Claims
- 1. A conductive adhesive comprising a binder resin and a metal filler as main components, wherein the binder resin contains a functional group in its molecular chain that forms a multidentate bonding with an electrode metal after the binder resin is adhered,wherein taking the conductive adhesive as 100 wt %, the binder resin is contained in an amount between 5 and 25 wt %, and the metal filler is contained in an amount between 75 and 95 wt %.
- 2. The conductive adhesive according to claim 1, wherein the multidentate bonding is formed in a number between 2 and 4 per molecule.
- 3. The conductive adhesive according to claim 1, wherein the resin containing a functional group in its molecular chain that forms a multidentate bonding is present in an amount between 10 and 100 wt % of the total resin.
- 4. The conductive adhesive according to claim 1, wherein at least two functional groups are present, which may be the same or different, selected from the group consisting of a carbonyl groups a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group.
- 5. The conductive adhesive according to claim 1, wherein the metal filler is at least one particle selected from the group consisting of silver, silver-plated nickel and silver-plated copper.
- 6. The conductive adhesive according to claim 1, wherein the binder resin is at least one resin selected from a thermoplastic resin and a thermosetting resin.
- 7. The conductive adhesive according to claim 6, wherein the thermoplastic resin is at least one resin selected from the group consisting of a polyester resin, a silicone resin, a vinyl resin, a vinyl chloride resin, an acrylic resin, a polystyrene resin, an ionomer resin, a polymethylpentene resin, a polyimide resin, a polycarbonate resin, a fluororesin and a thermoplastic epoxy resin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2000-001526 |
Jan 2000 |
JP |
|
Parent Case Info
This application is a divisional of Ser. No. 09/751,621 Dec. 29, 2000, now U.S. Pat. No. 6,521,144.
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Number |
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Country |
5-159622 |
Jun 1993 |
JP |
9-176285 |
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JP |
Non-Patent Literature Citations (1)
Entry |
“Development of Functional Adhesives and the New Technology”; Miyairi, Hiroo; CMC, Jun. 30, 1997; with partial English translation. |