TREA

Inorganic insulating substrates

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  • H05K1/0306
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0306Inorganic insulating substrates
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
    • Publication number 20240431027
    • Publication date Dec 26, 2024
    • TOPPAN Holdings Inc.
    • Yuki UMEMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240431023
    • Publication date Dec 26, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Ho JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240422901
    • Publication date Dec 19, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Heun LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240413072
    • Publication date Dec 12, 2024
    • Dyi-Chung HU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    GLASS CLOTH, PREPREG AND PRINTED WIRING BOARD
    • Publication number 20240414840
    • Publication date Dec 12, 2024
    • Asahi Kasei Kabushiki Kaisha
    • Amane HIROSE
    • D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
  • Information Patent Application

    DEVICE COMPRISING A LOW DIELECTRIC LOSS BOROSILICATE GLASS SUBSTRAT...
    • Publication number 20240400438
    • Publication date Dec 5, 2024
    • The Penn State Research Foundation
    • Michael T. Lanagan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SILICA GLASS SUBSTRATE
    • Publication number 20240407089
    • Publication date Dec 5, 2024
    • AGC Inc.
    • Kent SUGA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC SUB-ASSEMBLY INCLUDING CERAMIC SUBSTRATE WITH CONDUCTIVE...
    • Publication number 20240407096
    • Publication date Dec 5, 2024
    • MELLANOX TECHNOLOGIES, LTD.
    • Ihab KHOURY
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
    • Publication number 20240407099
    • Publication date Dec 5, 2024
    • Amkor Technology Singapore Holding Pte. Ltd.
    • Sang Hyun Jin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
    • Publication number 20240407107
    • Publication date Dec 5, 2024
    • Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
    • Karolis RATAUTAS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240387344
    • Publication date Nov 21, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
    • Publication number 20240365467
    • Publication date Oct 31, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SILANOL-BASED COMPOSITE COMPOSITION
    • Publication number 20240351950
    • Publication date Oct 24, 2024
    • ROBERT BOSCH GmbH
    • Stefan Henneck
    • C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD THEREFOR
    • Publication number 20240357739
    • Publication date Oct 24, 2024
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL AND COPPER CLAD LAMINATE
    • Publication number 20240357740
    • Publication date Oct 24, 2024
    • CO-TECH DEVELOPMENT CORP.
    • Yun-Hsing SUNG
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    METHOD OF PRODUCING PLATING DEPOSIT
    • Publication number 20240351943
    • Publication date Oct 24, 2024
    • C. Uyemura & Co., Ltd.
    • Takuya Komeda
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
    • Publication number 20240357748
    • Publication date Oct 24, 2024
    • Unimicron Technology Corp.
    • Jeng-Ting LI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
    • Publication number 20240349427
    • Publication date Oct 17, 2024
    • TOPPAN Holdings Inc.
    • Takehisa TAKADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341034
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGES HAVING ELECTRICAL AND OPTICAL CONNECTIV...
    • Publication number 20240319458
    • Publication date Sep 26, 2024
    • Corning Incorporated
    • Lars Martin Otfried Brusberg
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MA...
    • Publication number 20240324105
    • Publication date Sep 26, 2024
    • Kabushiki Kaisha Toshiba
    • Kentaro IWAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carriers Connected by Staggered Interconnect Elements
    • Publication number 20240314931
    • Publication date Sep 19, 2024
    • AT&S Austria Technologie & Systemtechnik AG
    • Abderrazzaq IFIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
    • Publication number 20240306298
    • Publication date Sep 12, 2024
    • Unimicron Technology Corp.
    • Tzyy-Jang TSENG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306299
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240306292
    • Publication date Sep 12, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kyehwan Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306296
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240298406
    • Publication date Sep 5, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT CARRIER BOARD
    • Publication number 20240292517
    • Publication date Aug 29, 2024
    • ASIA PACIFIC MICROSYSTEMS, INC.
    • Jer-Wei HSIEH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR