Connection arrangement and method for optical communications

Abstract

An arrangement for connecting an electronic subassembly and an optical subassembly in an electro-optical communication device such as an electro-optical transceiver. The arrangement includes a body of a rigid dielectric material for mounting e.g. on the optical subassembly. The body has electrically conductive pathways provided thereon and includes a shaped portion providing a socket-like formation. At least one electrical contact element is coupled with e.g. the electronic subassembly. The electrical contact element is pluggable into the socket-like formation of the body of rigid dielectric material and includes an elastic device adapted to elastically co-operate with the socket-like formation of the body of rigid dielectric material to retain the electrical contact element plugged in the socket-like formation to provide electrical contact with the electrically conductive pathways provide thereon, while permitting vibrational displacement of the electrical contact element within the socket-like formation.

Description

The invention will now be described, by way of example only, with reference to the enclosed figures of drawing, wherein:

FIGS. 1 and 2 have been already described in the foregoing,

FIG. 3 represents, by way of direct comparison to the representation of FIG. 2, a first possible embodiment of the arrangement described herein, and.

FIG. 4 represents, again by way of direct comparison to the representation of FIG. 2, a second possible embodiment of the arrangement described herein.

Claims

1. An arrangement for connecting an electronic subassembly and an optical subassembly in an electro-optical communication device, the arrangement including: a body of a rigid dielectric material for mounting on the one of said electronic subassembly and said optical subassembly, said body having electrically conductive pathways provided thereon and including a shaped portion providing a socket-like formation; andat least one electrical contact element for coupling with the other of said electronic subassembly and said optical subassembly, said at least one electrical contact element being pluggable into said socket-like formation of said body of a rigid dielectric material; said at least one electrical contact element including elastic means adapted to elastically co-operate with said socket-like formation of said body of a rigid dielectric material to retain said at least one electrical contact element plugged in said socket-like formation to provide electrical contact with said electrically conductive pathways in said body of a rigid dielectric material, while permitting vibrational displacement of said at least one electrical contact element within said socket-like formation.

2. The arrangement of claim 1, wherein said body of a rigid dielectric material includes a body of a material selected out of a ceramics material and glass.

3. The arrangement of claim 2, wherein said body of a rigid dielectric material includes a body of alumina.

4. The arrangement of claim 1, wherein said body of a rigid dielectric material is a feedthrough provided in the casing of said optical subassembly.

5. The arrangement of claim 1, wherein said body of a rigid dielectric material includes two pod-like extensions jointly defining said socket-like formation.

6. The arrangement of claim 1, wherein said at least one electrical contact element is provided with metallisation patterns that constitute by themselves said elastic means adapted to elastically co-operate with said socket-like formation of said body of a rigid dielectric material.

7. The arrangement of claim 6, wherein said metallisation patterns are in the form of bumps.

8. The arrangement of claim 1, wherein said at least one electrical contact element is provided with metallisation patterns having associated said elastic means adapted to elastically co-operate with said socket-like formation of said body of a rigid dielectric material.

9. The arrangement of claim 1, wherein said at least one of said socket-like formation and said at least one electrical contact element has associated at least one lateral mechanical guide to lock said socket-like formation and said at least one electrical contact element into position after said at least electrical contact element is plugged into said socket-like formation.

10. The arrangement of claim 1, wherein said at least one of said socket-like formation has a closed shape, such as an annular shape.

11. The arrangement of claim 1, wherein said at least one electrical contact element is carried by a flexible element.

12. The arrangement of claim 11, wherein said flexible element is a flexible printed circuit board.

13. A method of connecting an electronic subassembly and an optical subassembly in an electro-optical communication device, the method including the steps of: mounting on the one of said electronic subassembly and said optical subassembly a body of a rigid dielectric material, said body having electrically conductive pathways provided thereon and including a shaped portion providing a socket-like formation;coupling with the other of said electronic subassembly and said optical subassembly at least one electrical contact element including elastic means (128) adapted to elastically co-operate with said socket-like formation of said body of a rigid dielectric material to retain said at least one electrical contact element plugged in said socket-like formation to provide electrical contact with said electrically conductive pathways in said body of a rigid dielectric material, while permitting vibrational displacement of said at least one electrical contact element within said socket-like formation; andplugging said at least one electrical contact element into said socket-like formation of said body of a rigid dielectric material.