Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

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CPC
H01L23/40

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power conversion device
- Patent number 12,178,023
- Issue date Dec 24, 2024
- Denso Corporation
- Kazuya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Welding-type power supplies with expandable thermal interfaces
- Patent number 12,178,021
- Issue date Dec 24, 2024
- Illinois Tool Works Inc.
- Alan Adam Manthe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plates incorporating S-cells
- Patent number 12,165,954
- Issue date Dec 10, 2024
- TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for phase switch timing controller for inverter...
- Patent number 12,162,366
- Issue date Dec 10, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package structure having hollow cylinders and method of fabricating...
- Patent number 12,159,851
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory card and memory system
- Patent number 12,136,606
- Issue date Nov 5, 2024
- Kioxia Corporation
- Yuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Clamping element and method for producing a power semiconductor device
- Patent number 12,125,767
- Issue date Oct 22, 2024
- HITACHI ENERGY LTD
- Lluis Santolaria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,125,804
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one resin part that closes one...
- Patent number 12,119,279
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Mamoru Togami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a pressure device acting on a swi...
- Patent number 12,112,994
- Issue date Oct 8, 2024
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Stefan Oehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe with in-plane heat spreader and loading mechanism
- Patent number 12,114,466
- Issue date Oct 8, 2024
- Intel Corporation
- Penchala Pratap Binni Boyina
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High efficiency heat dissipation using thermal interface material film
- Patent number 12,100,640
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 12,094,802
- Issue date Sep 17, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backing plate assembly with jack screw for bare die device heat sin...
- Patent number 12,096,601
- Issue date Sep 17, 2024
- Ciena Corporation
- Maxwell Thomas McKerlie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite structure for image plane normalization of a microelectro...
- Patent number 12,087,704
- Issue date Sep 10, 2024
- Raytheon Company
- Thomas Sprafke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing direct silicon footprint microfluid...
- Patent number 12,080,626
- Issue date Sep 3, 2024
- Georgia Tech Research Corporation
- Luis Daniel Lorenzini Gutierrez
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic component module
- Patent number 12,080,613
- Issue date Sep 3, 2024
- Murata Manufacturing Co., Ltd.
- Motohiko Kusunoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having mechanical brace standoffs
- Patent number 12,080,623
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for holding a heat generating device
- Patent number 12,080,624
- Issue date Sep 3, 2024
- Solaredge Technologies Ltd.
- Tomer Kugman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lidded semiconductor package
- Patent number 12,080,614
- Issue date Sep 3, 2024
- Mediatek Inc.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,074,143
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly
- Patent number 12,074,103
- Issue date Aug 27, 2024
- AP Memory Technology Corp.
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device with cooling member
- Patent number 12,074,088
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Takahiko Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,074,154
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20240429113
- Publication date Dec 26, 2024
- MEDIATEK INC.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC BOARD EQUIPPED WITH A HEAT DISSIPATION DEVICE AND APPARA...
- Publication number 20240431017
- Publication date Dec 26, 2024
- BULL SAS
- Bernard TENEZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...
- Publication number 20240421033
- Publication date Dec 19, 2024
- Yamaichi Electronics Co., Ltd.
- Koichi MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20240422949
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Po-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLER AND SEMICONDUCTOR MODULE
- Publication number 20240421028
- Publication date Dec 19, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240413051
- Publication date Dec 12, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE FIXING ELEMENT
- Publication number 20240402767
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIXING ELEMENT FOR HEAT DISSIPATION AND METHOD OF MOUNTING THE SAME
- Publication number 20240402768
- Publication date Dec 5, 2024
- Wen-Ji Lan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20240399895
- Publication date Dec 5, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING
- Publication number 20240405005
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ELEMENT FOR HEAT DISSIPATION UNIT AND HEAT DISSIPATION U...
- Publication number 20240402769
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROGRAMMABLE INTERPOSERS FOR ELECTRICALLY CONNECTING INTEGRATED CIR...
- Publication number 20240404592
- Publication date Dec 5, 2024
- Michael Kozicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20240404915
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING UNIT AND HEAT DISSIPATION DEVICE USING SAME
- Publication number 20240402766
- Publication date Dec 5, 2024
- Asia Vital Components Co., Ltd.
- Wen-Ji Lan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Thermal Module
- Publication number 20240395663
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sing-Da JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS
- Publication number 20240395772
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
- Publication number 20240371725
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371795
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20240371747
- Publication date Nov 7, 2024
- AP Memory Technology Corp.
- Wenliang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
- Publication number 20240363486
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan Sheng Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH INTERPOSER ASSEMBLY
- Publication number 20240363485
- Publication date Oct 31, 2024
- Tesla, Inc.
- Yong guo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240363591
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363611
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...
- Publication number 20240355759
- Publication date Oct 24, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20240355704
- Publication date Oct 24, 2024
- Hitachi Energy Ltd
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS

Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power conversion device

Multi-die package with multiple heat channels

Welding-type power supplies with expandable thermal interfaces

Cold plates incorporating S-cells

Systems and methods for phase switch timing controller for inverter...

Package structure having hollow cylinders and method of fabricating...

Semiconductor package structure and fabrication method thereof

Memory card and memory system

Device and method for a two phase heat transfer

Systems and methods for bidirectional message architecture for inve...

Clamping element and method for producing a power semiconductor device

Semiconductor package and manufacturing method thereof

Semiconductor device having at least one resin part that closes one...

Power semiconductor module having a pressure device acting on a swi...

Heat pipe with in-plane heat spreader and loading mechanism

Systems and methods for integrated gate driver for inverter for ele...

High efficiency heat dissipation using thermal interface material film

Data processing device

Backing plate assembly with jack screw for bare die device heat sin...

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Composite structure for image plane normalization of a microelectro...

System and method for providing direct silicon footprint microfluid...

Electronic component module

Integrated circuit packages having mechanical brace standoffs

Apparatus and method for holding a heat generating device

Lidded semiconductor package

Integrated circuit package and method

Circuit assembly

Semiconductor device and semiconductor device with cooling member

Package structure

Patents Applicationslast 30 patents

LIDDED SEMICONDUCTOR PACKAGE

Power Module and Method for Assembling a Power Module

ELECTRONIC BOARD EQUIPPED WITH A HEAT DISSIPATION DEVICE AND APPARA...

HEATSINK UNIT, IC SOCKET, SEMICONDUCTOR PACKAGE MAKING METHOD, AND...

HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

COOLER AND SEMICONDUCTOR MODULE

INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...

HEAT DISSIPATION MEMBER

REWORKABLE FIXING ELEMENT

FIXING ELEMENT FOR HEAT DISSIPATION AND METHOD OF MOUNTING THE SAME

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

IPD MODULES WITH FLEXIBLE CONNECTION SCHEME IN PACKAGING

CONNECTING ELEMENT FOR HEAT DISSIPATION UNIT AND HEAT DISSIPATION U...

PROGRAMMABLE INTERPOSERS FOR ELECTRICALLY CONNECTING INTEGRATED CIR...

DATA PROCESSING DEVICE

FIXING UNIT AND HEAT DISSIPATION DEVICE USING SAME

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

Semiconductor Device Package with Thermal Module

PACKAGE STRUCTURE INCLUDING GUIDING PATTERNS

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method

CIRCUIT ASSEMBLY

INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS

ELECTRONIC ASSEMBLIES WITH INTERPOSER ASSEMBLY

INTEGRATED CIRCUIT PACKAGE AND METHOD

PACKAGE STRUCTURE

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...

POWER SEMICONDUCTOR MODULE