The invention relates to a contact pin having an angular end section that is designed in particular for connecting to a wire or plug, wherein the angular end section has an angular cross-section.
In the case of contact pins that are known from the prior art, in particular solder pins, the problem has been recognized that as the temperature of a contact pin that is being soldered to a circuit board changes, in particular as a result of thermal expansion of mutually different materials, wire-drawn contact pins that have a square or rectangular cross-section can cause a weakening of the solder site as a result of grooves occurring in the solder in the region of the aperture.
In accordance with the invention, the contact pin of the type mentioned in the introduction has a round, preferably rounded, end section that lies opposite the end section and is designed for the purpose of being soldered to a circuit board, wherein the cross-section of the round end section is embodied in a circular manner at least in sections of the periphery. The round end section provides the advantage that—in comparison to a corner in the end section—grooves are not formed in the solder. It is of further advantage that a solder connection between the contact pin and the circuit board cannot be damaged, in particular interrupted, which increases the reliability of the solder connection by means of the contact pin.
It is preferred that the round end section is produced by means of re-shaping, in particular by means of stamping, an angular end section, in particular an angular wire. The angular end section has for example a square or rectangular cross-section.
By means of the re-shaping process, in particular stamping process, a wire that has a rectangular or square cross-section and is in the form of bar stock or rolled material can be cut into contact pins that are formed in each case from a longitudinal section of the wire. The contact pin can consequently be produced in an advantageous manner from an angular wire, for example from a raw wire that is bar-shaped or is wound onto a spool.
The contact pins can be re-shaped in a circular manner with the end section that is provided for soldering purposes, which advantageously only requires the use of one further tool. Prior to being re-shaped in a circular manner, a diameter of the previously angular end section can be reduced by means of a punching process. Once the round shape has been produced, the contact pin can be inserted—by way of example by a pick-and-place machine—into an aperture of a circuit board.
The aperture can be produced by way of example by means of a rotary-bit drilling process, a laser drilling process or by means of a die-cutting process.
In a preferred embodiment, the contact pin comprises a connecting section that is formed from a longitudinal section of the contact pin and connects the angular end section to the round end section, wherein a diameter of the connecting section is tapered along a longitudinal extension of the contact pin from the angular end section towards the round end section. The contact pin thus comprises in the region of the connecting section a cross-section that tapers towards the round end section. In an advantageous manner, the tapering connecting section avoids a sharp edge as the transition from the angular end section to the round, in particular rounded, end section.
The angular, in particular rectangular or square, end section is preferably designed for connecting to a plug in particular a connector strip or a male multipoint connector. The plug or the connector strip comprises for this purpose at least one bushing that is designed for holding the end section of the contact pin in an at least in part force-fit manner and electrically contacting said end section of the contact pin.
In a preferred embodiment, the cross-section of the round end section is embodied in a circular manner. This round shape renders it possible to insert the round end section advantageously in a simple manner into the aperture of the circuit board.
In a different embodiment, the cross-section of the round end section is embodied in an elliptical manner. This elliptical shape renders it possible, in the case of an aperture that has a round cross-section, to form a gap between the round end section of the contact pin and a wall of the aperture, into which gap liquid solder can flow, in an advantageous manner at two mutually opposite surface regions of the round end section, which regions comprise a greater radius of curvature than two surface sections that are arranged adjacent thereto in the circumferential direction and have a smaller radius of curvature.
In a preferred embodiment, the cross-section of the round end section has a wavy peripheral contour. It is preferred that rounded webs are formed in the circumferential direction along the longitudinal extension and a radially inwards extending groove is formed in each case between said webs. As a consequence, a gap of a predefined size can be formed between the contact pin and a cylinder wall of the aperture in an advantageous manner in the region of the groove between two webs. The rounded areas of the webs can in each case contact the cylinder wall. Liquid solder can be drawn in between the webs in the region of the groove by means of capillary action into the gap that is formed between the webs.
The size of the gap between the contact pin and a cylinder wall of the aperture of the circuit board can thus be fixed in a precise manner. An optimum gap size can be determined by way of example in an empirical manner depending upon the solder that is being used.
The size of the gap is further advantageously to a great extent not dependent upon a positioning of the contact pin in the aperture since the webs in each case form a contact point against the wall of the aperture.
In a preferred embodiment, at least three webs and three grooves are formed along the longitudinal extension of the round end section. As a consequence, the contact pin can be advantageously centered in a precise manner in the aperture.
In a preferred embodiment, the grooves are formed in each case for the purpose of generating a capillary action for liquid solder against a wall of a circular cylindrical aperture of the circuit board, which wall contacts the webs. As a consequence, liquid solder can be drawn in an advantageous manner into the gap in the region of the groove. It is thus possible to produce a reliable solder connection and consequently also a reliable electrical contact between the contact pin and the circuit board. The aperture comprises for this purpose a metal layer by way of example in the region of the wall of the aperture. The metal layer can be formed by way of example by means of a galvanizing process. The metal layer can be formed in a different embodiment by means of a sleeve or a rivet.
The invention also relates to a circuit board having at least one contact pin of the type previously described. It is preferred that the circuit board comprises at least one aperture that has a circular cross-section and the contact pin that has the round end section is arranged in said aperture. It is further preferred that the contact pin is soldered to the circuit board at least in the region of the round end section. The solder connection can be produced by way of example by means of a solder wave bath.
The invention also relates to a method for connecting a contact pin, in particular a contact pin in accordance with the previously described type, to a circuit board. In the case of the method for connecting a contact pin, in particular a contact pin in accordance with the previously described type, to a circuit board, a cross-section that is embodied in a circular manner at least at one section of the periphery is produced by means of re-shaping the angular end section at an end section of a wire that forms the contact pin and comprises in particular a square cross-section. In the case of the method, it is preferred that at least one web that is embodied by the corner of the cross-section is re-shaped in a circular manner. It is further preferred that the contact pin having the re-shaped end section is inserted into an aperture of the circuit board and soldered in said aperture.
It is preferred that the size of the cross-section of the end section is reduced prior to the re-shaping process by means of a punching process. As a consequence, the rounded end section can have a smaller diameter than if the process step of stamping were not performed.
The invention is described hereinunder with reference to figures and further exemplary embodiments. Further advantageous embodiments are evident from the features described in the figures and in the dependent claims.
The contact pin 1 is embodied in the region of the end section 3 with a square cross-section. A connecting section 5 extends between the end section 3 and the end section 7 and in said connecting section a diameter of the contact pin 1 tapers towards the commencement of the end section 7. The contact pin 1 has a round cross-section in the region of the end section 7. Two section lines 15 and 17 are illustrated.
The aperture of the circuit board 20 in
The broken line represents the wall of the aperture 25 that can contact by way of example the mutually adjacent webs. The spacing 40 is created by means of which a gap is formed in which liquid solder can flow. The end section 11 comprises six webs and six grooves in this exemplary embodiment.
Number | Date | Country | Kind |
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10 2011 087 616 | Dec 2011 | DE | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP2012/073084 | 11/20/2012 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2013/079356 | 6/6/2013 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
2991440 | Kulka | Jul 1961 | A |
4420877 | McKenzie, Jr. | Dec 1983 | A |
4494308 | Schauer | Jan 1985 | A |
4501065 | Zemek | Feb 1985 | A |
4575176 | Castello | Mar 1986 | A |
4802862 | Seidler | Feb 1989 | A |
4907988 | Tilse | Mar 1990 | A |
7723620 | Kawade | May 2010 | B2 |
20020052146 | Custer | May 2002 | A1 |
20080009155 | Ide | Jan 2008 | A1 |
20120289102 | Moll | Nov 2012 | A1 |
Number | Date | Country |
---|---|---|
4126574 | Feb 1993 | DE |
29817129 | Feb 2000 | DE |
S5233072 | Mar 1977 | JP |
S61117468 | Jun 1986 | JP |
04-039877 | Feb 1992 | JP |
4039877 | Feb 1992 | JP |
H05121142 | May 1993 | JP |
H07226240 | Aug 1995 | JP |
H08148205 | Jun 1996 | JP |
H09223529 | Aug 1997 | JP |
10241760 | Sep 1998 | JP |
H10241760 | Sep 1998 | JP |
2003-051349 | Feb 2003 | JP |
Entry |
---|
International Search Report for Application No. PCT/EP2012/073084 dated Jan. 30, 2013 (English Translation, 1 page). |
NN: “Lotstift,” Wikipedia, Oct. 5, 2010, XP002689884, Retrieved from the Internet on Jan. 9, 2013: URL:http://de.wikipedia.org/wiki/L%C3%B6tstift. |
Number | Date | Country | |
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20140299368 A1 | Oct 2014 | US |