Inorganic insulating substrates

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CPC
H05K1/0306

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0306Inorganic insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 12,273,995
- Issue date Apr 8, 2025
- AMOSENSE CO., LTD.
- Taejung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate module with filter function
- Patent number 12,273,994
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Noriaki Okuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, laminate, and production methods therefor, as well as prin...
- Patent number 12,256,490
- Issue date Mar 18, 2025
- Resonac Corporation
- Mari Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded substrate and bonded substrate manufacturing method
- Patent number 12,249,547
- Issue date Mar 11, 2025
- NGK Insulators, Ltd.
- Takashi Ebigase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency electronic component and module
- Patent number 12,245,365
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi Oie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with bridge chiplets
- Patent number 12,238,872
- Issue date Feb 25, 2025
- Advanced Micro Devices, Inc.
- Robert N. McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carriers connected by staggered interconnect elements
- Patent number 12,232,263
- Issue date Feb 18, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,232,255
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor vehicle lighting module comprising a ceramic substrate
- Patent number 12,225,662
- Issue date Feb 11, 2025
- Valeo Vision
- Alexandre Val
- F21 - LIGHTING
Information Patent Grant
Electronic component and method for producing electronic component
- Patent number 12,224,097
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Kouhei Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal component and ceramic substrate
- Patent number 12,207,400
- Issue date Jan 21, 2025
- Shinko Electric Industries Co., Ltd.
- Ayako Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,200,859
- Issue date Jan 14, 2025
- TOPPAN INC.
- Jun Onohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and manufacturing method thereof
- Patent number 12,199,027
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper metallization for through-glass vias on thin glass
- Patent number 12,200,875
- Issue date Jan 14, 2025
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for mounting electronic element, electronic device, and e...
- Patent number 12,193,145
- Issue date Jan 7, 2025
- Kyocera Corporation
- Yukio Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon nitride sintered body, silicon nitride substrate, and silic...
- Patent number 12,187,651
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Katsuyuki Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-to-back solid state lighting devices and associated methods
- Patent number 12,191,298
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Cem Basceri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin laminated glass assembly with electric circuitry
- Patent number 12,185,460
- Issue date Dec 31, 2024
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Foldable cover and display for an electronic device
- Patent number 12,174,671
- Issue date Dec 24, 2024
- Apple Inc.
- Christopher D. Jones
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Support substrate and method for producing a support substrate
- Patent number 12,177,970
- Issue date Dec 24, 2024
- Rogers Germany GmbH
- Tilo Welker
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing package, electronic device, and electr...
- Patent number 12,177,983
- Issue date Dec 24, 2024
- Kyocera Corporation
- Yoshitomo Onitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a ceramic copper circuit board
- Patent number 12,167,534
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE
- Publication number 20250110529
- Publication date Apr 3, 2025
- Apple Inc.
- Christopher D. Jones
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...
- Publication number 20250113439
- Publication date Apr 3, 2025
- Kabushiki Kaisha Toshiba
- Yukihisa MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC P...
- Publication number 20250109057
- Publication date Apr 3, 2025
- FULLTECH FIBER GLASS CORP.
- Hsien-Chung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250109530
- Publication date Apr 3, 2025
- NITTO BOSEKI CO., LTD.
- Hiroyuki KAWANISHI
- D03 - WEAVING
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...
- Publication number 20250112144
- Publication date Apr 3, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOTWIN LINER FOR THROUGH GLASS VIAS
- Publication number 20250106982
- Publication date Mar 27, 2025
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES
- Publication number 20250105132
- Publication date Mar 27, 2025
- Intel Corporation
- Pratyush MISHRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
- Publication number 20250098065
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Sachiko FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20250089160
- Publication date Mar 13, 2025
- Murata Manufacturing Co., Ltd.
- Tomoki YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY
- Publication number 20250089161
- Publication date Mar 13, 2025
- Fuyao Glass America Inc.
- Yue Shao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250089165
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Hun NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081340
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250071902
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250063671
- Publication date Feb 20, 2025
- LX Semicon Co., Ltd.
- Nam Tae CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...
- Publication number 20250056719
- Publication date Feb 13, 2025
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...
- Publication number 20250048563
- Publication date Feb 6, 2025
- Kabushiki Kaisha Toshiba
- Maki YONETSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250046694
- Publication date Feb 6, 2025
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING SAME
- Publication number 20250040047
- Publication date Jan 30, 2025
- Kyocera Corporation
- Masashi OHMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
- Publication number 20250031319
- Publication date Jan 23, 2025
- Panasonic Holdings Corporation
- HIROKI KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Inorganic insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module

Multilayer substrate module with filter function

Electronic component and manufacturing method thereof

Prepreg, laminate, and production methods therefor, as well as prin...

Substrate structure and cutting method thereof

Bonded substrate and bonded substrate manufacturing method

High-frequency electronic component and module

Connection structure and method of forming the same

Circuit board with bridge chiplets

Circuit board and method for manufacturing the same

Component carriers connected by staggered interconnect elements

Circuit board

Motor vehicle lighting module comprising a ceramic substrate

Electronic component and method for producing electronic component

Glass carrier having protection structure and manufacturing method...

Metal component and ceramic substrate

Beveled overburden for vias and method of making the same

Circuit board

Substrate and manufacturing method thereof

Copper metallization for through-glass vias on thin glass

Substrate for mounting electronic element, electronic device, and e...

Silicon nitride sintered body, silicon nitride substrate, and silic...

Back-to-back solid state lighting devices and associated methods

Ultra-thin laminated glass assembly with electric circuitry

Foldable cover and display for an electronic device

Support substrate and method for producing a support substrate

High powered RF part for improved manufacturability

Electronic component housing package, electronic device, and electr...

Method for manufacturing a ceramic copper circuit board

Printed circuit board

Patents Applicationslast 30 patents

FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE

CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, MET...

GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC P...

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL IS...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

NANOTWIN LINER FOR THROUGH GLASS VIAS

POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

MULTILAYER SUBSTRATE

LOW STRESS THROUGH GLASS VIAS (TGVS)

ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

METHOD FOR MANUFACTURING CIRCUIT BOARD

CERAMIC SUBSTRATE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, WIRI...

BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING...

Metal-ceramic substrate and method for producing a metal ceramic su...

WIRING SUBSTRATE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

WIRING BOARD AND MOUNTING STRUCTURE USING SAME

CAMERA MODULE

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE