Patent Application
20180269131
This patent application is directed to computer component cooling systems and, more specifically, to liquid cooling systems.
Cooling a component (e.g., microprocessor) can enhance the lifetime and/or performance of the component. Liquids allow the transfer of more heat from computer components being cooled than air, making liquid cooling systems desirable for high performance computer applications and for extending the life of components. Conventional liquid cooling systems typically comprise a sealed system incorporating a small radiator, a fan, a coolant block, and an optional pump. The coolant block is typically clamped on top of the component to be cooled. The coolant block transfers heat from the component to coolant circulating through the block. The coolant circulates passively or via a pump to a radiator where heat is rejected to the surrounding atmosphere.
Embodiments of the component cooling systems described herein may be better understood by referring to the following Detailed Description in conjunction with the accompanying drawings, in which like reference numerals indicate identical or functionally similar elements:
The headings provided herein are for convenience only and do not necessarily affect the scope or meaning of the claimed embodiments. Further, the drawings have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be expanded or reduced to help improve the understanding of the embodiments. Moreover, while the disclosed technology is amenable to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and are described in detail below. The intention, however, is not to unnecessarily limit the embodiments described. On the contrary, the embodiments are intended to cover all suitable modifications, equivalents, and alternatives falling within the scope of the embodiments as defined by the appended claims.
Technology is provided for a component (e.g., microprocessor) cooling system. The disclosed cooling system includes a radiator having centrally located inlet and outlet connections which provide enhanced cooling performance and more compact and serviceable component packaging. In some embodiments, the system can include a cooling block assembly and a radiator. The cooling block assembly can include a mounting bracket and a coolant block positioned in the mounting bracket. The coolant block includes a cold plate volume in fluid communication with an inlet plenum and an outlet plenum. The cold plate is configured to be placed in close contact with a component thereby transferring heat from the component. A pump is positioned between the inlet plenum and the outlet plenum and is in fluid communication with the outlet plenum. The radiator includes a center tank having an inlet chamber in fluid communication with an outlet of the pump and an outlet chamber in fluid communication with the inlet plenum. A pair of end tanks are positioned on opposite sides of the center tank with core tubes extending between the inlet and outlet chambers and the pair of end tanks. The pump circulates coolant between the cooling block and the radiator to cool the component.
Various examples of the devices introduced above will now be described in further detail. The following description provides specific details for a thorough understanding and enabling description of these examples. One skilled in the relevant art will understand, however, that the techniques discussed herein may be practiced without many of these details. Likewise, one skilled in the relevant art will also understand that the technology can include many other features not described in detail herein. Additionally, some well-known structures or functions may not be shown or described in detail below so as to avoid unnecessarily obscuring the relevant description.
The terminology used below is to be interpreted in its broadest reasonable manner, even though it is being used in conjunction with a detailed description of some specific examples of the embodiments. Indeed, some terms may even be emphasized below; however, any terminology intended to be interpreted in any restricted manner will be overtly and specifically defined as such in this section.
The coolant block 108 can include a cold plate volume 112 in fluid communication with an inlet plenum 114 and an outlet plenum 116. A coolant, such as water, flows through the coolant block 108 and passes over a heat transfer plate or other heat sink member that conveys heat from the component (e.g., microprocessor) to the coolant in the cold plate volume 112 before the coolant exits through the outlet plenum 116, thereby drawing heat away from the component. A pump 118 is positioned between the inlet plenum 114 and the outlet plenum 116. The pump 118 is mounted to the mounting bracket 106 with fasteners as shown. An inlet 120 of the pump 118 is connected for fluid communication with the outlet plenum 116 via a transfer tube assembly 124.
In some embodiments, the radiator 104 includes a center tank 126 and a pair of end tanks 132 positioned on opposite sides of the center tank 126. The flow of coolant is divided so a first portion flows through tubes in the left side (one side) of the radiator, and a second portion of the coolant flows through tubes in the right side (other side) of the radiator. In some embodiments, the center tank 126 is positioned approximately midway between the pair of end tanks 132. The center tank 126 has an inlet connector 128 connected to an outlet 122 of the pump 118, and an outlet connector 130 connected to the inlet plenum 114. Centrally locating the inlet and outlet connectors 128/130 provides enhanced cooling performance, as explained more fully below, and provides more compact and serviceable component packaging. Typical component cooling system radiators have connections located at either end of the radiator in one of the end tanks 132, for example. In a typical microprocessor cooling application, the tubing connecting the pump and radiator in these conventional systems interferes with components mounted adjacent the processor, such as memory cards. The centrally located inlet and outlet connections 128/130 of the present system facilitate routing the coolant tubing (e.g., tubing assemblies 140/142) directly to the coolant block 108 and associated microprocessor (not shown) without interfering with any components (e.g., memory cards) located next to the microprocessor.
As shown in
Three inlet core tubes 150 extend between the inlet chamber 144 and one of the pair of end tanks 132 and three outlet core tubes 152 extend between the end tank 132 and the outlet chamber 146. More or fewer core tubes can be used in various embodiments. It should also be appreciated that additional inlet and outlet core tubes 150 and 152 extend in the opposite direction to the other of the pair of end tanks 132.
In operation, the component to be cooled (not shown) heats the coolant in the coolant block 108 as it passes over the heat transfer plate 134 (
The above description and drawings are illustrative and are not to be construed as limiting. Numerous specific details are described to provide a thorough understanding of the disclosure. However, in some instances, well-known details are not described in order to avoid obscuring the description. Further, various modifications may be made without deviating from the scope of the embodiments. Accordingly, the embodiments are not limited except as by the appended claims.
Reference in this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the disclosure. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Moreover, various features are described which may be exhibited by some embodiments and not by others. Similarly, various requirements are described which may be requirements for some embodiments but not for other embodiments.
The terms used in this specification generally have their ordinary meanings in the art, within the context of the disclosure, and in the specific context where each term is used. It will be appreciated that the same thing can be said in more than one way. Consequently, alternative language and synonyms may be used for any one or more of the terms discussed herein, and any special significance is not to be placed upon whether or not a term is elaborated or discussed herein. Synonyms for some terms are provided. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification, including examples of any term discussed herein, is illustrative only and is not intended to further limit the scope and meaning of the disclosure or of any exemplified term. Likewise, the disclosure is not limited to various embodiments given in this specification. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. In the case of conflict, the present document, including definitions, will control.
