CONTROLER AND MODULAR CONTROL SYSTEM OF AN INDUSTRIAL AUTOMATION SYSTEM

The invention relates to a controller for an industrial automation system, having a main module with a housing which can be fitted on a DIN rail by means of a base, and with at least two printed circuit boards which are arranged in the housing, one of these printed circuit boards being a backplane bus printed circuit board and one being a main printed circuit board, wherein the main printed circuit board is assigned a heat sink for the cooling of components and wherein the backplane bus printed circuit board provides a backplane bus. The invention furthermore relates to a modular control system with such a main module.

In industrial automation systems, controllers, also called SPS (Speicher Programmierbare Steuerung—Programmable Memory Controller), PLC (Programmable Logic Controller) or PAC (Programmable Automation Controller), are used in order to activate actuators and to input measurement data via sensors. In general, the activation of the actuators or the outputting of the sensors takes place via field appliances, which are connected to the controller via one or more field buses. Amongst other things, input and output modules, also called I/O modules, which provide analog and/or digital input or output channels, are included in the field appliances. In this case, frequently not every individual field appliance is attached directly to the field bus, but rather via a so-called field bus coupler (Remote I/O), which constitutes an interface between the field bus on the one hand and a sub-bus, via which a plurality of field appliances can be attached. Sensors and actuators can also in each case be provided with a dedicated field bus terminal for connection to the field bus.

Alternatively or additionally to the transfer via the field bus, it can be envisaged to attach field appliances also directly to the controller in a comparable way, such as in the case of a field bus coupler, whereby this provides a sub-bus, which is comparable to a field bus coupler.

In general, provision is made to arrange controllers in a switchgear cabinet assigned to the industrial installation. For this purpose, controllers have typical mounting elements such as a DIN rail receptacle, for example. The arrangement in a switchgear cabinet puts constraints on the geometric, mechanical, thermal and electrical layout of the controller. The space available for components of the controller and in particular for terminals of the controller is severely restricted. In addition, the thermal load can be high, such that, in the case of a compact construction, good cooling of the components must be achievable. In addition, requirements for performance and/or the available interfaces of the controller frequently change over time, and so it is desirable for the controller to be flexibly expandable.

An expandable automation appliance, which can be formed as a controller, is known from published document DE 10 2014 118 389 A1, in which appliance a main module, which provides the main functionality, is expandable by one or more connection modules, in order to be able to operate the main module with various field bus systems. In terms of costs, here it is disadvantageous that in each case a combination of main module and connection module must be used in order to build up a functional controller.

A problem of the present invention is to provide a controller and a modular control system, which enable good cooling of electronic components while having a compact construction, which are flexible with regard to the available printed circuit board surface area and connection possibilities and which have a compact construction.

This problem is solved by a controller and a control system having the features of the respective independent claim.

A controller according to the invention for an industrial automation system of the type mentioned at the outset is characterised in that the heat sink is arranged in the housing, is attached to the base and supports at least one of the printed circuit boards. The heat sink is therefore used as a central element of the controller, which supports at least one, preferably also several of the printed circuit boards of the main module, i.e. these printed circuit boards are attached to the heat sink. In this way, the space available in the housing is used optimally, so that a compact main module with a high component density can be produced. In addition, the assembling of the main module is simplified, since a central assembly, with printed circuit boards which are attached to the heat sink, can be premounted, which is then inserted as a whole into the base and is connected to this.

In an advantageous configuration of the controller, the heat sink has a substantially parallelepipedal outline and, with two mutually perpendicular outer surfaces, lies parallel to the main printed circuit board and the backplane bus printed circuit board. In this way, a backplane bus printed circuit board situated in the base and a main printed circuit board perpendicular thereto can be connected to one another in a compact manner via the heat sink. Both the main printed circuit board and the backplane bus printed circuit board are preferably attached to the heat sink.

Further preferably, at least one outer surface of the heat sink is formed as a cooling surface, with which the components of the main printed circuit board are in thermal contact. The cooling surface in this case can be formed in a stepped manner and can have plateaus at different heights, in order to equally efficiently contact structural elements of the main printed circuit board which are at different heights.

In a further advantageous configuration of the controller, the heat sink has at least one mounting foot, which protrudes into the base and is attached there. Therefore, the volume available in the base can be used for attaching the heat sink and as much usable volume as possible remains in the region situated above the base, for printed circuit boards. In addition, the perpendicular main printed circuit board can also be brought parallel to the cooling surface of the heat sink into the base. In this way, additional equipment space is created on the main printed circuit board, without enlarging the installation height of the main module, i.e. the height above the DIN rail. A section of the main printed circuit board protruding into the base can also be used for ground contacting to the DIN rail via a contact spring arranged in the base.

In order to enable rapid and uncomplicated mounting of the main module, an assembly comprising heat sink and printed circuit boards is only attached to the at least one mounting foot on the base.

In a further advantageous configuration of the controller, the heat sink has inner cooling fins, by means of which cooling channels are formed. Therefore, the heat sink has large outer surfaces, which can be used as cooling surfaces and are in thermal contact with components which are to be cooled, and a high level of cooling performance of the heat sink is achieved. The inner cooling fins preferably run perpendicular to the main printed circuit board, in order to optimally dissipate heat drawn in from there.

In a further advantageous configuration of the controller, the heat sink has outer cooling fins, beside which at least one additional printed circuit board is arranged. With the at least one additional printed circuit board, the intermediate space between the outer cooling fins can be used optimally, in order to create further installation space for components. The outer cooling fins preferably run parallel to the main printed circuit board. Preferably at least one of the outer cooling fins, in a longitudinal direction, is shorter than other sections of the heat sink, in order to create space for electrical connections between the main printed circuit board and the additional printed circuit board(s).

In this case, the main module can be formed in such a way that it can be operated autonomously as a so-called monolithic controller. It can also be connected, via a field bus, to field appliances and in particular also to an output station (Remote I/O), which has a field bus coupler and input and/or output modules (I/O modules).

It can also be envisaged that the main module itself acts as a field bus coupler in addition to the control functionality and has a direct connection possibility for I/O modules. Finally, I/O modules can also be contained directly in the main module or also plug-in locations for I/O modules can be provided in the case of the main module.

Moreover, optionally a connection possibility for expansion modules can be provided on the main module, so that the controller can be operated as a modular control system. The functional scope of the control system can be supplemented, for example, with a safety control module, servo drive modules, rapid and highly accurate I/O and camera modules for manufacturing-measurement and test technology, memory modules/data loggers, multipliers/switches, media converters, repeaters, gateways and routers with a sniffer and analysis function (Predictive Analytics).

For the connection to a laterally stackable expansion module, the main module can have, in one configuration, a plug connector coupled to the backplane bus printed circuit board.

A control system according to the invention comprises a controller of the above-described type with a main module and is expanded by at least one stacked expansion module, wherein the main module is connected to the at least one expansion module via a backplane bus printed circuit board. The advantages described in connection with the controller arise in an additionally flexibly expandable system.

The controller according to the invention and the control system according to the invention are described in more detail hereinafter using exemplary embodiments with reference to figures. In the figures:

FIG. 1 shows a diagrammatic isometric view of a control system;

FIGS. 2-2
c show various views of a further exemplary embodiment of a control system;

FIGS. 3a, 3b show two different isometric views of an exemplary embodiment of a main module of a controller;

FIGS. 4a-4c show various views of the main module according to FIGS. 3a, b with the housing cover fitted;

FIGS. 5a-5d show various views of a further exemplary embodiment of a main module of a controller, depicted without the housing cover and partially without the base;

FIGS. 6a-6c show the main module from FIGS. 5a to 5d with the housing cover fitted;

FIGS. 7a-7e show various views of a further exemplary embodiment of a main module of a controller, depicted without the housing cover and without the base;

FIGS. 8a, 8b show the main module from FIGS. 7a to 7e with the base or base and housing cover fitted;

FIG. 9a shows an isometric view of a further exemplary embodiment of a main module of a controller, depicted without the housing cover and without the base;

FIGS. 9b, 9c in each case show an isometric view of a further exemplary embodiment of a main module of a controller, depicted without the housing cover;

FIGS. 10a, 10b show two different isometric views of a first exemplary embodiment of an expansion module for a control system;

FIGS. 11a, 11b show two different isometric views of a second exemplary embodiment of an expansion module for a control system;

FIGS. 12a, 12b show two different isometric views of a third exemplary embodiment of an expansion module for a control system; and

FIGS. 13a-13c show diagrammatic plan views of a main module of a controller in various connection configurations.

FIG. 1 shows, in a diagrammatic isometric view, a first exemplary embodiment of a control system. The control system comprises a main module 1 and in this example an expansion module 2.

Within the framework of this application, identical reference numbers in all figures denote identical or identically acting elements. In the case of the expansion module 2, reference numbers of the components are provided with an apostrophe for better distinguishability.

The control system from FIG. 1 is provided for mounting in a switchgear cabinet. The usual mounting orientation is such that the lower, non-visible side in FIG. 1 is set vertically in the switchgear cabinet. This side will also be referred to hereinafter as the mounting side. The side situated at the top in FIG. 1 is thus oriented parallel to the “mounting side” and likewise runs perpendicularly in the case of a switchgear cabinet mounting. It faces the operator or user and will be referred to hereinafter as the “front side”. The side facing the viewer, visible in FIG. 1, is oriented horizontally in the case of a typical switchgear cabinet mounting and will be referred to hereinafter as the “lower side”. The side facing away from the viewer, not visible in FIG. 1, which is likewise oriented horizontally in the case of the switchgear cabinet mounting, will be referred to as the “upper side”.

Connected to the left side of the main module 1 in FIG. 1 is the expansion module 2, which is reproduced separated from the main module 1, for the sake of better depiction. This left side of the main module 1 or of the expansion module 2 is also the left side in the case of mounting in the switchgear cabinet and will be referred to as such hereinafter. Input/output modules 3, which are not depicted here, can also be connected to the right side of the main module 1, which is also the right side of the main module 1 in the case of switchgear cabinet mounting and will be referred to as such hereinafter.

The main module 1 has a base 10, onto which a housing cover 60 is fitted. The base 10, as depicted in this exemplary embodiment, is preferably made up of several components, in the present case three latching supports 11, oriented parallel to one another, which are spaced apart from one another by spacing elements 16. The latching supports 11 serve to attach the main module 1 to a DIN rail of the switchgear cabinet, onto which they can be latched.

On the upper side of the main module 1, at each latching support 11, release levers 13 are arranged, which release the latching supports 11 upon actuation, so that the main module 1 can be removed from the DIN rail. The latching support 11 arranged on the right side of the main module 1 has projecting latching hooks 14, with which the mentioned input/output modules 3 can be latched onto the main module 1. The input/output modules 3, for their part, are equipped with comparable latching supports 11, so that they can be fitted onto the DIN rail and can be latched onto the main module 1 by pushing them on.

The right latching support 11 of the main module 1 additionally supports various bus contacts 15, via which a power supply and also data can be transferred to the fitted input/output modules 3. The mechanical configuration of the right side of the main module 1 and also the electrical and mechanical configuration of the bus contacts 15 corresponds to that of a system-identical field bus coupler, such that the input/output modules 3 constructed for this system-identical field bus coupler can be attached directly to the main module 1 of the control system here. This enables direct use of the input/output modules 3 without an interposed field bus and field bus coupler.

The right side of the main module 1 is configured in the same form factor, which the input/output modules 3 also have. It has a section in which power supply terminals 31 are positioned. The power supply terminals 31 in this case are formed as plug-in elements with a printed circuit board edge connector, which plug-in elements can be plugged onto a printed circuit board that is arranged underneath (cf. e.g. FIG. 2a or 3a). The plug-in elements can provide various desired contact types as power supply terminals 31, for example push-in contacts, screw contacts or plug connectors. In order to be able to exchange the plug-in elements of the power supply terminals 31, the housing cover 60 in this region is formed as a hinged strip 62 that can be folded up. This system and this form factor are preferably implemented in a comparable manner in the input/output modules 3 which can be fitted.

In its wider left part, the installation space of the main module 1 is larger and correspondingly the housing cover 60 is formed by a main cover 61 that projects the hinged strip 62 upwards. On the lower and upper sides, ventilation breakouts 63 are preferably formed, through which a convection airstream leads through the main module 1 from the bottom up. In the case of extreme thermal ambient conditions, a fan can be fitted on the lower side or the upper side on the main cover 61, which fan draws a forced airstream through the main module 1 for better cooling. In harsher ambient conditions, filter elements can additionally be provided, which minimise the ingress of dirt through the ventilation breakouts 63.

In the depicted exemplary embodiment of the main module 1, terminals 30 are provided on the lower side, whereas the front side of the main module 1 has switching and signal elements 40, for example status indicators, switches or pushbuttons. An antenna terminal 33 is likewise arranged on the front side. In addition, a memory card terminal 34 with an insertion slot for e.g. a (micro) SD memory card is arranged on the front side. Details on the inner structure of the main module 1 are explained in the following figures.

The expansion module 2, which can be plugged onto the left side of the main module 1, has a basically comparable structure. The expansion module 2 also comprises a base 10′, which has latching supports 11′, which are spaced apart from one another by spacing elements 16′. Latching hooks 14′ serve for the latching connection to the main module 1.

In FIG. 1, a housing cover 60′ of the expansion module 2 is indicated only by dashed outlines and otherwise depicted transparently, so that an inner structure is visible. In the expansion module 2, a printed circuit board 20′ is arranged perpendicularly, which supports terminals 30′ at its upper end in FIG. 1. These are correspondingly accessible from the front side of the expansion module 2. On the right side of the expansion module 2, there are bus contacts 15′, in the form of a printed circuit board edge connector in the depicted exemplary embodiment. The main module 1 and the expansion module 2 are coupled to one another via the bus contacts 15′. Optionally, several, in particular two, printed circuit boards 20 can be arranged parallel to one another in a supplementary module 2, in order to enlarge the equipment space and/or to enlarge the article variance of the expansion modules 2 inexpensively via equipment variants of the terminals on the two printed circuit boards 20. The structure of the expansion module 2 will also be explained in more detail in the following figures.

A further exemplary embodiment of a control system is depicted in various views in FIGS. 2a and 2c. FIGS. 2a and 2b each show a diagrammatic isometric view from two different perspectives and FIG. 2c reproduces a plan view of one side of the control system. In FIGS. 2a to 2c the housing covers 60, 60′ are removed, in order to give a view into the inner structure of the control system.

In the case of the control system depicted in FIGS. 2a to 2c, a main module 1 is connected to two expansion modules 2. Both expansion modules 2 are plugged in one behind the other on the left side of the main module 1, therefore a first expansion module 2 is connected directly to the main module 1 and a second expansion module 2 is plugged into the first expansion module 2. This is possible because the bus contacts 15′ of the expansion module 2 are passed through, such that a stacking of several expansion modules 2 can take place. For this purpose, the left side of each expansion module 2 is formed similarly to the left side of the main module 1.

In terms of the basic structure, the main module 1 and the depicted expansion modules 2 are constructed in a comparable way to the first exemplary embodiment according to FIG. 1. There are small differences relating to the configuration of the heat sink 50, which takes up the entire installation height of the main module 1 in the exemplary embodiment in FIGS. 2a to 2c, whereas in the exemplary embodiment in FIG. 1 there remains a free space above the heat sink 50, which can optionally be used in some other way.

There is a further difference that relates to the configuration of the bus contacts 15′, which are not formed as printed circuit board edge connectors in the exemplary embodiment in FIGS. 2a to 2c. Instead, in each case plug connectors 26 and 26′ respectively are provided, which are plugged into one another and have the bus contacts 15′. In order to enable the stackability of several expansion modules 2, the expansion modules in FIGS. 2a to 2c additionally have a printed circuit board 20′ that is oriented parallel to the mounting side or front side, which printed circuit board 20′ accommodates the plug connectors for the bus contacts 15′ and are electrically connected, via a further plug connector, to main (printed circuit boards) 20′ which are oriented perpendicular to said further plug connector.

The function of the various printed circuit boards 20 and 20′ of main module 1 and of the expansion modules 2 will also be described in greater detail hereinafter.

An exemplary embodiment of a main module 1 of a controller is depicted in more detail in FIGS. 3a, 3b and 4a-4c. FIGS. 3a and 3b show the main module 1 without the housing cover 60 fitted, in order to obtain a view into the inner structure. FIGS. 4a to 4c show various views of the main module 1 with the housing cover 60 fitted. FIGS. 3a, 4b and 4a, 4b are in each case isometric views from different perspectives and FIG. 4c is a plan view of the front side of the main module 1.

The configuration of the base 10 of the main module 1 corresponds to that of the main modules 1 according to FIGS. 1 and 2a to 2c. The associated description will be dispensed with here.

The present main module 1 has a plurality of printed circuit boards 20, the arrangement and function of which will be described in more detail hereinafter.

Firstly, a backplane bus printed circuit board 21 is arranged on the base frame 18 of the base 10, which backplane bus printed circuit board 21 extends over the entire surface of the base frame 18. Towards the right side, the backplane bus printed circuit board 21 reaches slightly above the base frame 18 as far as the printed circuit board support 17. The printed circuit board support 17 perpendicularly supports a daughter printed circuit board 22, which is plugged into the printed circuit board support 17 and reaches as far as the bus contacts 15 on the right side of the main module 1.

The bus contacts 15, via which a power supply and data connection to the input/output modules 3 takes place, are correspondingly contacted directly via the daughter printed circuit board 22. The daughter printed circuit board 22 is perpendicular to the backplane bus printed circuit board 21 and is connected to it via a right-angle plug connector 26. The daughter printed circuit board 22 has, at its upper end, printed circuit board edge connectors onto which the power supply terminals 31, which are arranged in the hinged strip 62 (cf. FIGS. 4a to 4c), are plugged.

The main module 1 is supplied with power supply voltage, generally a direct current voltage in the region of 24V, via these power supply terminals 31. Electronic components for providing the power supply to the main module 1 and the input/output modules 3 and also plugged-on expansion modules 2 are arranged on the daughter printed circuit board 22. In principle, within the framework of this application, components which are arranged on printed circuit boards 20 are depicted only by way of example. It goes without saying that the space on all printed circuit boards 20 that is not taken up by depicted components in the figures is available for electrical or electronic components. All printed circuit boards 20 can be equipped on one or (preferably) on both sides.

The backplane bus printed circuit board 21 accommodates a backplane bus for the main module 1 and any expansion modules 2. The backplane bus provides power supply lines and data lines. The data lines form at least one standardised and/or proprietary data bus. The lines of the backplane bus are extended further to a plugged-in expansion module 2, for example via the bus contacts 15′.

As FIGS. 3a and 3b in particular show, a main printed circuit board 23 is situated perpendicularly on the backplane bus printed circuit board 21, approximately in the centre of the main module 1, which main printed circuit board 23 accommodates the essential functional elements of the main module 1, in particular one or more CPU (Central Processing Unit), one or more FPGA (Field Programmable Gate Array), memory modules such as RAM (Random Access Memory), NVRAM (Non Volatile RAM), an RTC (Real Time Clock), and also interface drivers for interface terminals 32, for an antenna terminal 33 and switching and signal elements 40.

These interface terminals 32 and switching and signal elements 40 are arranged in the front (in FIGS. 3a and 3b upper) region of the main printed circuit board 23. The switching and signal elements 40 and an antenna terminal 33 can be arranged on the border of the main printed circuit board 23 (cf. for example FIG. 3a), whereas the various interface terminals 32 are positioned on the side of the main printed circuit board 23 facing away from the daughter printed circuit board 22. In particular, RJ-45 terminals are provided as interface terminals 32, or D-SUB terminals, which are likewise used as field bus terminals. Furthermore, interface terminals 32 can be formed as SFP (Small Formfactor Pluggable) network terminals, as USB terminals, as display terminals or also as BL/SL terminals. The antenna terminal 33 can be formed, for example, as an SMA high frequency terminal.

A heat sink 50 is positioned between the daughter printed circuit board 22 and the main printed circuit board 23. A cooling surface 51 facing the main printed circuit board 23 is in thermal contact with heat-producing components of the main printed circuit board 23, which are preferably arranged on the printed circuit board side facing the heat sink 50. All the heat-producing components such as the CPU, the FPGAs etc. can be cooled via the heat sink 50.

In the depicted example (cf. FIGS. 2a to 2c), the heat sink 50 is attached to mounting domes 19, which are formed in the base 10. The mounting domes 19 can be brought through an aperture in the backplane bus printed circuit board 21, so that the heat sink is connected directly to the base 10. Alternatively, the mounting domes 19 can end below the backplane bus printed circuit board 21 and a screw can pass through the backplane bus printed circuit board 21 and a spacing piece can pass into the heat sink 50, so that the heat sink 50 is attached to the base 10 together with the backplane bus printed circuit board 21.

In the case of the depicted exemplary embodiment in FIGS. 3a and 3b, the (in the figures) upper cooling channel 52 facing the front side is not formed over the entire width of the heat sink 50, such that a free space is created on the rear side of the main printed circuit board 23, in which free space a small additional printed circuit board 25, which is oriented parallel to the main printed circuit board 23, is positioned. This can be connected to the main printed circuit board 23 via soldering pins and/or plug connectors and can accommodate additional switching and signal elements 40 or also terminals 30.

In the case of the depicted example (cf. FIG. 3a), the additional printed circuit board 25 provides a memory card terminal 34 for accommodating a micro SD memory card and also a battery terminal 35 for accommodating and contacting a back-up battery for powering the real time clock (RTC), for example.

As can be seen in FIGS. 4a to 4c, the region in which the memory card terminal 34 and the battery are arranged can be covered by an access flap 64, in order to protect an inserted memory card or battery against being inadvertently removed. In the main cover 61, a display can also be arranged, or an aperture, through which a display is accessible. The display can be equipped with a touch function and can form a switching and signal element 40.

The interface terminals 32, which are positioned in the front side in this exemplary embodiment in FIGS. 3a, 3b and 4a to 4c (and also in the examples in FIGS. 5a-5d, 6a-6c, 7a-7e, 8a and 8b), can, in alternative configurations, also be accessible in whole or in part from the lower side of the main module 1, as is implemented in the exemplary embodiment in FIGS. 1 and 2a to 2c.

On the left side of the main module 1, an optional supplementary printed circuit board 24 can be arranged parallel to the main printed circuit board 23 (cf. FIGS. 2a to 2c, 3a, 3b or also 9a to 9c, for example). This supplementary printed circuit board 24 can, for example, also have interface drivers and further interface terminals 32, which are then accessible on the front side or lower side of the main module 1. In this way, a larger variance of interfaces can be provided. The individual interface terminals 32 are positioned on the main printed circuit board 23 and the supplementary printed circuit board 24 in such a way that they utilise the installation space situated between these without interfering with one another. Preferably, components protruding into this installation space, and in particular the interface terminals 32, are arranged in a toothed and mutually engaging manner on the main printed circuit board 23 and the supplementary printed circuit board 24. The installation space can therefore be used optimally in a wide variety of equipment variants.

The supplementary printed circuit board 24 can additionally be used to provide particularly rapid input/output channels via FPGA or GPIO (General Purpose Input Output) modules with optionally direct access to the backplane bus. In this way, specific input/output channels with switching times in the region of nanoseconds can be produced.

In a recess of the supplementary printed circuit board 24, the plug contact is mounted on the backplane bus printed circuit board 21, in order to connect expansion modules 2 to the main module 1 via its bus contacts 15′. Besides the function of relaying and distributing the backplane bus, the backplane bus printed circuit board 21 alternatively can also be used in order to accommodate back-up capacitors for smoothing and supporting the power supply line of the backplane bus.

It is also conceivable to arrange the back-up battery of the real time clock (RTC), which is situated on the additional printed circuit board 25 in the depicted exemplary embodiment, on the upper or lower side of the backplane bus printed circuit board 21 (cf. FIG. 7e). In the housing cover 60 or the base 10, in an appropriate location, a flap or covering is then provided, through which the back-up battery is accessible and can be replaced. A drawer can also be provided, into which the back-up battery is inserted, in order to be able to easily replace the back-up battery.

A further exemplary embodiment of a main module 1 of a control system is depicted in FIGS. 5a to 5d and 6a to 6c. FIGS. 5a to 5d show the main module 1 without the housing cover 60 fitted, whereas FIGS. 6a to 6c reproduce the main module 1 with the housing cover 60 fitted.

In this exemplary embodiment too, the base 10 of the main module 1 is constructed as in the previous exemplary embodiments, to which reference is hereby made. Hereinafter, the differences compared to the previously described exemplary embodiments will be substantially explored.

In the case of the exemplary embodiment shown here, besides the daughter printed circuit board 22 and the backplane bus printed circuit board 21 and any additional printed circuit boards 25 which are used, only one main printed circuit board 23, and no supplementary printed circuit board 24, is provided.

In order to be able to make optimum use of the available space, the main printed circuit board 23 is arranged in the region of the left side of the main module 1. The switching and signal elements 40 in turn are positioned along a section of the upper (based on the depiction in the figures) border of the main printed circuit board 23. Owing to the arrangement of the main printed circuit board 23 laterally in the main module 1, the interface terminals 32 which protrude clearly to the side from the main printed circuit board 23 (again in particular RJ-45 and USB terminals) are arranged to the right in the main module 1 on the main printed circuit board 23. In a region below (again based on the depiction in the figures), the heat sink 50 is brought close to the main printed circuit board 23, in order to be able to thermally connect heat-emitting components of the main printed circuit board to the heat sink 50 and to be able to cool them via the heat sink 50. In the upper region of the heat sink 50, this is unlatched in order to be able to provide space for the interface terminals 32 and the additional printed circuit board 25. If there is low demand for cooling, the section of the heat sink 50 that is located beside the interface terminals 32 can optionally be dispensed with, so that in turn more space for the depicted additional printed circuit board 25 or space for an additional printed circuit board 25 oriented parallel to the front side is available.

A further difference compared to the previous exemplary embodiments relates to the configuration of the printed circuit boards 20 in the region of the connection between the backplane bus printed circuit board 21 and the main printed circuit board 23.

As can be seen clearly from FIG. 5b, on the left side of the main module 1 the backplane bus printed circuit board 21 in turn opens into a plug contact, via which the backplane bus can be transferred to pluggable expansion modules 2. The backplane bus printed circuit board 21, however, is brought up to the edge of the base frame 18 only in the region of this plug contact of the main module 1. In the upper and lower sections (based on the mounting direction of the main module 1 in the switchgear cabinet), the backplane bus printed circuit board 21 ends in front of the main printed circuit board 23. As a result, the main printed circuit board 23 can be lengthened downwards into the base 10, with the result that more equipment area is available. The region of the plug connector to the expansion modules 2 in this case is recessed. In FIG. 5c, the main module 1 is reproduced from the same perspective as in FIG. 5b, however the base 10 is removed in order to be able to depict the main printed circuit board 23 over its entire height. This figure furthermore shows that the heat sink 50 with a section that forms a mounting foot 57 likewise protrudes into the base 10, which serves to attach it.

In addition to the led-through plug connector for relaying the backplane bus to the expansion modules 2, a right-angle connector, not shown here, is arranged which transfers the backplane bus from the main printed circuit board 23 to the backplane bus printed circuit board 21. In an alternative configuration, both plug connectors can be combined in such a way that the main printed circuit board 23 has, on the front and rear sides, in each case a plug connector that on the one hand interacts with a corresponding mating plug connector on the backplane bus printed circuit board 21 and relays the backplane bus to the expansion module 2. Such an arrangement of plug connectors is also referred to as a 180° plug connector.

The larger surface area of the main printed circuit board 23 that can be achieved in this way makes it possible to accommodate the essential functions on one printed circuit board, with the result that the supplementary printed circuit board 24 can be omitted. A sufficient printed circuit board surface area in the case of compact housing dimensions is provided for most required applications. The variant shown in these figures thus constitutes an inexpensive version of the control system. The formation of all the essential components on the main printed circuit board 23 additionally offers the advantage that high frequency pulsed signals are conducted via a few plug connectors, which results in a good signal flow and thus the use of high pulse frequencies. The saving of the supplementary printed circuit board 24 additionally has a cost-reducing effect on the system, if only a small number of terminals and low article variance are required.

A further small difference compared to the previously shown exemplary embodiments lies in the assignment of the terminals 30 and switching and signal elements 40 to the various printed circuit boards 20. In the present example, the antenna terminal 33 is arranged on the additional printed circuit board 25. This is advantageous when the antenna terminal 33 and/or further interface terminals 32 are not included in the basic equipment of the main module 1, but rather can be added subsequently in an appropriate manner by retrofitting the additional printed circuit board 25.

In this exemplary embodiment, the memory card terminal 34 is also formed on the main printed circuit board 23. All the terminals and functional modules which are necessary for operation of the main module can be realised on the main printed circuit board 23 or the backplane bus printed circuit board 21 and the daughter printed circuit board 22. Optional features such as the antenna terminal 33, for example, can then be retrofitted via the additional printed circuit board. As has already been mentioned in connection with the previous exemplary embodiment, a back-up battery for a real time clock of the system can find room on the backplane bus printed circuit board 21, for example.

A further exemplary embodiment of a main module 1 of a controller is depicted in various views in FIGS. 7a to e and 8a and 8b. FIGS. 7a to e show the main module 1 without the housing. In FIG. 8a, the arrangement shown in FIGS. 7a to e is inserted into a base 10. Finally, the complete main module 1 with base 10 and housing upper part 60 fitted is depicted in FIG. 8b. FIGS. 7a and 7b are isometric oblique views of the main module 1, which is shown here without the base 10 and without the housing cover 60 fitted, FIG. 7c shows a plan view of the main module 1, FIG. 7d shows a side view and FIG. 7e shows a plan view of the lower side of the main module 1, therefore a view from the direction of the base 10, not depicted here.

As regards the basic structure, the main module 1 shown in FIGS. 7a to e and 8a, b is likewise constructed like the main module 1 that was described in connection with the previous figures. In particular, a plurality of printed circuit boards 20 is again present, specifically a backplane bus printed circuit board 21, a daughter printed circuit board 22, a main printed circuit board 23 and an additional printed circuit board 25. The backplane bus printed circuit board 21 is situated, as in the previous exemplary embodiments, parallel to a DIN rail, on which the main module 1 can be latched. The backplane bus printed circuit board 21 is thus also situated, as FIG. 8a shows, on the base 10, which in turn has through, in the present case, 3 latching supports 11, which are spaced apart from one another by spacing elements 16. The main printed circuit board 23, the daughter printed circuit board 22 and the additional printed circuit board 25 are arranged perpendicularly, opposite the backplane bus printed circuit board 21.

As already in the case of the previously shown exemplary embodiments, the heat sink 50 is arranged centrally in the main module 1 and, besides its function for the cooling of components of the main module 1, also serves to hold several of the printed circuit boards 20. The heat sink 50 thus constitutes the central and supporting element of the main module 1. It extends over the entire extent of the main module 1 in a direction perpendicular to the DIN rail, i.e. in the direction in which the latching supports 11 also run.

The cooling channels 52 are also formed by inner fins 53 in this direction. During mounting of the main module 1 on a DIN rail, the cooling channels 52 run perpendicular, so that a cooling air current enters through the cooling channels 52 by convection. If necessary, as described in connection with the exemplary embodiment in FIG. 1, a fan can be fitted on the outside of the housing 60, for example, which fan strengthens an air current through the ventilation breakouts 63 and the cooling channels 52.

In a lower region of the heat sink 50, which takes up approximately half or slightly more than half of the installation height, the inner cooling fins 53 are formed parallel to the backplane of the printed circuit board 21. Thus, they dissipate heat from the cooling surface 51, which runs parallel to the main printed circuit board 23. In this example, the inner fins 53 do not reach as far as the opposite wall of the heat sink 50, in order to simplify manufacture thereof in an extrusion die-casting process.

Electronic components, which are arranged on the side of the main printed circuit board 23 that faces the heat sink 50, are in thermal contact with this cooling surface 51. The cooling surface 51 in this case can be formed in a stepped manner and can have plateaus at different heights, in order to contact equally well structural elements of the main printed circuit board which are at different heights.

In an (in the figures) upper region of the heat sink 50, the otherwise parallelepipedal outline of the heat sink 50 is recessed in order to provide space for the interface terminals 32 and/or switching and signal elements 40, which are arranged on the main printed circuit board 23. Outer cooling fins 54 are oriented parallel to the main printed circuit board 23 in the remaining section of the heat sink 50. Thus, they are also parallel to the additional printed circuit board 25, which, for example, accommodates modules for wireless communication and supports an antenna terminal 33. Elements which are to be cooled on the additional printed circuit board 25 can be coupled to the adjacent cooling fins 54. An attachment groove 55 is provided in the heat sink 50 in the region of the recess, which attachment groove 55 serves to attach the printed circuit board 25.

As in the previously described exemplary embodiments, the main printed circuit board 23 is mounted on the heat sink 50 in this example too. By way of example, in FIG. 7b attachment screws 232 can be seen, which pass through the main printed circuit board 23 and are screwed into corresponding threaded bores in the heat sink 50. Moreover, the backplane bus printed circuit board 21 is also screwed to the heat sink 50, which has attachment bores 56 for this purpose, which can be seen in FIG. 7a for example. The backplane bus printed circuit board 21 and the main printed circuit board 23, just like the additional printed circuit board 25, thus form, together with the heat sink 50, a premounted assembly which is electrically functional per se and which is inserted as a whole into the base 10 for mounting.

To mount said unit in the base 10, the heat sink 50 has mounting feet 57, in a manner comparable to the exemplary embodiment in FIGS. 5a-d and 6a-c, with which mounting feet 57 it protrudes into the region of the base 10 through a recess at the edge of the backplane bus printed circuit board 21. Guides for the mounting feet 57 are preferably formed in the base 10, which guides receive an inserted heat sink 50 laterally in a form-fitting manner. As can be seen clearly particularly in FIG. 7b, in the depicted exemplary embodiment the main printed circuit board 23 is also led out further over the plane of the backplane bus printed circuit board 21 downwards in the direction of the base 10 and protrudes into the base 10 like the mounting feet 57.

In this way, additional equipment space is created on the main printed circuit board 23, without enlarging the installation height of the main module 1, i.e. the height above the DIN rail.

There is a recess 231 in the region of the DIN rail itself or the DIN rail receptacle 12 in the base 10. The view of the lower side of the backplane bus printed circuit board 21 in FIG. 7e shows the downwardly led-through mounting feet 57 with in each case a mounting bore 58, by means of which the inserted heat sink 50 can be screwed to the base from below. In this image, structural elements 211 of the backplane bus printed circuit board 21 additionally can be seen, which likewise protrude downwards into the base 10 and therefore also use its volume. Furthermore, attachment screws 212 can be seen in the image, with which the backplane bus printed circuit board 21 is screwed to the heat sink 50.

A further exemplary embodiment of a main module 1 of a controller is depicted in FIG. 9a. In a comparable manner to FIG. 8a, an isometric oblique view of the main module 1 is reproduced, with a base 10 and a fitted housing cover 60 not being reproduced in this figure.

From the basic structure, the exemplary embodiment depicted in FIG. 9a corresponds to that in FIGS. 7a-7e and 8a, b, in particular in relation to the mounting of the heat sink 50. In this exemplary embodiment too, this has mounting feet 57 which protrude downwards into the base 10. The main printed circuit board 23 and the backplane bus printed circuit board 21 are connected to the heat sink 50, for example via the attachment screws 212 which are visible in FIG. 9a.

Also as in the case of the previously described exemplary embodiment, in the case of the heat sink 50, inner cooling fins 53 are formed parallel to the backplane bus printed circuit board 21 in a lower section adjacent to the backplane bus printed circuit board 21, and outer cooling fins 54 are oriented perpendicular to the backplane bus printed circuit board 21 in the upper part of the heat sink 50 situated away from the backplane bus printed circuit board 21.

In contrast to the previously described exemplary embodiment, the heat sink 50 is formed to be wider in the direction of the DIN rail. In total, there are four outer cooling fins 54 parallel to the main printed circuit board 23, and they are distributed over the entire width of the heat sink 50. There are three intermediate spaces between the cooling fins 54, in which intermediate spaces there is an additional printed circuit board 25 in each case. In order to attach at least some of these additional printed circuit boards 25, there is in turn an attachment groove 55 in the heat sink 50 into which flexibly positionable attachment screws can be screwed.

In order to be able to make electrical connections between the main printed circuit board 23 and the additional printed circuit boards 25 or between various ones of the additional printed circuit boards 25, three of the four mentioned outer fins 54, between which the additional printed circuit boards 25 are positioned, are not formed over the entire extent of the heat sink 50. Specifically, the first and third of the mentioned cooling fins 54 in FIG. 9a end in front of the rear, non-visible ends of the heat sink. The (again seen from the left) second of the cooling fins 54 does not reach up to the other outline of the heat sink 50 on both sides. The interconnections made between the main printed circuit board 23 and the additional printed circuit boards 25 or between the additional printed circuit boards 25 can be a wide variety of plug connectors. Besides printed circuit board plug connectors, cable plug connectors can be provided in particular for the transfer of high frequency signals. For example, the right additional printed circuit board 25 in FIG. 9a supports a number of antenna terminals 33, which are formed in accordance with the SMA (Sub-Miniature-A) standard. Electronic components which serve these antenna terminals 33 can also be arranged on the adjacent additional printed circuit board, for example, which likewise supports antenna terminals 33, with high frequency signals being exchanged between the two printed circuit boards via miniature high frequency plugs and coaxial cables. Suitable miniature high frequency plug connectors are, for example, UMTC (Ultra-Miniature-Telecommunications-Connector) connectors. For the coaxial cables, preferably those with a diameter in the region of one millimeter are used. A positioning of the electronic components, which serve the antenna terminals 33, on the supplementary printed circuit board 24 or the backplane bus printed circuit board 21 is also possible.

A further difference of the exemplary embodiment in FIG. 9a compared to that previously described is the presence of a supplementary printed circuit board 24, which supplements the functionality of the main printed circuit board 23. This is arranged parallel to the main printed circuit board 23 and is connected to it via a printed circuit board connector, which is formed in the plane of the backplane bus printed circuit board 21. Radio and/or memory modules 241, for example, are arranged on the supplementary printed circuit board 24 on the side of the supplementary printed circuit board 24 opposite the main printed circuit board 23. The radio and/or memory modules 241 are thus accessible after removal of the housing cover 60 (not shown here) or opening of an appropriately arranged flap in the side wall of the housing cover 60, in order to be able to be supplemented or exchanged.

FIG. 9b shows, in a manner similar to FIG. 9a, a further exemplary embodiment of a main module 1 of a controller. The main module 1 is reproduced in an isometric oblique view, where a fitted housing cover 60 is also not shown in this depiction, but unlike in FIG. 9a a base 10 is depicted.

From the basic structure, the exemplary embodiment depicted in FIG. 9b corresponds to that in FIG. 9a, in particular again in relation to the mounting of the heat sink 50. Here too, the heat sink 50 has mounting feet 57 which protrude downwards into the base 10. The main board 23 and the backplane board 21 are connected to the heat sink 50. Elements of the main board 23 which are to be cooled can therefore directly adjoin one of the cooling surfaces 51 of the heat sink 50. In order to optimise the available equipment space on the main board 23, this is likewise inserted into the base 10 in the region of the mounting feet 57. This happens in the form of two tab-like sections protruding into the base 10, which are separated from one another by a recess in the central region, in a similar way to the recess 231 of the example in FIG. 7b.

Unlike in the case of the example in FIG. 9a, the heat sink 50 is otherwise parallelepipedal in its dimensions, without the outer cooling fins 54 which project upwards in the case of the example in FIG. 9a. Just like in the case of the example in FIG. 9a, the heat sink 50 does not extend over the entire height of the main printed circuit board 23, so that space for, here, three additional printed circuit boards 25 remains above (based on the depiction in FIG. 9b) the heat sink 50, which additional printed circuit boards 25 support terminals 30, for example interface terminals 32 and/or antenna terminals 33 and switching and signal elements 40, similarly to the example in FIG. 9a. The heat sink has an attachment groove 55 for fastening at least one of the additional printed circuit boards 25.

Also as in the case of the example in FIG. 9a, a supplementary printed circuit board 24 is arranged parallel to the main printed circuit board 23 on the side away from the heat sink 50. The spacing of the supplementary printed circuit board 24 from the main printed circuit board 23 is selected to be greater than in the example in FIG. 9a, in order to provide further equipment installation space and in particular installation space for accommodating terminals 30.

In the example, interface terminals 32 are depicted, specifically D-SUB terminals 32 on the supplementary printed circuit board 24 and RJ-45 terminals on the main printed circuit board 23. In order to be able to make optimum use of the installation space between the main printed circuit board 23 and the supplementary printed circuit board 24, components which protrude into this installation space and in particular terminals 30, such as the interface terminals 32 depicted here, are arranged in such a way that they interlock with one another. On the outer side of the supplementary printed circuit board 24 away from the main printed circuit board, radio and/or memory modules 241 can in turn be provided, which, if necessary, can be used in order to provide additional functionalities or further memory space. In the housing cover 60 shown here, closable openings can be provided at the appropriate locations, for example flaps or removable covers, in order to guarantee access to the radio and/or memory modules 241.

FIG. 9c shows a further exemplary embodiment of a controller in a manner similar to FIG. 9b. As regards the basic structure, reference is made to the description in relation to the preceding figures. The exemplary embodiment in FIG. 9c constitutes a symbiosis of the examples in FIGS. 9a and 9b. As in the case of the example in FIG. 9a, the heat sink 50 is also provided with outer cooling fins 54. As in the case of the example in FIG. 9b, the spacing between the main printed circuit board 23 and the supplementary printed circuit board 24 is widened in comparison with the example in FIG. 9a, in order to offer a larger installation space for equipping the printed circuit boards and in particular for accommodating terminals 30. A comparison with FIG. 9b shows that further interface terminals 32 are used in FIG. 9c. The large space available for interface terminals 32 enables the inexpensive production of a high article variance that is desired by the customer, with the possibility of arranging many interface terminals 32 in a flexible manner.

Isometric views from different directions of three examples of an expansion module 2 for a control system are depicted in FIGS. 10a and 10b, 11a and 11b and 12a, 12b in each case. The first example shown in FIGS. 10a and 10b is also shown in the control system in FIG. 1. The second example of the expansion module 2 reproduced in FIGS. 11a and 11b is used in the example in FIGS. 2a to 2c.

In the case of the first example in FIGS. 10a and 10b, a perpendicularly arranged main printed circuit board 23′ is provided, which has terminals 30′, specifically interface terminals 32′, on its upper (in the figures) border, that is to say the border facing the front side.

In a section of the main printed circuit board 23′ adjacent to the base 10, a so-called 180° plug connector is arranged, which provides plug contacts to both sides of the main printed circuit board 23′. In this plug connector, a backplane bus printed circuit board 21′ is inserted towards the right side, which reaches as far as a cutout in the housing cover 60′ depicted transparently in the figure. When the expansion module 2 is plugged onto a main module 1, this backplane bus printed circuit board 21′ contacts a corresponding plug connector in the main module 1. At the same time, a similar plug connector for contacting further expansion modules 2 is provided on the left side of the expansion module 2.

The example shown in FIGS. 11a and 11b differs from the first in that, similarly to the case of the main module 1, a backplane bus printed circuit board 21′ is provided, which is oriented parallel to the mounting side or front side and which has a plug connector on each of the sides of the expansion module 2. The main printed circuit board 23′ is fitted perpendicularly onto the backplane bus printed circuit board 21′ and is electrically connected thereto via a further plug connector. A section of the main printed circuit board 23′ in this case protrudes into the base 10, with the result that ground contacting, for example, to the DIN rail can take place via a contact spring arranged in the base 10.

The expansion module 2 shown in FIGS. 12a and 12b differs from those described previously in that a supplementary printed circuit board 24′ is provided in addition to and parallel to the main printed circuit board 23′, in order to provide additional printed circuit board space for the equipping of components. In the example shown, the supplementary printed circuit board 24′ is arranged above (based on the depiction in FIGS. 12a, 12b) the plug connector 26 and also formed less high than the main printed circuit board 23′. In alternative configurations, the main printed circuit board 23′ and the supplementary printed circuit board 24′ can, however, also be formed with the same installation height. In that case, interface terminals and/or switching and signal elements 40′ can also be arranged on the supplementary printed circuit board 24′. In the depicted example, these are mounted exclusively on the main printed circuit board 23′. Similarly to the case of the main printed circuit board 23 and the supplementary printed circuit board 24 of the main module 1 (cf. the description in relation to FIGS. 9a to 9c, for example), the provision of the supplementary printed circuit board 24′ with toothed interengaging fittings can also accompany the expansion module 2, with the result that a high article variance desired by the customer can be provided inexpensively with the same basic structure of the expansion modules 2.

The expansion modules 2 expand the control system by additional interfaces or also by application modules. Application modules can contain functions or also combinations of interfaces. Application modules combine functions for specific fields of application. The direct attachment of the expansion modules 2 to the backplane bus of the main module 1 makes it possible to exchange high data rates via the expansion modules 2. The expansion modules 2 can be regarded also in that sense as “High-Speed-Modules” or can form an output module for particularly short switching times. In order to expand the functional scope of the control system, the expansion modules 2 can also be formed as memory modules, as repeaters, as camera modules, as gateways, as multipliers, switches or repeaters, as media converters, as data loggers, as routers for data analysis, possibly with a sniffer and/or analysis function (e.g. Predictive Analytics) or for providing safety functions.

FIGS. 13a to 13c in each case show a diagrammatic view of the front side (only in the region of the main cover 61) of the main module 1.

Various possible configurations of the front side with terminals 30 and switching and signal elements 40 are reproduced diagrammatically and not in the exact geometric position. The various configurations in FIGS. 13a to 13c differ in the type of terminals 30 or switching and signal elements 40 and in particular the density with which these terminals 30 and switching and signal elements 40 are arranged on the front side.

The exemplary embodiments shown in FIGS. 13a and 13b are achievable, for example, by means of the basic structure of all the previously shown exemplary embodiments of a main module 1. The configuration shown in FIG. 13c with a very high density of terminals 30 and switching and signal elements 40 is implementable preferably by means of the exemplary embodiments in FIGS. 3a and 3b and 4a to 4c and 9a to 9c, since in these exemplary embodiments, besides the main printed circuit board 23, the supplementary printed circuit board 24 is available, in order to accommodate further interface terminals 32 in particular.

REFERENCE NUMBERS

1 main module

2 expansion module

3 input/output module

10 base

11 latching support

12 DIN rail receptacle

13 release lever

14 latching hook

15 bus contacts

16 spacing element

17 printed circuit board support

18 base frame

19 mounting dome

20 printed circuit boards

21 backplane bus printed circuit board

211 structural element

212 attachment screw

22 daughter printed circuit board

221 printed circuit board edge contacts

23 main printed circuit board

231 recess for DIN rail

232 attachment screw

24 supplementary printed circuit board

241 radio and/or memory module

25 additional printed circuit board

26 plug connector

30 terminals

31 power supply terminal

32 interface terminal

33 antenna terminal

34 memory card terminal

35 battery terminal

36 audio terminal

40 switching and signal elements

50 heat sink

51 cooling surface

52 cooling channel

53 inner cooling fins

54 outer cooling fins

55 attachment groove

56 attachment bore

57 mounting foot

58 mounting bore

60 housing cover

61 main cover

62 hinged strip

63 ventilation breakout

64 access flap

CONTROLER AND MODULAR CONTROL SYSTEM OF AN INDUSTRIAL AUTOMATION SYSTEM

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CPC

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