Claims
- 1. A conditioning tool useful for treating the polishing surface of a polishing pad, comprising:
a base for supporting conditioning materials; the base having an abrasive section for cutting a polishing surface of the polishing pad; and a polymeric section for treating the polishing surface of the polishing pad, the polymeric section being operable in a first position with only the polymeric section in contact with the polishing surface of the polishing pad and operable in a second position with the abrasive section in contact with the polishing surface of the polishing pad.
- 2. The conditioning tool of claim 1 wherein a bladder controls movement and downward force of the polymeric section independent of the abrasive section.
- 3. The conditioning tool of claim 1 wherein an electromechanical device controls movement and downward force of the polymeric section independent of the abrasive section.
- 4. The conditioning tool of claim 1 wherein the base includes openings for transferring fluids to the polishing pad.
- 5. A conditioning tool useful for treating the polishing surface of a polishing pad, comprising:
a base for supporting conditioning materials; the base having an abrasive section for cutting a polishing surface of a polishing pad; and a polymeric section for treating the polishing surface of the polishing pad, the polymeric section being capable of movement and downward force independent of the abrasive section and being operable in a first position with only the polymeric section in contact with the polishing surface of the polishing pad and operable in a second position with the abrasive section in contact with the polishing surface of the polishing pad.
- 6. A method of treating the surface of a polishing pad with a conditioning tool comprising the steps of:
treating the polishing pad with a polymeric section of the conditioning tool to treat a polishing surface of the polishing pad; manipulating the conditioning tool to engage an abrasive section of the conditioning tool; and conditioning the polishing pad with the abrasive section of the conditioning tool to provide the polishing surface of the polishing pad with a conditioned surface.
- 7. The method of claim 6 including the additional step of treating the polishing pad with the polymeric section for more than one polishing cycle before conditioning the polishing surface with the abrasive section.
- 8. The method of claim 6 wherein the treating and the conditioning occur as a simultaneous operation.
- 9. The method of claim 6 wherein the treating the polishing pad with the polymeric section cleans the polishing surface of the polishing pad with brushes.
- 10. The method of claim 6 wherein the treating the polishing pad with the polymeric section conditions the polishing surface of the polishing pad with a polymeric pad.
REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation-in-part of U.S. application Ser. No. 10/115,476, filed Apr. 2, 2002, now abandoned.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
10115476 |
Apr 2002 |
US |
Child |
10405542 |
Apr 2003 |
US |