[0001] The subject matter of this Application is related to that disclosed in U.S. Pat. No. 5,785,116 entitled FAN ASSISTED HEAT SINK, filed by Wagner on Feb. 1, 1996 and issued on Jul. 28, 1998. That Patent describes a particular type of internal fan heat sink for microprocessors, large power VLSI devices and the like, that dissipate a sufficient amount of power to require a substantial heat sink. The instant invention pertains to a manner of making an improved version of that same type of internal fan heat sink, which heat sink has a number of unique properties that do not readily lend themselves to summary description: it is not a garden variety heat sink with a fan grafted onto it. For this reason U.S. Pat. No. 5,785,116 is hereby expressly incorporated herein by reference, so that all the unique properties of that active heat sink, including its manner of operation and final shaping during manufacture, will be fully available for the understanding of this Disclosure.