Pads for surface mounting

Industry

CPC
H05K1/111

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/111Pads for surface mounting

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Guard trace ground via optimization for high-speed signaling
- Patent number 12,238,855
- Issue date Feb 25, 2025
- Dell Products L.P.
- Vijender Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB production by laser systems
- Patent number 12,238,862
- Issue date Feb 25, 2025
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including conductive pad and electric device...
- Patent number 12,232,259
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,232,257
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,232,258
- Issue date Feb 18, 2025
- Innolux Corporation
- Shang-Ru Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assembly
- Patent number 12,232,267
- Issue date Feb 18, 2025
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Applicator with thermal contact sensors
- Patent number 12,220,346
- Issue date Feb 11, 2025
- LIGHTFECTIVE LTD
- Yotam Zimmerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,224,121
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,224,235
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,225,661
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and display device
- Patent number 12,219,702
- Issue date Feb 4, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 12,219,710
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare circuit board
- Patent number 12,219,711
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Chun-Hsien Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,219,703
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jonghyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device
- Patent number 12,219,712
- Issue date Feb 4, 2025
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board
- Patent number 12,213,253
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Sung Wuk Ryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package and printed circuit board attachment
- Patent number 12,205,859
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hatching ground under a pad in a printed circuit board
- Patent number 12,207,391
- Issue date Jan 21, 2025
- Dell Products L.P.
- Zhenli Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Platform supports the shortest electrical connection between two QS...
- Patent number 12,207,403
- Issue date Jan 21, 2025
- Shuang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
- Patent number 12,207,411
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including electrostatic discharge path
- Patent number 12,181,936
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Donghyeon Yeo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...
- Publication number 20250079279
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT FOR INTEGRATION INTO A SMART CARD, SMART CARD WITH...
- Publication number 20250079688
- Publication date Mar 6, 2025
- Linxens Holding
- Yean-Wei YEAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081337
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMPING STRUCTURE
- Publication number 20250071888
- Publication date Feb 27, 2025
- Apple Inc.
- Shawn X. ARNOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250071889
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250071896
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATES AND ELECTRONIC APPARATUSES
- Publication number 20250056710
- Publication date Feb 13, 2025
- Hefei BOE Ruisheng Technology Co., Ltd.
- Jiawei XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL INLINE POWER MODULE
- Publication number 20250056738
- Publication date Feb 13, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME
- Publication number 20250048550
- Publication date Feb 6, 2025
- The Charles Stark Draper Laboratory, Inc.
- William A. ROY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
- Publication number 20250040038
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE (LED) PACKAGE AND ILLUMINATING DEVICE INCLUDIN...
- Publication number 20250031507
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jongho LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Welded and Soldered Connections to Flexible Interconnect Ci...
- Publication number 20250024605
- Publication date Jan 16, 2025
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM
- Publication number 20250024600
- Publication date Jan 16, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Charles SOURIAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING ASSEMBLY AND OPTO-ELECTROMECHANICAL DEVICE...
- Publication number 20250015067
- Publication date Jan 9, 2025
- Rayprus Technology (Foshan) Co., Ltd.
- HSIN-YEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND LIGHT-EMITTING PANEL WITH CIRCUIT BOARD
- Publication number 20250008649
- Publication date Jan 2, 2025
- AUO Corporation
- Chieh-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250008650
- Publication date Jan 2, 2025
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- CLINTON LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION
- Publication number 20250008656
- Publication date Jan 2, 2025
- Meta Platforms Technologies, LLC
- Andrew Matthew BARDAGJY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND CIRCUIT BOARD
- Publication number 20240422913
- Publication date Dec 19, 2024
- Murata Manufacturing Co., Ltd.
- Ryutatsu MIZUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION
- Publication number 20240421516
- Publication date Dec 19, 2024
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE-SPEED WITCH MODULE HAVING A DISCRETE ON/OFF DETECTION PAD
- Publication number 20240422903
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Sefa HAZIR
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pads for surface mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and electronic device including same

Connection structure and method of forming the same

Flexible pressure sensors and user interfaces

Guard trace ground via optimization for high-speed signaling

PCB production by laser systems

Printed circuit board including conductive pad and electric device...

Wiring substrate

Electronic device

Electronics assembly

Applicator with thermal contact sensors

Multilayer capacitor and board having the same mounted thereon

Printed circuit board

Multilayer substrate

Wiring substrate and display device

Apparatus and power module

Display apparatus

Bare circuit board

Printed circuit board

Printed circuit board and electronic device

Printed circuit board

Conductive ink interconnected devices

Package and printed circuit board attachment

Hatching ground under a pad in a printed circuit board

Platform supports the shortest electrical connection between two QS...

Printed wiring boards, printed wiring board assemblies, and electro...

Component carrier having a double dielectric layer and method of ma...

Fine pitch copper pillar package and method

Wiring substrate and method for manufacturing wiring substrate

Electronic device including electrostatic discharge path

Method and apparatus for flexible circuit cable attachment

Patents Applicationslast 30 patents

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...

PRINTED CIRCUIT FOR INTEGRATION INTO A SMART CARD, SMART CARD WITH...

BONDED STRUCTURES

PRINTED CIRCUIT BOARD

DAMPING STRUCTURE

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

WIRING SUBSTRATES AND ELECTRONIC APPARATUSES

DUAL INLINE POWER MODULE

High Density 3D Interconnect Configuration

TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME

Advanced Device Assembly Structures And Methods

ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD

Printed Circuits with Embedded Resistive Thermal Devices

PRINTED CIRCUIT BOARD

LIGHT EMITTING DIODE (LED) PACKAGE AND ILLUMINATING DEVICE INCLUDIN...

Forming Welded and Soldered Connections to Flexible Interconnect Ci...

INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM

CHIP SYSTEM AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGING ASSEMBLY AND OPTO-ELECTROMECHANICAL DEVICE...

CIRCUIT BOARD AND LIGHT-EMITTING PANEL WITH CIRCUIT BOARD

CONTACT HEIGHT ADJUSTMENT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

WIRE BONDING FOR MINIATURIZING PRINTED CIRCUIT INTERCONNECTION

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

CIRCUIT MODULE AND CIRCUIT BOARD

TECHNIQUES FOR A MODULE CONNECTOR DESIGN TO IMPROVE PIN CONNECTION

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

VARIABLE-SPEED WITCH MODULE HAVING A DISCRETE ON/OFF DETECTION PAD

HEATSINK BASED POWER DELIVERY FOR CPUS