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H05K3/321

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

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H05K3/321by conductive adhesive

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing component embedded circuit board
- Patent number 12,238,871
- Issue date Feb 25, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assembly
- Patent number 12,232,267
- Issue date Feb 18, 2025
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-connected analyte sensors
- Patent number 12,150,250
- Issue date Nov 19, 2024
- DexCom, Inc.
- Jason Halac
- G01 - MEASURING TESTING
Information Patent Grant
Power module and power conversion device
- Patent number 12,136,582
- Issue date Nov 5, 2024
- Mitsubishi Electric Corporation
- Yoshinori Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component on flexible substrate
- Patent number 12,069,808
- Issue date Aug 20, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deformable sensor
- Patent number 12,038,274
- Issue date Jul 16, 2024
- Forciot OY
- Mikko Turunen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring substrate and information processing device
- Patent number 12,003,047
- Issue date Jun 4, 2024
- Hitachi, Ltd.
- Norio Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronics assembly
- Patent number 11,950,367
- Issue date Apr 2, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-connected analyte sensors
- Patent number 11,943,876
- Issue date Mar 26, 2024
- DexCom, Inc.
- Jason Halac
- G01 - MEASURING TESTING
Information Patent Grant
Forming electrical interconnections using capillary microfluidics
- Patent number 11,937,381
- Issue date Mar 19, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronics assembly and electronics assembly
- Patent number 11,910,530
- Issue date Feb 20, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,904,073
- Issue date Feb 20, 2024
- Verily Life Sciences LLC
- Alexander Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lens driving device, camera device, and optical apparatus including...
- Patent number 11,903,142
- Issue date Feb 13, 2024
- LG Innotek Co., Ltd
- Do Yun Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display device
- Patent number 11,874,569
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Han Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image-capturing apparatus with a plurality of camera modules and a...
- Patent number 11,877,045
- Issue date Jan 16, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Seiya Tsuzaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit formation method
- Patent number 11,849,545
- Issue date Dec 19, 2023
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting circuit board to stretchable wires
- Patent number 11,825,605
- Issue date Nov 21, 2023
- Sensor Holdings Limited
- Todd Alan Gisby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless BGA interconnect
- Patent number 11,811,182
- Issue date Nov 7, 2023
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
UV fixing glue for assembly
- Patent number 11,778,753
- Issue date Oct 3, 2023
- Heraeus Deutschland GmbH & Co. KG
- Ilias Nikolaidis
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
COMPACT INTERFACE THROUGH HINGE CONNECTOR
- Publication number 20250106995
- Publication date Mar 27, 2025
- Apple Inc.
- Parin R Dedhia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE ADHESIVE AND COMPOSITION THEREOF
- Publication number 20250066643
- Publication date Feb 27, 2025
- NOPION CO., LTD.
- Chang Hoon SIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-CONNECTED ANALYTE SENSORS
- Publication number 20250040058
- Publication date Jan 30, 2025
- Dexcom, Inc.
- Jason Halac
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20240237218
- Publication date Jul 11, 2024
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT BOARD ASSEMBLY
- Publication number 20240188219
- Publication date Jun 6, 2024
- JOHNAN Corporation
- Yoshinari MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20240170301
- Publication date May 23, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- ZHI-CHENG LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE WIRING BOARD AND LIGHT CONTROL UNIT
- Publication number 20240155762
- Publication date May 9, 2024
- TOPPAN INC.
- Masaki TSUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LENS DRIVING DEVICE, CAMERA DEVICE, AND OPTICAL APPARATUS INCLUDING...
- Publication number 20240155775
- Publication date May 9, 2024
- LG Innotek Co.,Ltd
- Do Yun KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240111194
- Publication date Apr 4, 2024
- SAMSUNG DISPLAY CO., LTD.
- Han Ho PARK
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...
- Publication number 20240090125
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT FORMING METHOD
- Publication number 20240023249
- Publication date Jan 18, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20240008189
- Publication date Jan 4, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof
- Publication number 20230413430
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230389184
- Publication date Nov 30, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20230389185
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Forming Bent Display Panels
- Publication number 20230352497
- Publication date Nov 2, 2023
- Apple Inc.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230354521
- Publication date Nov 2, 2023
- Innolux Corporation
- Chueh-Yuan Nien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-CONNECTED ANALYTE SENSORS
- Publication number 20230328893
- Publication date Oct 12, 2023
- Dexcom, Inc.
- Jason M. Halac
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230309231
- Publication date Sep 28, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...
- Publication number 20230309230
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Tsuyoshi TAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230300993
- Publication date Sep 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- JOOYOUNG KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND APPARATUS
- Publication number 20230225054
- Publication date Jul 13, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARABLE INTERFACE CABLE STRUCTURE FOR HIGH VOLTAGE UNDER-MODULE P...
- Publication number 20230198177
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20230091571
- Publication date Mar 23, 2023
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by conductive adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing component embedded circuit board

Connection method for chip and circuit board, and circuit board ass...

Printed circuit board and manufacturing method thereof

Electronics assembly

Method and apparatus for flexible circuit cable attachment

Separable interface cable structure for high voltage under-module p...

Pre-connected analyte sensors

Power module and power conversion device

Low pressure sintering powder

Circuit board and method for manufacturing thereof

Electronic component on flexible substrate

Electronic device and method of manufacturing the same

Deformable sensor

Resin multilayer substrate and method for manufacturing resin multi...

Method of forming a top plane connection in an electro-optic device

Wiring substrate and information processing device

Method for manufacturing electronics assembly

Pre-connected analyte sensors

Forming electrical interconnections using capillary microfluidics

Method for manufacturing electronics assembly and electronics assembly

Biocompatible electromechanical connection for ceramic substrate el...

Lens driving device, camera device, and optical apparatus including...

Display device

Image-capturing apparatus with a plurality of camera modules and a...

Circuit formation method

Interconnecting circuit board to stretchable wires

Solderless BGA interconnect

Circuit board structure and method for manufacturing a circuit boar...

High-speed RFID tag assembly using impulse heating

UV fixing glue for assembly

Patents Applicationslast 30 patents

COMPACT INTERFACE THROUGH HINGE CONNECTOR

ANISOTROPIC CONDUCTIVE ADHESIVE AND COMPOSITION THEREOF

PRE-CONNECTED ANALYTE SENSORS

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

LOW PRESSURE SINTERING POWDER

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

METHOD FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT BOARD ASSEMBLY

PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...

FLEXIBLE WIRING BOARD AND LIGHT CONTROL UNIT

LENS DRIVING DEVICE, CAMERA DEVICE, AND OPTICAL APPARATUS INCLUDING...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

DISPLAY DEVICE

ELECTRONIC DEVICE

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...

CIRCUIT FORMING METHOD

Method and Apparatus for Flexible Circuit Cable Attachment

Printed Circuit Board and Manufacturing Method Thereof

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

Methods of Forming Bent Display Panels

ELECTRONIC DEVICE

PRE-CONNECTED ANALYTE SENSORS

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...

CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

ELECTRONIC MODULE AND APPARATUS

SEPARABLE INTERFACE CABLE STRUCTURE FOR HIGH VOLTAGE UNDER-MODULE P...

METHODS OF MAKING PRINTED STRUCTURES

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...