Patent Application
20170290153
The present invention relates to a connecting structure for two printed circuit boards, and at least one of the two printed circuit boards is a flexible printed circuit board.
Conventionally, a flexible printed circuit board, which is bendable, is usually used for specially-designed LED lights. However, the flexible printed circuit board costs higher than a rigid printed circuit board. Thus, to save the cost, the flexible printed circuit board is usually cut into strips, and then two of the strips of the flexible printed circuit board are connected into a desired shape. Or one of the strips of the flexible printed circuit board and a striped rigid circuit board are connected into a desired shape.
However, with reference to
To overcome the shortcomings, the present invention provides a connecting structure for printed circuit boards to mitigate or obviate the aforementioned problems.
The main objective of the present invention is to provide a connecting structure for printed circuit boards that can enhance the resistance to pull.
The connecting structure for printed circuit boards has two printed circuit boards, at least one of the two printed circuit boards is a flexible printed circuit board, and each one of the two printed circuit boards has at least one connecting portion protruding from an end of said printed circuit board, and soldered on a top surface of the other printed circuit board.
Each one of the printed circuit boards is attached to the other printed circuit board only by a part (connecting portion), such that the solders on the connecting portion can extend forward and in two transverse directions beyond the connecting portion, thereby increasing the contact area between the solder and the top surface of the other printed circuit board. Therefore, the connecting structure can firmly connect two printed circuit boards and can enhance the resistance to pull.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
A connecting structure for printed circuit boards in accordance with the present invention comprises two printed circuit boards, which may be two flexible printed circuit boards or one flexible printed circuit board and one rigid printed circuit board. A first embodiment and a second embodiment in
With reference to
In a preferred embodiment, the printed circuit boards 10 are preferably, but not limited to, elongated and striped. Each one of the printed circuit boards 10 has multiple connecting portions 14. The connecting portions 14 protrude from an end of the printed circuit board 10, and are spaced apart from each other. The connecting portions 14 extend curvedly into and are soldered on a top surface of the other printed circuited board 10. The connecting portions 14 of the two printed circuit boards 10 are arranged in a staggered manner. The bottom soldering pads 111 are disposed in the connecting portions 14, and correspond to the top soldering pads 131 of the other printed circuit board 10. Solder 20 wraps a top surface, a front surface, and both sides of one of the connecting portions 14, and extends into a portion between said connecting portion 14 and the top surface of the other printed circuit board 10. To be specific, the solder 20 is attached and soldered to the bottom soldering pad 111 of said connecting portion 14 and the corresponding top soldering pad 131. The conductive layer 12, the bottom soldering pads 111 and the top soldering pads 131 are all conductors and are attached to each other, such that the conductive layer 12 of the upper printed circuit board 10, the bottom soldering pad 111 of the upper printed circuit board 10, the top soldering pad 131 of the lower printed circuit board 10, and the conductive layer 12 of the lower printed circuit board 10 are electrically conducted in sequence. That is, the two printed circuit boards 10 are electrically connected.
When the two printed circuit boards 10 are in assembly, unmelted solders are put between the top soldering pad 131 of one of the printed circuit boards 10 and the corresponding bottom soldering pad 111 of the other printed circuit board 10. Then, the unmelted solders are heated indirectly and melted when the two printed circuit boards 10 are soldered by another solder 20, which still achieves the soldering.
Each one of the printed circuit boards 10 is attached to the other printed circuit board 10 only by a part (connecting portions 14), and the connecting portions 14 are arranged in a staggered manner, such that the solders 20 on the connecting portions 14 can extend forward and in two transverse directions beyond the connecting portion 14, thereby increasing the contact area between the solder 20 and the top surface of the other printed circuit board 10. Therefore, the connecting structure can firmly connect two printed circuit boards 10 and can enhance the resistance to pull.
With reference to
With reference to
In another embodiment, the solder may not wrap the top surface of the connecting portion, and is only disposed between the connecting portion and the top surface of the other printed circuit board. The solder still extends to the front surface and the both sides of the connecting portion, such that the solder is still firmly attached to the connecting portion to achieve the enhancement of the resistance to pull.
In another embodiment, the solder may not extend into the portion between the connecting portion and the top surface of the other printed circuit board, and only wraps the top surface, the front surface, and the both sides of the connecting portion, such that the solder is still firmly attached to the connecting portion to achieve the enhancement of the resistance to pull.
In another embodiment, the flexible printed circuit board or the rigid printed circuit board may be altered in other structures other than two insulated layers and a conductive layer.
In another embodiment, each one of the two printed circuit boards may have only one connecting portion. In this situation, the solder on the connecting portion still extends forward and in at least one transverse direction beyond the connecting portion, thereby increasing the contact area of the solder to enhance the resistance to pull.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
