Claims
- 1. A compact arrayed image sensor, comprising:
- an imperviously sealed package made of an electrically insulating material, said package having a front face provided with a transparent window;
- an insulating support interposed between said front and rear face;
- an array of photosensitive elements on a monocrystalline semiconductor substrate, wherein said semiconductor substrate is interposed between said window and said insulating support, said semiconductor substrate facing said window, and said array of photosensitive elements facing said insulating support, oriented such that said photosensitive elements receive light rays that have gone through the window and through the substrate;
- electrical contacts for connection with said photosensitive elements, said contacts being located on said semiconductor substrate;
- connection terminals which go through the insulating support and through the rear face of the package, said connection terminals having respective ends, an internal end located on the inside, and an external end located on the outside of said impervious package.
- 2. An image sensor according to claim 1, wherein the connection means comprise spacers made of an electrically conductive material, respectively interposed between the ends of the terminals and the corresponding contacts, these spacers being in contact with these ends and these terminals.
- 3. A sensor according to claim 1, wherein said spacers are indium balls.
- 4. A sensor according to claim 1, wherein said spacers are formed by a conductive bonder.
- 5. A sensor according to claim 1, wherein the connection means comprise an insulating sheet including zones of conductive material, respectively located so as to face said contacts and the corresponding ends of said terminals.
- 6. A sensor according to claim 5, wherein said conducting material is a metal.
- 7. A compact arrayed image sensor comprising an imperviously sealed package, said package having a rear face, and a front face provided with a transparent window; and
- array of photosensitive elements on a monocrystalline semiconductor substrate wherein said substrate being at least partially transparent to the light radiation to be directed, said semiconductor substrate facing said window and said array facing said rear face such that light radiation to be detected passes through said substrate, said semiconductor substrate provided with contact pads for electrical connection with said photosensitive elements; said sensor further comprising connecting pins in electrical contact with said contact pads, said pins projecting through the rear face of the package.
Priority Claims (1)
Number |
Date |
Country |
Kind |
88 00679 |
Jan 1988 |
FRX |
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Parent Case Info
This application is a continuation of application Ser. No. 07/298,903, filed on Jan. 19, 1989, now abandoned.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
3456159 |
Davis et al. |
Jul 1969 |
|
Foreign Referenced Citations (5)
Number |
Date |
Country |
2565408 |
Jun 1985 |
FRX |
0040870 |
Mar 1983 |
JPX |
0107788 |
Jun 1983 |
JPX |
0047774 |
Mar 1984 |
JPX |
0096751 |
Jun 1984 |
JPX |
Non-Patent Literature Citations (3)
Entry |
Patents Abstracts of Japan, vol. 7, No. 123 (E-178)[1268], May 27, 1983. |
Patent Abstracts of Japan, vol. 8, No. 139 (E-253)[1576], Jun. 28, 1984. |
Patent Abstracts of Japan, vol. 7, No. 214 (E-199)[1359], Sep. 21, 1983. |
Continuations (1)
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Number |
Date |
Country |
Parent |
298903 |
Jan 1989 |
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