Pads for surface mounting

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H05K1/111

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/111Pads for surface mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit forming method
- Patent number 12,369,259
- Issue date Jul 22, 2025
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High durability solder terminals
- Patent number 12,356,545
- Issue date Jul 8, 2025
- Skyworks Solutions, Inc.
- Yuji Yashiro
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Low profile SODIMM (small outline dual inline memory module)
- Patent number 12,349,274
- Issue date Jul 1, 2025
- Intel Corporation
- Raghavendra Rao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics module with raceway and submodules
- Patent number 12,342,477
- Issue date Jun 24, 2025
- Honeywell Federal Manufacturing & Technologies, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus, load and electronic device
- Patent number 12,342,450
- Issue date Jun 24, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Wulong Cong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory module connection interface for power delivery
- Patent number 12,342,461
- Issue date Jun 24, 2025
- Dell Products L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 12,334,262
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pads with concave edges for ball grid arrays
- Patent number 12,328,826
- Issue date Jun 10, 2025
- MOTOROLA SOLUTIONS, INC.
- Edwin L Bradley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,328,817
- Issue date Jun 10, 2025
- LG Innotek Co., Ltd
- Eon Jong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module, intermediate connection member, and electronic d...
- Patent number 12,327,938
- Issue date Jun 10, 2025
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery system
- Patent number 12,321,208
- Issue date Jun 3, 2025
- Dell Products L.P.
- Jason Charles Pritchard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
PCB pad for SMT process
- Patent number 12,324,097
- Issue date Jun 3, 2025
- Delta Electronics, Inc.
- Heng-Chao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exterior aircraft light, aircraft comprising an exterior aircraft l...
- Patent number 12,312,098
- Issue date May 27, 2025
- Goodrich Lighting Systems GmbH & Co. KG
- Marion Depta
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,309,940
- Issue date May 20, 2025
- Innolux Corporation
- Wei-Cheng Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,309,941
- Issue date May 20, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,309,929
- Issue date May 20, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting of capacitors on printed circuit boards for non-volatile m...
- Patent number 12,309,942
- Issue date May 20, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for active implantable medical device
- Patent number 12,302,492
- Issue date May 13, 2025
- NeuroPace, Inc.
- Joseph Vandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure and an electronic device including the same
- Patent number 12,302,495
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yeonkyung Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High speed electrical connector
- Patent number 12,300,937
- Issue date May 13, 2025
- Amphenol Commercial Products (ChengDu) Co., LTD.
- Wenfeng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad and via pattern arrangement for differential signal shielding
- Patent number 12,295,094
- Issue date May 6, 2025
- Marvell Israel (M.I.S.L) Ltd.
- Dan Azeroual
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, system, and apparatus for finely pitched high speed connect...
- Patent number 12,288,943
- Issue date Apr 29, 2025
- JABIL INC.
- Marcel Moortgat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,284,758
- Issue date Apr 22, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND DISPLAY APPARATUS
- Publication number 20250240872
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuang LEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Cooling Using PCB Through Holes
- Publication number 20250240878
- Publication date Jul 24, 2025
- Jordan K. Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER FOR ACTIVE IMPLANTABLE MEDICAL DEVICE
- Publication number 20250240886
- Publication date Jul 24, 2025
- NeuroPace, Inc.
- Joseph Vandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MEMBER
- Publication number 20250234453
- Publication date Jul 17, 2025
- Hitachi, Ltd
- Daigo KOMESU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
- Publication number 20250227837
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- John A. Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...
- Publication number 20250227854
- Publication date Jul 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...
- Publication number 20250227840
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Sang Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING SOLDER WALL
- Publication number 20250227852
- Publication date Jul 10, 2025
- Samsung Electronics Co., LTD
- Eun-seok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250218968
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Buwon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250210272
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Sik WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC BOARD
- Publication number 20250212329
- Publication date Jun 26, 2025
- Lenovo (Beijing) Limited
- Seiji Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEM DUAL LAYER MODULAR PRINTED CIRCUIT BOAR...
- Publication number 20250203777
- Publication date Jun 19, 2025
- Dell Products L.P.
- Allen B. McKittrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20250191841
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Moon Soo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20250193997
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250185180
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250185173
- Publication date Jun 5, 2025
- SAMSUNG DISPLAY CO., LTD.
- WONTAE KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250176104
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176103
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sanghyeok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS COMPRISING INTERPOSER
- Publication number 20250176106
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Euisup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE IN ELECTRICALLY CONDUCTIVE PATTERN OF FABRIC
- Publication number 20250176101
- Publication date May 29, 2025
- WAVE COMPANY CO., LTD.
- Na-Yun CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250159805
- Publication date May 15, 2025
- InnoLux Corporation
- Shang-Ru WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250157910
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS

Pads for surface mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit forming method

Printed wiring board and method for manufacturing printed wiring board

Electronic substrate and electronic device

High durability solder terminals

Low profile SODIMM (small outline dual inline memory module)

Electronics module with raceway and submodules

Power supply apparatus, load and electronic device

Memory module connection interface for power delivery

Multilayer ceramic capacitor and board having the same

Solder pads with concave edges for ball grid arrays

Flexible printed circuit board, COF module, and electronic device c...

Electronic module, intermediate connection member, and electronic d...

Power delivery system

PCB pad for SMT process

Exterior aircraft light, aircraft comprising an exterior aircraft l...

Wiring board, semiconductor device, and method of manufacturing wir...

Electronic device

Circuit board

High density coil design and process

Board-level pad pattern for multi-row QFN packages

Sandwich structure power supply module

High capacitance memory device

Mounting of capacitors on printed circuit boards for non-volatile m...

Interposer for active implantable medical device

Interposer structure and an electronic device including the same

High speed electrical connector

Pad and via pattern arrangement for differential signal shielding

Method, system, and apparatus for finely pitched high speed connect...

Wiring circuit board

Printed circuit board

Patents Applicationslast 30 patents

CIRCUIT BOARD AND DISPLAY APPARATUS

Liquid Cooling Using PCB Through Holes

INTERPOSER FOR ACTIVE IMPLANTABLE MEDICAL DEVICE

COMPOSITE MEMBER

SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...

ELECTRONIC DEVICE COMPRISING SOLDER WALL

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

MULTILAYER ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD

ELECTRONIC BOARD

INFORMATION HANDLING SYSTEM DUAL LAYER MODULAR PRINTED CIRCUIT BOAR...

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DISPLAY APPARATUS

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SELECTIVE TRANSFER OF MICRO DEVICES

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC APPARATUS COMPRISING INTERPOSER

BONDING STRUCTURE IN ELECTRICALLY CONDUCTIVE PATTERN OF FABRIC

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ELECTRONIC DEVICE

CONNECTION STRUCTURE AND METHOD OF FORMING THE SAME