Patent Application
20210344342
The inventive subject matter relates to electrical power apparatus and methods and, more particularly, to driver circuits for power semiconductor switches.
Semiconductor switches, such as insulated gate bipolar transistors (IGBTs) and power metal-oxide-semiconductor field-effect transistors (MOSFETs), are used in a variety of different types of electrical power applications, such as in rectifiers, inverters, motor drives and the like. Solid state circuit breakers incorporating such semiconductor switches have also been developed, with the semiconductor switches being used to replace the electromechanical switches traditionally used in such devices. In such applications, semiconductor switches offer advantages of speed and resistance to environmental degradation.
In some applications, it is desirable to have tight alignment in turn-on and turn-off of multiple semiconductor switches. For example, in operations in which power semiconductor switches are operated in series. However, disparities in characteristics of the inverter transistors, such as variances in threshold voltage and gate capacitance, can lead to variances in device turn-on and turn-off times among devices, which may cause one of the series connected semiconductor switches to carry the entire voltage. Similarly, in applications that operate multiple semiconductor switches in parallel in order to increase current carrying capacity, relatively small disparities in device parameters, such as turn-on resistance and threshold voltage, can lead to nonuniform current distribution among the paralleled devices. Such current maldistribution can lead to device overload and failure. Such problems can be particularly acute due to exceeding device capability for wide bandgap semiconductor switches, such as silicon carbide (SiC) power transistors, which may be operated at switching frequencies and/or voltage levels that are significantly greater than those used for conventional silicon devices.
According to some embodiments, an apparatus includes a power semiconductor switch, a driver circuit configured to drive a control terminal of the power semiconductor switch, and a control circuit configured to apply a control signal to the driver circuit responsive to a comparison of a reference voltage to a voltage at the control terminal of the semiconductor switch. In some embodiments, the power semiconductor switch may include a field effect transistor (FET), such as a wide bandgap silicon carbide (SiC) MOSFET. The control terminal may include a gate terminal of the FET, and the voltage at the control terminal may include a gate voltage.
In some embodiments, the driver circuit may include a totem-pole circuit and the control circuit may apply the control signal to control terminals of first and second transistors of the totem-pole circuit. The power semiconductor switch may include a field effect transistor (FET), the control terminal may include a gate terminal of the FET, and the voltage at the control terminal may include a gate voltage of the FET. The FET may include a wide bandgap FET and the first and second transistors may include respective wide bandgap transistors. For example, the FET may include a SiC MOSFET and the first and second transistors of the totem-pole circuit may include respective gallium nitride (GaN) transistors.
According to further aspects, the control circuit may include a reference voltage generator configured to generate the reference voltage responsive to a drive signal and the reference voltage may conform to a reference voltage profile stored by the reference voltage generator. The reference voltage profile may be adjustable. The apparatus may further include a reference voltage profile generator configured to adjust the reference voltage profile responsive to a sensed parameter of the power semiconductor switch.
In further embodiments, the power semiconductor switch may include a first power semiconductor switch, the driver circuit may include a first driver circuit, the control circuit may include a first control circuit configured to apply a control signal to the first driver circuit responsive to a comparison of a first reference voltage to a first voltage at the control terminal of the first semiconductor switch, and the apparatus may further include a second power semiconductor switch coupled in series or in parallel with the first semiconductor switch, a second driver circuit configured to drive a control terminal of the second power semiconductor switch, and a second control circuit configured to apply a control signal to the second driver circuit responsive to a comparison of a second reference voltage to a voltage at the control terminal of the second semiconductor switch.
In some embodiments of the inventive subject matter, and apparatus includes a wide bandgap power transistor, a totem-pole circuit configured to drive the wide bandgap power transistor, and a control circuit configured to apply a control signal to the totem-pole circuit responsive to a comparison of a voltage at a control terminal of the wide bandgap power transistor to a reference voltage. The control circuit may include a reference voltage generator configured to generate the reference voltage responsive to a drive signal and the reference voltage may conform to a reference voltage profile stored by the reference voltage generator. The reference voltage profile may be adjustable. The apparatus may further include a reference voltage profile generator configured to adjust the reference voltage profile responsive to a sensed parameter of the wide bandgap power transistor.
In still further embodiments, an apparatus includes a wide bandgap FET and a driver circuit comprising at least one wide bandgap gate driving transistor coupled to a gate terminal of the wide bandgap FET and controlled responsive to a voltage at the gate terminal of the wide bandgap FET. The apparatus further includes a control circuit configured to compare a voltage at the gate terminal of the wide bandgap FET to a reference voltage and to apply a control signal to the driver circuit responsive to the comparison.
Specific exemplary embodiments of the inventive subject matter now will be described with reference to the accompanying drawings. This inventive subject matter may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive subject matter to those skilled in the art. In the drawings, like numbers refer to like items. It will be understood that when an item is referred to as being “connected” or “coupled” to another item, it can be directly connected or coupled to the other item or intervening items may be present. As used herein the term “and/or” includes any and all combinations of one or more of the associated listed items.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the inventive subject matter. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless expressly stated otherwise. It will be further understood that the terms “includes,” “comprises,” “including” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, items, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, items, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this inventive subject matter belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Some embodiments of the inventive subject matter arise from a realization that closed-loop control of switching times of series and/or parallel-connected power semiconductor switching devices may be particularly advantageous in certain applications (e.g., SiC-based power MOSFETs and similar devices). According to some aspects, a control signal applied to a control terminal of a semiconductor switch, such as a SiC power MOSFET gate, may be generated based on a comparison of a voltage applied to the control terminal to a reference voltage, which may be generated from a profile that can be calibrated for the particular power transistor. This comparison enables producing a continuously regulated control signal to compensate for the individual characteristics of each semiconductor forcing it to behave in a predetermined manner according to the generated profile. Thus, for example, operations of series and/or parallel connected power MOSFETs having slightly different device parameters can be aligned by controlling the control signals applied to the MOSFETs based on continuous gate voltage feedback.
Referring to
As illustrated in
As shown, the transistors Q2, Q2 of the totem-pole driver circuit 420 may be driven by a control circuit 210 that generates a control signal that drives the transistors Q2, Q3 responsive to, for example, the output of a hysteresis current regulator commanded by the comparison between a gate voltage of the MOSFET Q1 and a reference voltage regulator profile. Along the lines discussed above with reference to
As shown in
According to further embodiments illustrated in
The drawings and specification, there have been disclosed exemplary embodiments of the inventive subject matter. Although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation, the scope of the inventive subject matter being defined by the following claims.
