Plated through-holes or plated via connections

Industry

CPC
H05K3/42

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/42Plated through-holes or plated via connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive method for manufacturing circuit board with fine interc...
- Patent number 12,309,938
- Issue date May 20, 2025
- Hsu-Tung Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Closed-cavity printed circuit board
- Patent number 12,284,771
- Issue date Apr 22, 2025
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming engineered thermal paths of printed circuit boa...
- Patent number 12,262,464
- Issue date Mar 25, 2025
- Matthew D. Neely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and wiring board manufacturing method
- Patent number 12,250,773
- Issue date Mar 11, 2025
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite printed wiring board and method of manufacturing composit...
- Patent number 12,238,861
- Issue date Feb 25, 2025
- Mitsubishi Electric Corporation
- Tatsuya Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,238,852
- Issue date Feb 25, 2025
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection method for chip and circuit board, and circuit board ass...
- Patent number 12,232,266
- Issue date Feb 18, 2025
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for electrochemical process
- Patent number 12,227,866
- Issue date Feb 18, 2025
- Yuming Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 12,225,658
- Issue date Feb 11, 2025
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via plug resistor
- Patent number 12,218,042
- Issue date Feb 4, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with integral terminals
- Patent number 12,200,862
- Issue date Jan 14, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper metallization for through-glass vias on thin glass
- Patent number 12,200,875
- Issue date Jan 14, 2025
- Industrial Technology Research Institute
- Yiu-Hsiang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for detecting defective back-drills in printed ci...
- Patent number 12,153,084
- Issue date Nov 26, 2024
- R & D Circuits, Inc.
- Donald Eric Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 12,150,254
- Issue date Nov 19, 2024
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency package including a substrate body having first and...
- Patent number 12,142,807
- Issue date Nov 12, 2024
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR PROVIDING SHORT STRUCTURES FOR BACKDRILL VA...
- Publication number 20250181055
- Publication date Jun 5, 2025
- CIENA CORPORATION
- Vinh Ha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
- Publication number 20250176113
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Luciano ZIZZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250168980
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Gyu PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLING DEPTH OF PENETRATION OF BACKDRILL CAVITY FILLING BY ADJ...
- Publication number 20250168989
- Publication date May 22, 2025
- Arista Networks, Inc.
- James Alden Weaver
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Filling an Indentation...
- Publication number 20250142736
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD STRUCTURE
- Publication number 20250133665
- Publication date Apr 24, 2025
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- CHI SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA PLUG RESISTOR
- Publication number 20250125242
- Publication date Apr 17, 2025
- Intel Corporation
- Santosh Gangal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250120014
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF
- Publication number 20250113446
- Publication date Apr 3, 2025
- ROGERS CORPORATION
- Michael S. Kuszaj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20250113433
- Publication date Apr 3, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250098067
- Publication date Mar 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR DETECTING DEFECTIVE BACK-DRILLS IN PRINTED CI...
- Publication number 20250085332
- Publication date Mar 13, 2025
- R&D Circuits, Inc.
- Donald Thompson
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250089167
- Publication date Mar 13, 2025
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250081358
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi NISHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND LAMINATED WIRING BOARD
- Publication number 20250081329
- Publication date Mar 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250063661
- Publication date Feb 20, 2025
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING CRACK DETECTION WIRING
- Publication number 20250054426
- Publication date Feb 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Kyungsu LEE
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...
- Publication number 20250056725
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250048542
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH REDUCED VIA STRIPING
- Publication number 20250040045
- Publication date Jan 30, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20250040026
- Publication date Jan 30, 2025
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE USING SAME
- Publication number 20250040047
- Publication date Jan 30, 2025
- Kyocera Corporation
- Masashi OHMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR FORMING CIRCUIT PATTERN ON SUBSTRATE USING METAL FOIL W...
- Publication number 20250031316
- Publication date Jan 23, 2025
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED VIA-IN-VIA VERTICAL CONNECTION
- Publication number 20250031318
- Publication date Jan 23, 2025
- Nokia Solutions and Networks Oy
- Paul BROWN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD
- Publication number 20250024598
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Takuto HIDANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING STUB-FREE VIA HOLE, PCB, ELECTRONIC DEVICE...
- Publication number 20250024612
- Publication date Jan 16, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Tianqi YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Plated through-holes or plated via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mating backplane for high speed, high density electrical connector

Subtractive method for manufacturing circuit board with fine interc...

Devices with conductive or magnetic nanowires for localized heating...

Component carrier with partially metallized hole using anti-plating...

Closed-cavity printed circuit board

Methods for forming engineered thermal paths of printed circuit boa...

Wiring board and wiring board manufacturing method

Wiring board

Interconnect structure having conductor extending along dielectric...

Method of preparing a high density interconnect printed circuit boa...

Composite printed wiring board and method of manufacturing composit...

Circuit board and method for manufacturing the same

Connection method for chip and circuit board, and circuit board ass...

Systems and methods for electrochemical process

Interlaced crosstalk controlled traces, vias, and capacitors

Via plug resistor

Method of manufacture for embedded IC chip directly connected to PCB

Beveled overburden for vias and method of making the same

Backplane footprint for high speed, high density electrical connectors

Panel molded electronic assemblies with integral terminals

Copper metallization for through-glass vias on thin glass

Circuit board with rigid portion and flexible portion having connec...

Capacitive compensation for vertical interconnect accesses

Circuit board and manufacturing method thereof and electronic device

Wiring circuit board, producing method thereof, and wiring circuit...

Package carrier with improved heat dissipation efficiency and manuf...

Technologies for power tunnels on circuit boards

System and method for detecting defective back-drills in printed ci...

Method of forming a laminate structure having a plated through-hole...

High-frequency package including a substrate body having first and...

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR PROVIDING SHORT STRUCTURES FOR BACKDRILL VA...

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CONTROLLING DEPTH OF PENETRATION OF BACKDRILL CAVITY FILLING BY ADJ...

Stamping Surface Profile in Design Layer and Filling an Indentation...

PRINTED CIRCUIT BOARD

METHOD FOR PRODUCING A CIRCUIT BOARD STRUCTURE

VIA PLUG RESISTOR

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING BOARD AND SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

SYSTEM AND METHOD FOR DETECTING DEFECTIVE BACK-DRILLS IN PRINTED CI...

WIRING SUBSTRATE

WIRING BOARD

WIRING BOARD AND LAMINATED WIRING BOARD

PRINTED WIRING BOARD

MANUFACTURING METHOD OF CIRCUIT BOARD

ELECTRONIC DEVICE INCLUDING CRACK DETECTION WIRING

CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...

CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

PRINTED CIRCUIT BOARD WITH REDUCED VIA STRIPING

MANUFACTURING METHOD OF PACKAGE CARRIER

WIRING BOARD AND MOUNTING STRUCTURE USING SAME

METHODS FOR FORMING CIRCUIT PATTERN ON SUBSTRATE USING METAL FOIL W...

PLATED VIA-IN-VIA VERTICAL CONNECTION

SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD

METHOD FOR MANUFACTURING STUB-FREE VIA HOLE, PCB, ELECTRONIC DEVICE...