CONNECTOR ASSEMBLY

Abstract

The present disclosure provides a connector assembly including a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell and includes a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate. The heat dissipating base plate has a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region. The solder is provided within the soldering region in a manner such that a face of the soldering region is covered by the solder.

Description

RELATED APPLICATION

This application claims priority to Chinese Application Serial No. 201921769509.7, filed on Oct. 18, 2019, which is incorporated by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to a connector assembly, and particularly relates to a connector assembly having a heat sink.

BACKGROUND

Chinese invention patent application issuance publication No. CN101959389B (corresponding to U.S. Pat. Nos. 8,245,763B2, 8,459,336B2 and 8,578,605B2) discloses a heat dissipating device, in which heat dissipating fins and a heat pipe are assembled by a soldering manner, surfaces of the heat dissipating fins which are connected with the heat pipe are provided with a guiding trace line, the guiding trace line is used to guide a solder paste to be coated on the surfaces of the heat dissipating fins.

Chinese utility model patent application issuance publication No. CN206160785U discloses a heat sink, the heat sink includes a heat dissipating fin, a bottom plate and a heat pipe limited between the heat dissipating fin and the bottom plate. The bottom plate is formed with a heat pipe lower groove which receives the heat pipe, the heat dissipating fin is formed with a heat pipe upper groove which corresponds to the heat pipe lower groove, in the process of soldering, the heat pipe upper groove is not fully filled by a solder, and a gap is remained at the solder to accommodate a redundant part of the solder.

The technical features of the above two prior arts are only to solve a problem in soldering between the heat dissipating fin and the heat pipe, but are not to solve a problem in soldering between the heat dissipating fin and the bottom plate. The problem in soldering between the heat dissipating fin and the bottom plate in the prior art lies in overflowing of the solder at a rim of the bottom plate and the efficiency of the heat dissipation after soldering.

In order to have higher heat dissipating efficiency, existing heat dissipating fins are arranged on a whole top face of the bottom plate, in order to reduce overflowing of the solder, the whole top face of the bottom plate will not completely coated with a solder paste when the solder paste is coated, for example, an coating manner employs a grid node arrangement manner to coat a solder paste, but such a coating manner will result in that a soldering between the heat dissipating fins and the top face of the bottom plate is spot soldering, that is, many gaps without the solder paste are present between the heat dissipating fins and the top face of the bottom plate, and thus will affect heat dissipating efficiency. And such a coating manner of the solder paste in the grid node arrangement is still necessary to precisely control an amount of the solder paste, otherwise the problem in overflowing of the solder at the rim of the bottom plate still occurs.

SUMMARY

Therefore, an object of the present disclosure is to provide a connector assembly which can improve at least one deficiency in prior art.

Accordingly, in some embodiments, a connector assembly of the present disclosure comprises a receptacle connector, a shielding shell and a heat sink. The shielding shell covers the receptacle connector. The heat sink is assembled to the shielding shell, the heat sink comprises a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate, the heat dissipating base plate has a soldering region on which a solder is provided and a recessed channel which is provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region, the solder is provided within the soldering region in a manner that a whole face of the soldering region is covered by the solder.

In some embodiments, the heat dissipating fin is formed by arranging and assembling a plurality of heat dissipating sheets which each are in the form of a sheet, each heat dissipating sheet has an edgewise bend which is soldered on the soldering region of the heat dissipating base plate.

In some embodiments, the heat dissipating base plate has a plurality of soldering regions which are spaced apart from each other, the recessed channel is a recessed channel which extends continuously along the rim of the heat dissipating base plate and surrounds the plurality of soldering regions.

In some embodiments, the heat sink further comprises a clip which is limited between the heat dissipating base plate and the heat dissipating fin which have been engaged with each other, the heat sink is assembled to the shielding shell with the clip.

In some embodiments, the heat dissipating fin is provided with a receiving groove to partially receive the clip.

In some embodiments, the shielding shell has a wall used to assemble the heat sink, the wall is provided with a window, the heat dissipating base plate of the heat sink is provided with a contacting plate which passes through the window.

In some embodiments, the heat dissipating base plate further has a pressing region which correspondingly positioned between the adjacent soldering regions, the pressing region corresponds to the receiving groove of the heat dissipating fin in position and is used to allow the clip to elastically press against, the recessed channel extends continuously along the rim of the heat dissipating base plate and surrounds the plurality of soldering regions and the pressing region.

In the present disclosure, the recessed channel which is provided around the outer periphery of the soldering region of the heat dissipating base plate collects and accommodates a part of the solder (for example tin paste) which is squeezed out of the soldering region to prevent the solder from overflowing the rim of the heat dissipating base plate, thus the solder can be provided to the soldering region in a manner that the whole face of the soldering region is covered by the solder and the solder can be connected between the heat dissipating fin and the heat dissipating base plate in a manner that a gap between the heat dissipating fin and the heat dissipating base plate in the soldering region is fully filled, so as to increase heat dissipating efficacy.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and technical effects of the present disclosure will be apparent in an embodiment referring to the accompanying figures, in which:

FIG. 1 is a perspective view of an embodiment of a connector assembly of the present disclosure;

FIG. 2 is a perspective exploded view of FIG. 1;

FIG. 3 is a perspective exploded view of a heat sink of the embodiment;

FIG. 4 is a perspective view of the heat sink of the embodiment viewed from bottom;

FIG. 5 is a perspective exploded view of a heat dissipating fin of the heat sink of the embodiment;

FIG. 6 is a schematic top view of a heat dissipating base plate of the heat sink of the embodiment, in which solder is in a state before soldering;

FIG. 7 is a schematic cross-sectional view taken along a line A-A of FIG. 6;

FIG. 8 is a schematic top view of the heat sink of the embodiment, in which the solder is in a state after soldering; and

FIG. 9 is a partial schematic cross-sectional view taken along a line B-B of FIG. 8.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Before the present disclosure is described in detail, it should be noted that like elements are denoted by the same reference numerals in the following description.

Referring to FIG. 1 and FIG. 2, an embodiment of a connector assembly 100 of the present disclosure is configured to mate with a mating module (not shown), the connector assembly 100 includes a receptacle connector 1, a shielding shell 2 and a heat sink 3.

The receptacle connector 1 is configured to be mechanically and electrically provided to a circuit board (not shown), the receptacle connector 1 has a housing 11 which is insulative and a plurality of terminals 12, the housing 11 has an insertion groove 111, the plurality of terminals 12 are provided in the insertion groove 111 and tail portions (not shown) of the plurality of terminals 12 are electrically and mechanically connected to the circuit board. The shielding shell 2 comprises a metal material, for example, and covers the receptacle connector 1, the shielding shell 2 extends along a front-rear direction D1 and has a top wall 21, a bottom wall 22 which faces and is spaced apart from the top wall 21 along an up-down direction D2, two side walls 23 which face and are spaced apart from each other along a left-right direction D3 and are respectively connected to two sides of the top wall 21 and the bottom wall 22, a rear wall 24 which is positioned at a rear end of the shielding shell 2 and connected to rear edges of the top wall 21 and the two side walls 23, and a plurality of insertion legs 25 which extend downwardly from the two side walls 23 and are adapted to be fixed on the circuit board and/or be connected to a ground trace. In addition, the shielding shell 2 further has a receiving cavity 26 which is defined by the top wall 21, the bottom wall 22, the two side walls 23 and the rear wall 24 together and positioned inside, an insertion opening 261 which is positioned at a front end of the shielding shell 2, in communication with the receiving cavity 26 and allows the mating module to insert, and a bottom opening 262 which is positioned behind the bottom wall 22 and in communication with the receiving cavity 26. Specifically, the receptacle connector 1 is provided to a rear segment of the receiving cavity 26 via the bottom opening 262 so as to be covered by the shielding shell 2, but the present disclosure is not limited thereto. After the mating module enters into the shielding shell 2 via the insertion opening 261, a mating portion (not shown) of the mating module can insert into the insertion groove 111 of the receptacle connector 1. Moreover, a plurality of grounding elements 27 are provided at the insertion opening 261 of the shielding shell 2, the grounding element 27 has a plurality of elastic fingers 271 which extend rearwardly from a position at the insertion opening 261 and are distributed to an outer side of the shielding shell 2 and an inner side of the shielding shell 2, the elastic fingers 271 positioned at the outer side of the shielding shell 2 are used to contact a case (not shown), the elastic fingers 271 positioned at the inner side of the shielding shell 2 are used to contact the mating module.

Referring to FIGS. 1 to 7, the heat sink 3 is assembled to the shielding shell 2, the heat sink 3 includes a heat dissipating base plate 31, a heat dissipating fin 32 soldered on the heat dissipating base plate 31 and two clips 33. The heat dissipating base plate 31 has a soldering region 311 which is positioned at a top face of the heat dissipating base plate 31 and allows a solder 200 (see FIG. 7, may be soldering tin) to be provided thereon and a recessed channel 312 which is formed to the top face of the heat dissipating base plate 31 and is positioned between a rim of the heat dissipating base plate 31 and an outer periphery of the soldering region 311. In the embodiment, the heat dissipating base plate 31 has three soldering regions 311 which are spaced apart from each other along the front-rear direction D1, the recessed channel 312 is a recessed channel 312 which extends continuously along the rim of the heat dissipating base plate 31 and surrounds the three soldering regions 311. It is noted that, in other varied embodiments, the soldering region 311 also may be single, which is not limited to the embodiment. The heat dissipating fin 32 is formed by arranging and assembling a plurality of heat dissipating sheets 321 which each are in sheet form, the plurality of heat dissipating sheets 321 extend along the front-rear direction D1 and are arranged parallel to each other and latched with each other. Each heat dissipating sheet 321 has edgewise bends 321a which are positioned at an upper edge and a lower edge of the heat dissipating sheet 321, a plurality of latching protrusion 321b which are formed to the upper edge and the lower edge of the heat dissipating sheet 321, and a plurality of latching holes 321c which are formed to the upper edge and the lower edge and allow the latching protrusions 321b of the adjacent heat dissipating sheet 321 to latch therewith, so that the plurality of heat dissipating sheets 321 are sequentially fixed with each other by latching, and furthermore, a pressing indentation may be provided to a latching position between each latching protrusion 321b and the latching hole 321c in the same column of the latching protrusions 321b and the latching holes 321c by pressing so as to strengthen engagement strength between the heat dissipating sheets 321. The edgewise bend 321a of the edgewise bends 321a positioned at the lower edge of the heat dissipating sheet 321 is soldered on the soldering region 311 of the heat dissipating base plate 31.

A shown in FIG. 6 and FIG. 7, before soldering, the solder 200 may be provided within the soldering region 311 in a manner that a whole face of the soldering region 311 is covered by the solder 200 by means of coating or printing, for example. After soldering, as shown in FIG. 8 and FIG. 9, the heat dissipating fin 32 is soldered to the soldering region 311 of the heat dissipating base plate 31, the recessed channel 312 which is provided around the outer periphery of the soldering region 311 of the heat dissipating base plate 31 collects and accommodates a part of the solder 200 which is squeezed out of the soldering region 311, so as to prevent the solder 200 from overflowing the rim of the heat dissipating base plate 31, thus the solder 200 can be provided to the soldering region 311 in a manner that the whole face of the soldering region 311 is covered by the solder 200 and the solder 200 can be connected between the heat dissipating fin 32 and the heat dissipating base plate 31 in a manner that a gap between the heat dissipating fin 32 and the heat dissipating base plate 31 in the soldering region 311 is fully filled, so as to increase heat dissipating efficacy.

Returning to refer to FIG. 1 to FIG. 4 and FIG. 6, the two clips 33 are limited between the heat dissipating base plate 31 and the heat dissipating fin 32 which have been engaged with each other, and the two clips 33 are arranged along the front-rear direction D1. The heat sink 3 is assembled to the top wall 21 of the shielding shell 2 by the two clips 33 being latched to the two side walls 23 of the shielding shell 2. The shielding shell 2 further includes four latching tabs 231 which respectively protrude outwardly from the two side walls 23, each clip 33 has a pressing segment 331 which extends along the left-right direction D3, is interposed between the heat dissipating base plate 31 and the heat dissipating fin 32 and is in strip form and two latching segments 332 which extend downwardly from two ends the pressing segment 331 in the left-right direction D3 and are respectively latched to the two side walls 23 of the shielding shell 2, each latching segment 332 is formed with a latching aperture 332a which allows the corresponding latching tab 231 of the shielding shell 2 to latch therewith. In the embodiment, the heat dissipating fin 32 is provided with two receiving grooves 322 which respectively receive the two pressing segments 331 of the two clips 33. The heat dissipating base plate 31 further has two pressing regions 313 which are positioned at the top face of the heat dissipating base plate 31 and which each are positioned between two adjacent soldering regions 311, the two pressing regions 313 correspond to the two receiving grooves 322 of the heat dissipating fin 32 in position, the recessed channel 312 of the heat dissipating base plate 31 extends continuously along the rim of heat dissipating base plate 31 and surrounds the three soldering regions 311 and the two pressing regions 313. The solder 200 is not provided on the two pressing regions 313 and the two pressing regions 313 are used to allow the two pressing segments 331 of the two clips 33 to elastically and downwardly press against respectively, so as to attach the heat sink 3 to the top wall 21 of the shielding shell 2.

In the embodiment, the shielding shell 2 further has a window 263 which extends rearwardly along the front-rear direction D1, is provided to the top wall 21 and in communication with the receiving cavity 26, the heat dissipating base plate 31 of the heat sink 3 is provided with a contacting plate 314 at a bottom face of the heat dissipating base plate 31 to pass through the window 263, the contacting plate 314 is used to contact the mating module entering into the shielding shell 2 via the insertion opening 261 to cooperatively dissipate heat, although the contacting plate 314 is integrally formed to the heat dissipating base plate 31 in the embodiment, in other embodiments, the contacting plate 314 also may be a separate element and assembled and fixed to the heat dissipating base plate 31. In addition, the heat dissipating base plate 31 and the heat dissipating fin 32 of the heat sink 3 extend rearwardly beyond the rear wall 24 of the shielding shell 2, a part of the bottom face of the heat dissipating base plate 31 positioned behind the rear wall 24 is further provided with a plurality of heat dissipating sheet pieces 315 which protrude downwardly and extend along the front-rear direction D1. Such a configuration which extends beyond the rear wall 24 of the shielding shell 2 can increase a heat dissipating area of the heat dissipating base plate 31 and the heat dissipating fin 32, and cooperate with the plurality of heat dissipating sheet pieces 315 which are provided to a rear segment of the bottom face of the heat dissipating base plate 31, heat dissipating performance of the heat sink 3 with respect to the shielding shell 2 can be further increased.

In conclusion, in the present disclosure, the recessed channel 312 which is provided around the outer periphery of the soldering region 311 of the heat dissipating base plate 31 collects and accommodates a part of the solder 200 (for example tin paste) which is squeezed out of the soldering region 311 to prevent the solder 200 from overflowing the rim of the heat dissipating base plate 31, thus the solder 200 can be provided to the soldering region 311 in a manner that the whole face of the soldering region 311 is covered by the solder 200 and the solder 200 can be connected between the heat dissipating fin 32 and the heat dissipating base plate 31 in a manner that a gap between the heat dissipating fin 32 and the heat dissipating base plate 31 in the soldering region 311 is fully filled, so as to increase heat dissipating efficacy.

However, the above description is only for the embodiments of the present disclosure, and it is not intended to limit the implementing scope of the present disclosure, and the simple equivalent changes and modifications made according to the claims and the contents of the specification are still included in the scope of the present disclosure.

Claims

1. A connector assembly, comprising: a receptacle connector;a shielding shell covering the receptacle connector; anda heat sink assembled to the shielding shell, the heat sink comprising a heat dissipating base plate and a heat dissipating fin soldered on the heat dissipating base plate, the heat dissipating base plate having a soldering region on which solder is provided and a recessed channel provided between a rim of the heat dissipating base plate and an outer periphery of the soldering region, the solder being provided within the soldering region in a manner that a whole face of the soldering region is covered by the solder.

2. The connector assembly of claim 1, wherein the heat dissipating fin is formed by arranging and assembling a plurality of heat dissipating sheets which are each in sheet form, each heat dissipating sheet has an edgewise bend which is soldered on the soldering region of the heat dissipating base plate.

3. The connector assembly of claim 1, wherein the heat dissipating base plate has a plurality of soldering regions which are spaced apart from each other, the recessed channel is a recessed channel which extends continuously along the rim of the heat dissipating base plate and surrounds the plurality of soldering regions.

4. The connector assembly of claim 3, wherein the heat sink further comprises a clip which is limited between the heat dissipating base plate and the heat dissipating fin which have been engaged with each other, the heat sink is assembled to the shielding shell with the clip.

5. The connector assembly of claim 4, wherein the heat dissipating fin is provided with a receiving groove to partially receive the clip.

6. The connector assembly of claim 5, wherein the shielding shell has a wall used to attach the heat sink, the wall is provided with a window, the heat dissipating base plate of the heat sink is provided with a contacting plate which passes through the window.

7. The connector assembly of claim 5, wherein the heat dissipating base plate further has a pressing region which is correspondingly positioned between the adjacent soldering regions, the pressing region corresponds to the receiving groove of the heat dissipating fin in position and is used to allow the clip to elastically press against, the recessed channel extends continuously along the rim of the heat dissipating base plate and surrounds the plurality of soldering regions and the pressing region.