Pads for surface mounting

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H05K1/111

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/111Pads for surface mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power delivery system
- Patent number 12,321,208
- Issue date Jun 3, 2025
- Dell Products L.P.
- Jason Charles Pritchard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
PCB pad for SMT process
- Patent number 12,324,097
- Issue date Jun 3, 2025
- Delta Electronics, Inc.
- Heng-Chao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exterior aircraft light, aircraft comprising an exterior aircraft l...
- Patent number 12,312,098
- Issue date May 27, 2025
- Goodrich Lighting Systems GmbH & Co. KG
- Marion Depta
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,309,940
- Issue date May 20, 2025
- Innolux Corporation
- Wei-Cheng Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,309,941
- Issue date May 20, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,309,929
- Issue date May 20, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for active implantable medical device
- Patent number 12,302,492
- Issue date May 13, 2025
- NeuroPace, Inc.
- Joseph Vandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure and an electronic device including the same
- Patent number 12,302,495
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yeonkyung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High speed electrical connector
- Patent number 12,300,937
- Issue date May 13, 2025
- Amphenol Commercial Products (ChengDu) Co., LTD.
- Wenfeng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad and via pattern arrangement for differential signal shielding
- Patent number 12,295,094
- Issue date May 6, 2025
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, system, and apparatus for finely pitched high speed connect...
- Patent number 12,288,943
- Issue date Apr 29, 2025
- JABIL INC.
- Marcel Moortgat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,284,758
- Issue date Apr 22, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolator
- Patent number 12,279,362
- Issue date Apr 15, 2025
- Kabushiki Kaisha Toshiba
- Yoshinari Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for light-emitting diode assembly, backlight unit inc...
- Patent number 12,271,079
- Issue date Apr 8, 2025
- Dongwoo Fine-Chem Co., Ltd.
- Cheol Hun Lee
- G02 - OPTICS
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,274,000
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Sang Hun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mold adhesion boundary for die attach pad
- Patent number 12,274,006
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, power conversion apparatus, moving body, and...
- Patent number 12,267,955
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Takeshi Higashihata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of electronic component
- Patent number 12,267,956
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Noboru Serita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,256,500
- Issue date Mar 18, 2025
- STEMCO CO., LTD.
- Jin Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,256,492
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250185180
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250185173
- Publication date Jun 5, 2025
- SAMSUNG DISPLAY CO., LTD.
- WONTAE KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250176104
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176103
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sanghyeok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS COMPRISING INTERPOSER
- Publication number 20250176106
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Euisup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE IN ELECTRICALLY CONDUCTIVE PATTERN OF FABRIC
- Publication number 20250176101
- Publication date May 29, 2025
- WAVE COMPANY CO., LTD.
- Na-Yun CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250159805
- Publication date May 15, 2025
- InnoLux Corporation
- Shang-Ru WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT
- Publication number 20250159804
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Kihun OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED INDUCTOR, CIRCUIT BOARD ASSEMBLY, AND INVERTER
- Publication number 20250149234
- Publication date May 8, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Jinkun LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ITS MANUFACTURING METHOD
- Publication number 20250151207
- Publication date May 8, 2025
- Shanghai AVIC Optoelectronics Co., Ltd.
- Akira FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151194
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...
- Publication number 20250151200
- Publication date May 8, 2025
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD
- Publication number 20250142714
- Publication date May 1, 2025
- Dell Products L.P.
- Changsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...
- Publication number 20250132291
- Publication date Apr 24, 2025
- STATS ChipPAC Pte Ltd.
- DanFeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250126703
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250126717
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Cheolmin Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE MASKING TAPE FOR CIRCUIT BOARD TABS
- Publication number 20250122409
- Publication date Apr 17, 2025
- Dell Products L.P.
- Wallace H. ABLES
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250120009
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20250113428
- Publication date Apr 3, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUE FOR FACILITATING MOUNTING OF ELECTRONIC COMPONENT ONTO PR...
- Publication number 20250106981
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- MASAYOSHI TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20250106996
- Publication date Mar 27, 2025
- VIA TECHNOLOGIES, INC.
- Nai-Shung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pads for surface mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power delivery system

PCB pad for SMT process

Exterior aircraft light, aircraft comprising an exterior aircraft l...

Wiring board, semiconductor device, and method of manufacturing wir...

Electronic device

Circuit board

High density coil design and process

Board-level pad pattern for multi-row QFN packages

Sandwich structure power supply module

High capacitance memory device

Mounting of capacitors on printed circuit boards for non-volatile m...

Interposer for active implantable medical device

Interposer structure and an electronic device including the same

High speed electrical connector

Pad and via pattern arrangement for differential signal shielding

Method, system, and apparatus for finely pitched high speed connect...

Wiring circuit board

Printed circuit board

Isolator

Circuit board for light-emitting diode assembly, backlight unit inc...

Flexible printed circuit board, COF module, and electronic device c...

Printed circuit board with mold adhesion boundary for die attach pad

Semiconductor device, power conversion apparatus, moving body, and...

Dense via pitch interconnect to increase wiring density

Leadless current sensor package with high isolation

Mounting structure of electronic component

Electrical devices with electrodes on softening polymers and method...

Circuit board and manufacturing method therefor

Printed circuit board

Nitride-based semiconductor module and method for manufacturing the...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DISPLAY APPARATUS

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SELECTIVE TRANSFER OF MICRO DEVICES

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC APPARATUS COMPRISING INTERPOSER

BONDING STRUCTURE IN ELECTRICALLY CONDUCTIVE PATTERN OF FABRIC

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ELECTRONIC DEVICE

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

INTEGRATED INDUCTOR, CIRCUIT BOARD ASSEMBLY, AND INVERTER

WIRING SUBSTRATE AND ITS MANUFACTURING METHOD

PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...

MULTI-CONFIGURABLE ANTENNA TUNER CIRCUIT BOARD

Semiconductor Device and Method of Making a Dual-Sided Bridge Die P...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

PROTECTIVE MASKING TAPE FOR CIRCUIT BOARD TABS

SEMICONDUCTOR PACKAGE

TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD

TECHNIQUE FOR FACILITATING MOUNTING OF ELECTRONIC COMPONENT ONTO PR...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC ASSEMBLY