COMPLIANT MECHANICAL SYSTEM FOR MINI/MICRO CHIP MASS TRANSFER AND PACKAGING

Information

  • Patent Application
  • 20230298914
  • Publication Number
    20230298914
  • Date Filed
    December 06, 2022
    a year ago
  • Date Published
    September 21, 2023
    7 months ago
Abstract
A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexible hinges, and a pricking pin. The first thorn die attach drive devices and the second thorn die attach drive devices are mounted on the drive support plate. A drive end of the first thorn die attach drive device horizontally passes rightward through the first flexible hinge at a corresponding position; a drive end of the second thorn die attach drive device horizontally passes leftward through the first flexible hinge at a corresponding position; and the mounting base is hinged to the drive ends of the two thorn die attach drive devices through the second flexible hinges.
Description
Claims
  • 1. A compliant mechanical system for Mini/Micro chip mass transfer and packaging, comprising a flexure-based continuous ejector pin mechanism, wherein the flexure-based continuous ejector pin mechanism comprises a drive support plate, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin; two upper hinge portions and two lower hinge portions horizontally protrude from a front side of the drive support plate;the upper hinge portions and the lower hinge portions are arranged in two groups up and down facing each other, and are respectively located on a left side and a right side of the drive support plate;the upper hinge portion is connected to the lower hinge portion directly there_below through the first flexible hinge;the first thorn die attach drive device is mounted on the left side of the drive support plate; the first thorn die attach drive device horizontally passes through the first flexible hinge at a corresponding position; the second thorn die attach drive device is symmetrically mounted on the right side of the drive support plate; the second thorn die attach drive device horizontally passes through the first flexible hinge at a corresponding position;a left side and a right side of the mounting base are respectively hinged to the first thorn die attach drive device and the second thorn die attach drive device through the second flexible hinges; andan upper end of the pricking pin is vertically connected to a bottom of the mounting base.
  • 2. The compliant mechanical system according to claim 1, wherein the first thorn die attach drive device is fixedly mounted on the left side of the drive support plate through an L-shaped mounting plate; the second thorn die attach drive device is fixedly mounted on the right side of the drive support plate through an L-shaped mounting plate; the first thorn die attach drive device and the second thorn die attach drive device are collinearly arranged in a horizontal direction; and the second flexible hinges located on the left side and the right side of the drive support plate are symmetrically arranged left and right with respect to an extension direction of the pricking pin in a vertical direction.
  • 3. The compliant mechanical system according to claim 1, wherein two of the first flexible hinges are arranged in parallel between the upper hinge portion and the lower hinge portion directly therebelow; and the second flexible hinges are respectively hinged in parallel between the first thorn die attach drive device and the mounting base and between the second thorn die attach drive device and the mounting base.
  • 4. The compliant mechanical system according to claim 1, wherein the first thorn die attach drive device and the second thorn die attach drive device are voice coil motors.
  • 5. The compliant mechanical system according to claim 1, wherein the first flexible hinges are straight-beam hinges, and are of linear sheet structures having a uniform width and thickness; the second flexible hinges are arc flexible hinges, and are of linear strip structures; arc-shaped grooves are recessed in both ends of the arc flexible hinges, and groove surfaces of the arc-shaped grooves are arc surfaces; an extension direction of the arc grooves is horizontally arranged perpendicular to the drive support plate; and the first flexible hinges and the second flexible hinges are all made of aviation aluminum.
  • 6. The compliant mechanical system according to claim 1, further comprising: a portal frame, a first motion platform, a second motion platform, and an industrial camera, wherein the first motion platform is configured to bear a circuit substrate;the second motion platform is configured to bear a light emitting diode (LED) die and move directly above the first motion platform;the industrial camera is configured to detect relative positions between the circuit substrate and each LED die;the flexure-based continuous ejector pin mechanism is configured to transfer the LED die on the second motion platform to the circuit substrate on the first motion platform;the portal frame is mounted directly above the first motion platform; and the industrial camera and the flexible flexure-based continuous ejector pin mechanism are mounted on the portal frame.
  • 7. The compliant mechanical system according to claim 6, further comprising a controller, wherein the controller is connected to the first thorn die attach drive device, the second thorn die attach drive device, the first motion platform, the second motion platform, and the industrial camera.
  • 8. The compliant mechanical system according to claim 6, wherein the LED die is a Mini-LED die or a Micro-LED die.
  • 9. The compliant mechanical system for Mini/Micro chip mass transfer and packaging according to claim 6, wherein the controller is internally provided with a thorn die attach control method for transferring and packaging LED dies; and the thorn die attach control method comprises the following steps: representing an output bit of the pricking pin as: X=X1+X22Y=X1−X2tanθ2 ;wherein, X1 is an input displacement of the first thorn die attach drive device, X2 is an input displacement of the second thorn die attach drive device; x is an output displacement of the pricking pin in the horizontal direction, y is an output displacement of the pricking pin in the horizontal direction, and θ is an included angle between the second flexible hinge and the vertical direction.
  • 10. The compliant mechanical system for Mini/Micro chip mass transfer and packaging according to claim 7, wherein the thorn die attach control method comprises a thorn die attach operation which specifically comprises: controlling, by the controller, the first motion platform, the second motion platform, and the thorn die attach device to move to the X direction at a same speed.
Priority Claims (1)
Number Date Country Kind
202210151547.6 Feb 2022 CN national