Pads for surface mounting

Industry

CPC
H05K1/111

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/111Pads for surface mounting

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Circuit board for light-emitting diode assembly, backlight unit inc...
- Patent number 12,271,079
- Issue date Apr 8, 2025
- Dongwoo Fine-Chem Co., Ltd.
- Cheol Hun Lee
- G02 - OPTICS
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,274,000
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Sang Hun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mold adhesion boundary for die attach pad
- Patent number 12,274,006
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dense via pitch interconnect to increase wiring density
- Patent number 12,266,598
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Francesco Preda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, moving body, and...
- Patent number 12,267,955
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Takeshi Higashihata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure of electronic component
- Patent number 12,267,956
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Noboru Serita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 12,262,481
- Issue date Mar 25, 2025
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,256,500
- Issue date Mar 18, 2025
- STEMCO CO., LTD.
- Jin Han Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,256,492
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,254,803
- Issue date Mar 18, 2025
- Samsung Display Co., Ltd.
- Tae Hoon Kwon
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Capacitor bank assembly
- Patent number 12,250,771
- Issue date Mar 11, 2025
- Rockwell Collins, Inc.
- Martin J. Jennings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device including same
- Patent number 12,245,373
- Issue date Mar 4, 2025
- ASUSTeK COMPUTER Inc.
- Ping-Han Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and method of forming the same
- Patent number 12,243,813
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Guard trace ground via optimization for high-speed signaling
- Patent number 12,238,855
- Issue date Feb 25, 2025
- Dell Products L.P.
- Vijender Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB production by laser systems
- Patent number 12,238,862
- Issue date Feb 25, 2025
- IO Tech Group Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including conductive pad and electric device...
- Patent number 12,232,259
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,232,257
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Shunsuke Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,232,258
- Issue date Feb 18, 2025
- Innolux Corporation
- Shang-Ru Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assembly
- Patent number 12,232,267
- Issue date Feb 18, 2025
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Applicator with thermal contact sensors
- Patent number 12,220,346
- Issue date Feb 11, 2025
- LIGHTFECTIVE LTD
- Yotam Zimmerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,224,121
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,224,235
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,225,661
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and display device
- Patent number 12,219,702
- Issue date Feb 4, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display apparatus
- Patent number 12,219,710
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20250113428
- Publication date Apr 3, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUE FOR FACILITATING MOUNTING OF ELECTRONIC COMPONENT ONTO PR...
- Publication number 20250106981
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- MASAYOSHI TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20250106996
- Publication date Mar 27, 2025
- VIA TECHNOLOGIES, INC.
- Nai-Shung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20250104902
- Publication date Mar 27, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPACT INTERFACE THROUGH HINGE CONNECTOR
- Publication number 20250106995
- Publication date Mar 27, 2025
- Apple Inc.
- Parin R Dedhia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME
- Publication number 20250107004
- Publication date Mar 27, 2025
- Kyocera Corporation
- Rintaro KAMIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Source Printed Circuit Board and Display Device
- Publication number 20250104652
- Publication date Mar 27, 2025
- LG Display Co., Ltd.
- ChulWoo Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250098060
- Publication date Mar 20, 2025
- AT&S (Chongqing) Company Limited
- Lei Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250089171
- Publication date Mar 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...
- Publication number 20250081357
- Publication date Mar 6, 2025
- Western Digital Technologies, Inc.
- Nadav Tsur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...
- Publication number 20250079279
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT FOR INTEGRATION INTO A SMART CARD, SMART CARD WITH...
- Publication number 20250079688
- Publication date Mar 6, 2025
- Linxens Holding
- Yean-Wei YEAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081337
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMPING STRUCTURE
- Publication number 20250071888
- Publication date Feb 27, 2025
- Apple Inc.
- Shawn X. ARNOLD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250071889
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20250071896
- Publication date Feb 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATES AND ELECTRONIC APPARATUSES
- Publication number 20250056710
- Publication date Feb 13, 2025
- Hefei BOE Ruisheng Technology Co., Ltd.
- Jiawei XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL INLINE POWER MODULE
- Publication number 20250056738
- Publication date Feb 13, 2025
- Wolfspeed, Inc.
- Brice McPherson
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME
- Publication number 20250048550
- Publication date Feb 6, 2025
- The Charles Stark Draper Laboratory, Inc.
- William A. ROY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD
- Publication number 20250040038
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuits with Embedded Resistive Thermal Devices
- Publication number 20250036176
- Publication date Jan 30, 2025
- Apple Inc.
- Anne M. Mason
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE (LED) PACKAGE AND ILLUMINATING DEVICE INCLUDIN...
- Publication number 20250031507
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jongho LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Welded and Soldered Connections to Flexible Interconnect Ci...
- Publication number 20250024605
- Publication date Jan 16, 2025
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM
- Publication number 20250024600
- Publication date Jan 16, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Charles SOURIAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SYSTEM AND ELECTRONIC DEVICE
- Publication number 20250014976
- Publication date Jan 9, 2025
- Huawei Technologies Co., Ltd
- Yilu Liu
- H01 - BASIC ELECTRIC ELEMENTS

Pads for surface mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board for light-emitting diode assembly, backlight unit inc...

Flexible printed circuit board, COF module, and electronic device c...

Printed circuit board with mold adhesion boundary for die attach pad

Dense via pitch interconnect to increase wiring density

Semiconductor device, power conversion apparatus, moving body, and...

Leadless current sensor package with high isolation

Mounting structure of electronic component

Electrical devices with electrodes on softening polymers and method...

Circuit board and manufacturing method therefor

Printed circuit board

Nitride-based semiconductor module and method for manufacturing the...

Electronic component mounting substrate, electronic component mount...

Display device

Capacitor bank assembly

Printed circuit board and electronic device including same

Connection structure and method of forming the same

Flexible pressure sensors and user interfaces

Guard trace ground via optimization for high-speed signaling

PCB production by laser systems

Printed circuit board including conductive pad and electric device...

Wiring substrate

Electronic device

Electronics assembly

Applicator with thermal contact sensors

Multilayer capacitor and board having the same mounted thereon

Printed circuit board

Multilayer substrate

Wiring substrate and display device

Apparatus and power module

Display apparatus

Patents Applicationslast 30 patents

TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD

TECHNIQUE FOR FACILITATING MOUNTING OF ELECTRONIC COMPONENT ONTO PR...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC ASSEMBLY

MANUFACTURING METHOD OF POWER MODULE

COMPACT INTERFACE THROUGH HINGE CONNECTOR

WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME

Source Printed Circuit Board and Display Device

Component Carrier and Method of Manufacturing the Same

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

INTERPOSER FOR TROUBLESHOOTING A BALL GRID ARRAY (BGA) DEVICE AND C...

ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...

PRINTED CIRCUIT FOR INTEGRATION INTO A SMART CARD, SMART CARD WITH...

BONDED STRUCTURES

PRINTED CIRCUIT BOARD

DAMPING STRUCTURE

FLEXIBLE CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

WIRING SUBSTRATES AND ELECTRONIC APPARATUSES

DUAL INLINE POWER MODULE

TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME

High Density 3D Interconnect Configuration

Advanced Device Assembly Structures And Methods

ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD

Printed Circuits with Embedded Resistive Thermal Devices

PRINTED CIRCUIT BOARD

LIGHT EMITTING DIODE (LED) PACKAGE AND ILLUMINATING DEVICE INCLUDIN...

Forming Welded and Soldered Connections to Flexible Interconnect Ci...

INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM

CHIP SYSTEM AND ELECTRONIC DEVICE