Claims
- 1. A cooling method for cooling a substrate to a target temperature by loading said substrate onto a placing table by convey means and selectively supplying a first coolant having a temperature lower than said target temperature and a second coolant having a temperature almost equal to the target temperature into a coolant path arranged in said placing table, comprising the steps of:(A1) supplying said second coolant into said coolant path before loading of the substrate onto the placing table to set the temperature of the placing table at a temperature almost equal to the target temperature; (B1) supplying said first coolant into the coolant path when or a predetermined time after the substrate is loaded onto the placing table to cool the substrate; and (C1) supplying again the second coolant into the coolant path after the placing table is cooled to a temperature lower than the target temperature to warm the substrate to the target temperature.
- 2. A cooling method for cooling a substrate to a target temperature by allowing said substrate to be received by delivery means in an upper portion of a placing table, moving downward said delivery means to load the received substrate onto said placing table, and selectively supplying a first coolant having a temperature lower than said target temperature and a second coolant having a temperature almost equal to the target temperature to a coolant path arranged in the placing table, comprising the steps of:(A2) supplying said second coolant into said coolant path before the delivery means is moved downward to set the temperature of the placing table at a temperature almost equal to the target temperature; (B2) supplying the first coolant into the coolant path to cool the substrate when or a predetermined time after the delivery means is moved downward; and (C2) supplying again the second coolant into the coolant path after the placing table is cooled to a temperature lower than the target temperature to warm the substrate to the target temperature.
Priority Claims (2)
Number |
Date |
Country |
Kind |
7-024743 |
Jan 1995 |
JP |
|
8-24636 |
Jan 1996 |
JP |
|
Parent Case Info
This application is a division of Ser. No. 08/588,309 filed Jan. 18, 1996, now U.S. Pat. No. 5,941,083 issued Aug. 24, 1999.
US Referenced Citations (4)
Foreign Referenced Citations (1)
Number |
Date |
Country |
6-2262 |
Jan 1994 |
JP |