Claims
- 1. A process for the electroless plating of a non-conductor substrate comprising
- contacting said substrate prior to plating with a colloidal composition comprising a copper colloid admixed with cuprous compound and wherein the admixing takes place subsequent to the production of the copper colloid.
- 2. The process according to claim 1 wherein said copper colloid is derived from a copper (II) compound.
- 3. The process according to claim 1 wherein said colloidal composition further contains a stabilizer.
- 4. The process according to claim 1 wherein said substrate is a printed circuitry type substrate.
- 5. The process according to claim 1 wherein said electroless plating is of copper.
Reference to Prior Applications
This application is a continuation-in-part of U.S. application Ser. No. 672,044, filed on Mar. 30, 1970 which is a divisional application of U.S. application Ser. No. 607,506, filed on Aug. 26, 1975 now U.S. Pat. No. 3,993,799 which is a continuation-in-part of U.S. application Ser. No. 512,224 filed Oct. 4, 1974, now abandoned.
US Referenced Citations (7)
Divisions (1)
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Number |
Date |
Country |
Parent |
607506 |
Aug 1975 |
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Continuation in Parts (2)
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Number |
Date |
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Parent |
672044 |
Mar 1970 |
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Parent |
512224 |
Oct 1974 |
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