specially adapted for containing chips, dies or ICs

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H01L21/67356

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67356specially adapted for containing chips, dies or ICs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cover tape for packing electronic component, package, and package set
- Patent number 12,172,412
- Issue date Dec 24, 2024
- Dai Nippon Printing Co., Ltd.
- Ayuro Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing a substrate detection process
- Patent number 12,020,963
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Mapping of a replacement parts storage container
- Patent number 12,014,944
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip counter for semiconductor chip-mounted tape reel
- Patent number 11,893,451
- Issue date Feb 6, 2024
- Hyun Su Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming dice and structure of die
- Patent number 11,810,804
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded substrates
- Patent number 11,784,072
- Issue date Oct 10, 2023
- Hewlett-Packard Development Company, L.P.
- Michael Wayne Cumbie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mapping of a replacement parts storage container
- Patent number 11,469,123
- Issue date Oct 11, 2022
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including leads of different lengths
- Patent number 11,417,538
- Issue date Aug 16, 2022
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dice and structure of die
- Patent number 11,309,201
- Issue date Apr 19, 2022
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular pressing device capable of generating stage downward forces...
- Patent number 10,879,097
- Issue date Dec 29, 2020
- CHROMA ATE INC.
- Chi-Chen Wu
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor chip holder
- Patent number 10,879,098
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate detecting system in a substrate storage container
- Patent number 10,867,824
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transport packaging and method for expanded wafers
- Patent number 10,811,292
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Connie Alagadan Esteron
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
On-wafer calibration device
- Patent number 10,794,837
- Issue date Oct 6, 2020
- Rohde & Schwarz GmbH & Co. KG
- Robert Ziegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressing apparatus and compressing jig thereof
- Patent number 10,493,602
- Issue date Dec 3, 2019
- Horng Terng Automation Co., Ltd.
- Yu Hsien Wang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic component transport apparatus and electronic component i...
- Patent number 10,416,231
- Issue date Sep 17, 2019
- Seiko Epson Corporation
- Daisuke Kirihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article transport device
- Patent number 10,283,394
- Issue date May 7, 2019
- Daifuku Co., Ltd.
- Takeshi Abe
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Methods and devices for securing and transporting singulated die in...
- Patent number 9,929,031
- Issue date Mar 27, 2018
- Intel Corporation
- John C. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,837,466
- Issue date Dec 5, 2017
- Renesas Electronics Corporation
- Shintaro Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magazine for packaged integrated circuits
- Patent number 9,748,126
- Issue date Aug 29, 2017
- Texas Instruments Incorporated
- Razleen Abdul Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for metal-ceramic substrate and method for packing such sub...
- Patent number 9,434,509
- Issue date Sep 6, 2016
- Rogers Germany GmbH
- Johann Bräutigam
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,324,763
- Issue date Apr 26, 2016
- Renesas Electronics Corporation
- Shintaro Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for real time positioning of a substrate in a vac...
- Patent number 9,111,979
- Issue date Aug 18, 2015
- Kevin P Fairbairn
- G05 - CONTROLLING REGULATING
Information Patent Grant
Devices and method for handling microelectronics assemblies
- Patent number 9,048,272
- Issue date Jun 2, 2015
- Illinois Tool Works Inc.
- Valoris L. Forsyth
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Sealed chip package
- Patent number 8,772,016
- Issue date Jul 8, 2014
- Pacific Biosciences of California, Inc.
- Paul Newby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover tape for packaging semiconductor device and package for semic...
- Patent number 8,033,397
- Issue date Oct 11, 2011
- Fujitsu Semiconductor Limited
- Keiichi Sasamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip receptacle, method for fabricating a chip receptacle and chip...
- Patent number 7,445,119
- Issue date Nov 4, 2008
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Container for an electronic component
- Patent number 7,364,778
- Issue date Apr 29, 2008
- Denki Kagaku Kogyo Kabushiki Kaisha
- Takeshi Miyakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape for disk components
- Patent number 7,219,803
- Issue date May 22, 2007
- Entegris, Inc.
- Ronald E. Thomas, Jr.
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF OPERATING A PROCESSING APPARATUS
- Publication number 20240312814
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Cheng WU
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE
- Publication number 20240304478
- Publication date Sep 12, 2024
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240128107
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME CASSETTE WITH INTERNAL COVER CASES
- Publication number 20240087930
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATED DIE SHIPPING TRAY ASSEMBLY
- Publication number 20230290661
- Publication date Sep 14, 2023
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP CONTAINER AND FIXTURE
- Publication number 20230056554
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jiabao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINER
- Publication number 20230058606
- Publication date Feb 23, 2023
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER TAPE FOR PACKING ELECTRONIC COMPONENT, PACKAGE, AND PACKAGE SET
- Publication number 20220396057
- Publication date Dec 15, 2022
- DAI NIPPON PRINTING CO., LTD.
- Ayuro MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY CHAMBER FOR SELF-ASSEMBLY OF SEMICONDUCTOR LIGHT-EMITTING...
- Publication number 20220328716
- Publication date Oct 13, 2022
- LG ELECTRONICS INC.
- Inbum YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAINERS FOR PROTECTING SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20220230901
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- Mohamed A. Ditali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming dice and structure of die
- Publication number 20220199438
- Publication date Jun 23, 2022
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COUNTER FOR SEMICONDUCTOR CHIP-MOUNTED TAPE REEL
- Publication number 20210397921
- Publication date Dec 23, 2021
- NANODREAM CO.,LTD.
- Hyun Su LEE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING LEADS OF DIFFERENT LENGTHS
- Publication number 20210366728
- Publication date Nov 25, 2021
- INFINEON TECHNOLOGIES AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DICE AND STRUCTURE OF DIE
- Publication number 20210358786
- Publication date Nov 18, 2021
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PERFORMING A SUBSTRATE DETECTION PROCESS
- Publication number 20210098273
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINER
- Publication number 20210057246
- Publication date Feb 25, 2021
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HOLDER
- Publication number 20200090970
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Jen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPORT PACKAGING AND METHOD FOR EXPANDED WAFERS
- Publication number 20200083076
- Publication date Mar 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Connie Alagadan Esteron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DETECTING SYSTEM IN A SUBSTRATE STORAGE CONTAINER
- Publication number 20190371638
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PRESSING DEVICE CAPABLE OF GENERATING STAGE DOWNWARD FORCES...
- Publication number 20190172740
- Publication date Jun 6, 2019
- CHROMA ATE INC.
- Chi-Chen WU
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ON-WAFER CALIBRATION DEVICE
- Publication number 20190017940
- Publication date Jan 17, 2019
- ROHDE & SCHWARZ GMBH & CO. KG
- Robert ZIEGLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CONTACTLESS TRANSFER AND SOLDERING OF CHIP...
- Publication number 20180130683
- Publication date May 10, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSPORT APPARATUS AND ELECTRONIC COMPONENT I...
- Publication number 20180074119
- Publication date Mar 15, 2018
- SEIKO EPSON CORPORATION
- Daisuke KIRIHARA
- G01 - MEASURING TESTING
Information Patent Application
MAGAZINE FOR PACKAGED INTEGRATED CIRCUITS
- Publication number 20170330779
- Publication date Nov 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Razleen Abdul Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGAZINE FOR PACKAGED INTEGRATED CIRCUITS
- Publication number 20170194179
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Razleen Abdul Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...
- Publication number 20170032991
- Publication date Feb 2, 2017
- Intel Corporation
- John C. JOHNSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND FOUP TO BE USED THEREFOR
- Publication number 20160343598
- Publication date Nov 24, 2016
- RENESAS ELECTRONICS CORPORATION
- Jiro SAKAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160035787
- Publication date Feb 4, 2016
- Renesas Electronics Corporation
- Shintaro Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES
- Publication number 20150235882
- Publication date Aug 20, 2015
- Illinois Tool Works Inc.
- Valoris L. FORSYTH
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR
- Publication number 20150206779
- Publication date Jul 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS

specially adapted for containing chips, dies or ICs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cover tape for packing electronic component, package, and package set

Method of performing a substrate detection process

Mapping of a replacement parts storage container

Chip counter for semiconductor chip-mounted tape reel

Method of forming dice and structure of die

Molded substrates

Mapping of a replacement parts storage container

Semiconductor package including leads of different lengths

Method of forming dice and structure of die

Modular pressing device capable of generating stage downward forces...

Semiconductor chip holder

Substrate detecting system in a substrate storage container

Transport packaging and method for expanded wafers

On-wafer calibration device

Compressing apparatus and compressing jig thereof

Electronic component transport apparatus and electronic component i...

Apparatus and method for contactless transfer and soldering of chip...

Article transport device

Methods and devices for securing and transporting singulated die in...

Method of manufacturing semiconductor device

Magazine for packaged integrated circuits

Package for metal-ceramic substrate and method for packing such sub...

Method of manufacturing semiconductor device

System and method for real time positioning of a substrate in a vac...

Devices and method for handling microelectronics assemblies

Sealed chip package

Cover tape for packaging semiconductor device and package for semic...

Chip receptacle, method for fabricating a chip receptacle and chip...

Container for an electronic component

Carrier tape for disk components

Patents Applicationslast 30 patents

METHOD OF OPERATING A PROCESSING APPARATUS

METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE

MODULE TRAY FOR SEMICONDUCTOR DEVICE

FRAME CASSETTE WITH INTERNAL COVER CASES

SINGULATED DIE SHIPPING TRAY ASSEMBLY

SEMICONDUCTOR CHIP CONTAINER AND FIXTURE

MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINER

COVER TAPE FOR PACKING ELECTRONIC COMPONENT, PACKAGE, AND PACKAGE SET

ASSEMBLY CHAMBER FOR SELF-ASSEMBLY OF SEMICONDUCTOR LIGHT-EMITTING...

CONTAINERS FOR PROTECTING SEMICONDUCTOR DEVICES AND RELATED METHODS

Method of forming dice and structure of die

CHIP COUNTER FOR SEMICONDUCTOR CHIP-MOUNTED TAPE REEL

SEMICONDUCTOR PACKAGE INCLUDING LEADS OF DIFFERENT LENGTHS

METHOD OF FORMING DICE AND STRUCTURE OF DIE

METHOD OF PERFORMING A SUBSTRATE DETECTION PROCESS

MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINER

SEMICONDUCTOR CHIP HOLDER

TRANSPORT PACKAGING AND METHOD FOR EXPANDED WAFERS

SUBSTRATE DETECTING SYSTEM IN A SUBSTRATE STORAGE CONTAINER

MODULAR PRESSING DEVICE CAPABLE OF GENERATING STAGE DOWNWARD FORCES...

ON-WAFER CALIBRATION DEVICE

APPARATUS AND METHOD FOR CONTACTLESS TRANSFER AND SOLDERING OF CHIP...

ELECTRONIC COMPONENT TRANSPORT APPARATUS AND ELECTRONIC COMPONENT I...

MAGAZINE FOR PACKAGED INTEGRATED CIRCUITS

MAGAZINE FOR PACKAGED INTEGRATED CIRCUITS

METHODS AND DEVICES FOR SECURING AND TRANSPORTING SINGULATED DIE IN...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND FOUP TO BE USED THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DEVICES AND METHODS FOR HANDLING MICROELECTRONICS ASSEMBLIES

SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR