method for manufacturing...

Camera module having a soldering portion coupling a driving device...

ESD protection of chip scale package LEDS

Hermetic metallized via with improved reliability

Circuit board and method for producing circuit board

Stretchable mounting substrate

Copper/ceramic joined body and insulating circuit substrate

Bonded body, ceramic copper circuit substrate, and semiconductor de...

Micro-roughened electrodeposited copper foil and copper clad laminate

Multi-dielectric printed circuit board

Substrate, method for manufacturing substrate, and electronic device

Ceramic-copper composite, ceramic circuit board, power module, and...

Multi-layer printed circuit board made of different materials and m...

Electrically conductive vias and methods for producing same

Patents Applicationslast 30 patents

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

Metal-ceramic substrate and method for producing a metal ceramic su...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

WIRING SUBSTRATE

CAMERA MODULE

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

WIRING BOARD AND MOUNTING STRUCTURE USING SAME

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER

ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME

MAGNETIC CERAMIC SUBSTRATE, SUBSTRATE MANUFACTURING METHOD, AND CIR...

PRINTED CIRCUIT BOARD

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

SUBSTRATE AND MANUFACTURING METHOD THEREOF

GLASS CLOTH, PREPREG AND PRINTED WIRING BOARD

DEVICE COMPRISING A LOW DIELECTRIC LOSS BOROSILICATE GLASS SUBSTRAT...

SILICA GLASS SUBSTRATE

ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...

CIRCUIT BOARD

WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

SILANOL-BASED COMPOSITE COMPOSITION