Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

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CPC
H01L23/40

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Secondary side heatsink techniques for optical and electrical modules
- Patent number 12,288,954
- Issue date Apr 29, 2025
- Ciena Corporation
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and manufacturing method of power semico...
- Patent number 12,283,536
- Issue date Apr 22, 2025
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,283,539
- Issue date Apr 22, 2025
- Mitsubishi Electric Corporation
- Yuki Matsutaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned bolster plate and composite back plate for semiconductor...
- Patent number 12,279,395
- Issue date Apr 15, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 12,272,896
- Issue date Apr 8, 2025
- Molex, LLC
- Che-Yuan Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation fastener structure
- Patent number 12,272,617
- Issue date Apr 8, 2025
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Power transistor conversion device
- Patent number 12,255,541
- Issue date Mar 18, 2025
- ELMATEK INTERNATIONAL CORP.
- Steven Po-Cheng Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink techniques for optical and electrical modules
- Patent number 12,245,359
- Issue date Mar 4, 2025
- Ciena Corporation
- Mitchell O'Leary
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for low inductance phase switch for inverter fo...
- Patent number 12,225,696
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Systems and methods for adaptive gate driver for inverter for elect...
- Patent number 12,220,992
- Issue date Feb 11, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,218,021
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a semiconductor package with integrate...
- Patent number 12,218,030
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,214,677
- Issue date Feb 4, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Adjustable retention device for heat sink assembly
- Patent number 12,207,446
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Mehdi Hamid Vishkasougheh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,866
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 12,199,010
- Issue date Jan 14, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Hayata Onaga
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for non-overlap enforcement for inverter for el...
- Patent number 12,194,870
- Issue date Jan 14, 2025
- Borg Warner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic apparatus
- Patent number 12,199,009
- Issue date Jan 14, 2025
- Kioxia Corporation
- Kazuyuki Matsuzaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 12,199,021
- Issue date Jan 14, 2025
- Semikron Elektronik GmbH & Co. KG
- Manuel Noderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with blind hole attachment to heat sink
- Patent number 12,191,229
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,272
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for single channel fault encoding for inverter...
- Patent number 12,179,610
- Issue date Dec 31, 2024
- Borg Warner US Technologies LLC
- Marc R. Engelhardt
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor apparatus and electronic apparatus
- Patent number 12,185,502
- Issue date Dec 31, 2024
- Fujitsu Limited
- Shinya Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 12,178,023
- Issue date Dec 24, 2024
- Denso Corporation
- Kazuya Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Welding-type power supplies with expandable thermal interfaces
- Patent number 12,178,021
- Issue date Dec 24, 2024
- Illinois Tool Works Inc.
- Alan Adam Manthe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component holder with a temperature-control function
- Publication number 20250140631
- Publication date May 1, 2025
- BESI Switzerland AG
- Uwe BAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20250140610
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132225
- Publication date Apr 24, 2025
- Hitachi Astemo, Ltd.
- Yusuke TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
- Publication number 20250125218
- Publication date Apr 17, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink Fixing Structure and Heat Dissipation Apparatus
- Publication number 20250125219
- Publication date Apr 17, 2025
- ZTE Corporation
- Weifeng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
- Publication number 20250118628
- Publication date Apr 10, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
- Publication number 20250112143
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...
- Publication number 20250112110
- Publication date Apr 3, 2025
- STMicroelectronics International N.V.
- Florian PERMINJAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20250105092
- Publication date Mar 27, 2025
- Panasonic Automotive Systems Co., Ltd.
- Hayata ONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20250105091
- Publication date Mar 27, 2025
- KIOXIA Corporation
- Kazuyuki MATSUZAKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250105191
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
- Publication number 20250096071
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsunyen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Publication number 20250087615
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...
- Publication number 20250089224
- Publication date Mar 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
LIMITING STRUCTURE AND LIMITING METHOD THEREOF
- Publication number 20250081399
- Publication date Mar 6, 2025
- FIVEGRAND INTERNATIONAL CO., LTD.
- TING-JUI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...
- Publication number 20250056773
- Publication date Feb 13, 2025
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Publication number 20250022772
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Insik HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM BLOCK ASSEMBLY
- Publication number 20250014962
- Publication date Jan 9, 2025
- PURPLE CLOUD DEVELOPMENT PTE. LTD.
- HSIANG-CHIEH TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...
- Publication number 20250014967
- Publication date Jan 9, 2025
- Intel Corporation
- Kyle Jordan Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SERVER
- Publication number 20250014966
- Publication date Jan 9, 2025
- xFusion Digital Technologies Co., Ltd
- Shuimu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006577
- Publication date Jan 2, 2025
- Innolux Corporation
- Mei-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED SEMICONDUCTOR PACKAGE
- Publication number 20240429113
- Publication date Dec 26, 2024
- MEDIATEK INC.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Assembling a Power Module
- Publication number 20240429121
- Publication date Dec 26, 2024
- ZF Friedrichshafen AG
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Secondary side heatsink techniques for optical and electrical modules

Power semiconductor device and manufacturing method of power semico...

Systems and methods for cooling system and power module for inverte...

Semiconductor device

Patterned bolster plate and composite back plate for semiconductor...

Systems and methods for parameter drift correction for inverter for...

Connector assembly with movable heat sink

Heat dissipation fastener structure

Systems and methods for cooling system and power module for inverte...

Power transistor conversion device

Heatsink techniques for optical and electrical modules

Systems and methods for low inductance phase switch for inverter fo...

Systems and methods for adaptive gate driver for inverter for elect...

System, device and methods of manufacture

Semiconductor packages and methods of forming the same

Electronic module comprising a semiconductor package with integrate...

Systems and methods for integrated gate driver for inverter for ele...

Adjustable retention device for heat sink assembly

Semiconductor device

Power conversion apparatus

Systems and methods for non-overlap enforcement for inverter for el...

Electronic apparatus

Power semiconductor module and method for producing a power semicon...

Semiconductor package with blind hole attachment to heat sink

Package structure

Systems and methods for single channel fault encoding for inverter...

Semiconductor apparatus and electronic apparatus

Power conversion device

Multi-die package with multiple heat channels

Welding-type power supplies with expandable thermal interfaces

Patents Applicationslast 30 patents

Component holder with a temperature-control function

System, Device and Methods of Manufacture

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE

Heat Sink Fixing Structure and Heat Dissipation Apparatus

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD

THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED...

POWER CONVERSION APPARATUS

ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS

METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS

SYSTEMS AND METHODS FOR NON-OVERLAP ENFORCEMENT FOR INVERTER FOR EL...

LIMITING STRUCTURE AND LIMITING METHOD THEREOF

SYSTEMS AND METHODS FOR PHASE SWITCH TIMING CONTROLLER FOR INVERTER...

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW

COOLING SYSTEM BLOCK ASSEMBLY

METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL...

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

ELECTRONIC DEVICE AND SERVER

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LIDDED SEMICONDUCTOR PACKAGE

Power Module and Method for Assembling a Power Module