Claims
- 1. A colloidal composition useful in the metallization of an electrically non-conductive substrate wherein said colloidal composition is the reaction product resulting from the admixture in a liquid medium comprising at least one primary metal and at least one secondary metal, said metals being in positive oxidation states, and wherein said primary metal is selected from the group consisting of copper, nickel, iron, and cobalt and mixtures thereof and wherein said secondary metal is selected from the group consisting of aluminum, gallium, indium, germanium, lead, antimony, bismuth, chromium, tin, thallium, and mixtures thereof, and further wherein said primary metal and said secondary metal in said resultant colloidal composition are in a reduced oxidation state derived through the chemical reduction in the admixture of both the primary and secondary metals both metals having been initially introduced in a higher oxidation state than their oxidation states in the resultant colloidal composition.
- 2. A method for improving the stability of a colloidal dispersion comprising a primary metal selected from the group consisting of copper, nickel, cobalt, and iron including the step comprising of the admixing of a secondary metal selected from the group consisting of aluminum, gallium, indium, germanium, lead, antimony, bismuth, chromium, tin, thallium, and mixtures thereof, and further wherein said primary metal and said secondary metal in said resultant colloidal composition are in a reduced oxidation state derived through the chemical reduction in the admixture of both the primary and secondary metals, both metals having been initially introduced in a higher oxidation state than their oxidation states in the resultant colloidal dispersion.
REFERENCE TO PRIOR APPLICATIONS
This application is a continuation of Ser. No. 07/171,333, filed Mar. 21, 1988, abandoned, which is a continuation of Ser. No. 06/948,089, filed Dec. 31, 1986, abandoned, which is a continuation of Ser. No. 06/878,865, filed June 26, 1986, abandoned, which is a continuation-in-part of Ser. No. 06/264,214, filed May 15, 1981 abandoned, which is a divisional application of Ser. No. 06/137,447, filed Apr. 4, 1990, abandoned, which is a divisional application of Ser. No. 05/938,890, filed Aug. 3, 1978 and issued May 5, 1981 as U.S. Pat. No. 4,265,942.
US Referenced Citations (9)
Divisions (2)
|
Number |
Date |
Country |
Parent |
137447 |
Apr 1980 |
|
Parent |
938890 |
Aug 1978 |
|
Continuations (3)
|
Number |
Date |
Country |
Parent |
171333 |
Mar 1988 |
|
Parent |
948089 |
Dec 1986 |
|
Parent |
878865 |
Jun 1986 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
264214 |
May 1981 |
|