Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

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CPC
H01L23/40

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal spreader including ringframe and thermal straps for thermal...
- Patent number 12,322,674
- Issue date Jun 3, 2025
- Raytheon Company
- Keith R. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for data recorder for inverter for electric veh...
- Patent number 12,323,080
- Issue date Jun 3, 2025
- BorgWarner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Desktop electronic device
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- Issue date Jun 3, 2025
- Apple Inc.
- Brett W. Degner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Vapor chamber heat spreader for bare die processors
- Patent number 12,315,779
- Issue date May 27, 2025
- Amazon Technologies, Inc.
- Luke Thomas Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for a heat exchanger with a biasing bracket and mounting plate
- Patent number 12,317,457
- Issue date May 27, 2025
- Dana Canada Corporation
- Andrei Catuneanu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Technologies for processor loading mechanisms
- Patent number 12,315,780
- Issue date May 27, 2025
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TEC-embedded dummy die to cool the bottom die edge hotspot
- Patent number 12,308,299
- Issue date May 20, 2025
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchor and cavity configuration for MEMS-based cooling systems
- Patent number 12,308,302
- Issue date May 20, 2025
- Frore Systems Inc.
- Vikram Mukundan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetically secured semiconductor chip package loading assembly
- Patent number 12,309,933
- Issue date May 20, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Error-unlocking protection structure for heat dissipation base seat
- Patent number 12,300,572
- Issue date May 13, 2025
- Asia Vital Components (China) Co., Ltd.
- Xue-Hui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secondary side heatsink techniques for optical and electrical modules
- Patent number 12,288,954
- Issue date Apr 29, 2025
- Ciena Corporation
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power semiconductor device and manufacturing method of power semico...
- Patent number 12,283,536
- Issue date Apr 22, 2025
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned bolster plate and composite back plate for semiconductor...
- Patent number 12,279,395
- Issue date Apr 15, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 12,272,896
- Issue date Apr 8, 2025
- Molex, LLC
- Che-Yuan Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation fastener structure
- Patent number 12,272,617
- Issue date Apr 8, 2025
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power transistor conversion device
- Patent number 12,255,541
- Issue date Mar 18, 2025
- ELMATEK INTERNATIONAL CORP.
- Steven Po-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,218,021
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Adjustable retention device for heat sink assembly
- Patent number 12,207,446
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Mehdi Hamid Vishkasougheh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20250183131
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- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
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DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
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- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...
- Publication number 20250174511
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- NEC Corporation
- Junichi Chiba
- H01 - BASIC ELECTRIC ELEMENTS
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ELASTIC MEMBER AND ELASTIC DEVICE
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- Publication date May 29, 2025
- Mitsubishi Steel Mfg. Co., Ltd
- Yasuhiro MITSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblage module 3D
- Publication number 20250167057
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Manon PORLAN
- H01 - BASIC ELECTRIC ELEMENTS
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POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...
- Publication number 20250167073
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heatsink techniques for optical and electrical modules
- Publication number 20250168963
- Publication date May 22, 2025
- CIENA CORPORATION
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...
- Publication number 20250157884
- Publication date May 15, 2025
- ZTE Corporation
- Cheng TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component holder with a temperature-control function
- Publication number 20250140631
- Publication date May 1, 2025
- BESI Switzerland AG
- Uwe BAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20250140610
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132225
- Publication date Apr 24, 2025
- Hitachi Astemo, Ltd.
- Yusuke TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
- Publication number 20250125218
- Publication date Apr 17, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink Fixing Structure and Heat Dissipation Apparatus
- Publication number 20250125219
- Publication date Apr 17, 2025
- ZTE Corporation
- Weifeng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
- Publication number 20250118628
- Publication date Apr 10, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
- Publication number 20250112143
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...
- Publication number 20250112110
- Publication date Apr 3, 2025
- STMicroelectronics International N.V.
- Florian PERMINJAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20250105092
- Publication date Mar 27, 2025
- Panasonic Automotive Systems Co., Ltd.
- Hayata ONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250105091
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Kazuyuki MATSUZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250105191
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
- Publication number 20250096071
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsunyen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
LIMITING STRUCTURE AND LIMITING METHOD THEREOF
- Publication number 20250081399
- Publication date Mar 6, 2025
- FIVEGRAND INTERNATIONAL CO., LTD.
- TING-JUI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL

Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal spreader including ringframe and thermal straps for thermal...

Systems and methods for data recorder for inverter for electric veh...

Desktop electronic device

Systems and methods for an interlocking feature on a power module

Vapor chamber heat spreader for bare die processors

Systems for a heat exchanger with a biasing bracket and mounting plate

Technologies for processor loading mechanisms

TEC-embedded dummy die to cool the bottom die edge hotspot

Anchor and cavity configuration for MEMS-based cooling systems

Magnetically secured semiconductor chip package loading assembly

Error-unlocking protection structure for heat dissipation base seat

Integrated circuit package and method

Secondary side heatsink techniques for optical and electrical modules

Systems and methods for cooling system and power module for inverte...

Power semiconductor device and manufacturing method of power semico...

Semiconductor device

Patterned bolster plate and composite back plate for semiconductor...

Systems and methods for parameter drift correction for inverter for...

Connector assembly with movable heat sink

Heat dissipation fastener structure

Systems and methods for cooling system and power module for inverte...

Power transistor conversion device

Heatsink techniques for optical and electrical modules

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

System, device and methods of manufacture

Semiconductor packages and methods of forming the same

Electronic module comprising a semiconductor package with integrate...

Systems and methods for integrated gate driver for inverter for ele...

Adjustable retention device for heat sink assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

METHOD FOR MANUFACTURING SUBSTRATE COOLING MECHANISM AND SUBSTRATE...

ELASTIC MEMBER AND ELASTIC DEVICE

Assemblage module 3D

POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING POWER SEMICO...

Heatsink techniques for optical and electrical modules

CHIP LIQUID-COOLING HEAT DISSIPATION STRUCTURE AND FABRICATION METH...

Component holder with a temperature-control function

System, Device and Methods of Manufacture

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

Heat Sink Fixing Structure and Heat Dissipation Apparatus

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD

THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...

POWER CONVERSION APPARATUS

ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

LIMITING STRUCTURE AND LIMITING METHOD THEREOF

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...