COVERT INTELLIGENT NETWORKED SENSORS AND OTHER FULLY ENCAPSULATED CIRCUITS

Abstract

A metallic enclosure completely encapsulates an embedded electronic system, which may include sensors, wireless communications devices and other circuits. The enclosure is fabricated in layers of material using a solid-state additive consolidation or lamination process forming a true metallurgical bond between the layers during fabrication without melting the material in bulk. A plurality of enclosures may be provided, each encapsulating an electronic circuit including a wireless transmitter or receiver, with the electronic circuits within the enclosures forming a communications network. As such, a sensor may be used to detect an external characteristic, and a wireless transmitter may be activated to communicate information about the characteristic to a remote receiver. The enclosure may use one or more layers of dissimilar material to form an embedded active or passive electrical component such as an antenna, waveguide, or other device that cooperates with the circuitry.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a drawing in partial cross section depicting a preferred embodiment of the invention;

FIG. 2 is a drawing in partial cross section depicting an alternative construction; and

FIG. 3 illustrates one way in which dissimilar materials may be used to embed passive or active components.

Claims

1. An encapsulated electronic system, comprising: an electronic circuit; anda metallic enclosure that completely encapsulates the circuit, the enclosure being fabricated in layers of material using a solid-state additive consolidation or lamination process forming a true metallurgical bond between the layers during fabrication without melting the material in bulk.

2. The encapsulated electronic system of claim 1, wherein the enclosure is fabricated using an ultrasonic consolidation process.

3. The encapsulated electronic system of claim 1, wherein the enclosure is fabricated using electrical resistance welding.

4. The encapsulated electronic system of claim 1, wherein the enclosure is fabricated using frictional welding.

5. The encapsulated electronic system of claim 1, wherein the enclosure is fabricated using cold gas dynamic spraying.

6. The encapsulated electronic system of claim 1, further including the use of a subtractive fabrication process to achieve a final desired shape.

7. The encapsulated electronic system of claim 1, wherein the enclosure is coin-shaped.

8. The encapsulated electronic system of claim 1, wherein the electronic circuit includes a sensor.

9. The encapsulated electronic system of claim 1, wherein the electronic circuit includes a wireless transmitter or receiver.

10. The encapsulated electronic system of claim 1, including: a plurality of enclosures, each encapsulating an electronic circuit including a wireless transmitter or receiver; andwherein the electronic circuits within the enclosures form a communications network.

11. The encapsulated electronic system of claim 1, wherein the enclosure uses one or more layers of dissimilar material to form an embedded active or passive electrical component.

12. The encapsulated electronic system of claim 1, wherein the enclosure uses one or more layers of dissimilar material to form an embedded antenna.

13. The encapsulated electronic system of claim 1, wherein the enclosure includes an embedded waveguide.

14. The encapsulated electronic system of claim 1, wherein the electronic circuit includes an acoustic or radio-frequency detector that activates other components if the sound or RF energy exceeds a predetermined level.

15. The encapsulated electronic system of claim 1, wherein the electronic circuit includes: a rechargeable battery; andone or more elements to receive energy from an external source for battery-charging purposes.

16. The encapsulated electronic system of claim 1, wherein the electronic circuit includes: a rechargeable battery; andone or more elements to receive energy from an external source for battery-charging purposes.

17. The encapsulated electronic system of claim 1, wherein the electronic circuit includes: a sensor to detect an external characteristic; anda wireless transmitter to communicate information about the characteristic to a remote receiver.

18. The encapsulated electronic system of claim 1, wherein the enclosure includes: a magnet and a coil, one or both of which move when the enclosure is moved to generate electricity for the electronic circuit.

19. A method of embedding electronics in a metallic structure, comprising the steps of: providing electronic circuitry;providing a feedstock of material; andcompletely encapsulating the circuitry in an enclosure by bonding layers of the material around or over the circuitry without an adhesive using a solid-state additive consolidation or lamination process that does not melt the material in bulk.

20. The method of claim 19, wherein the enclosure is fabricated using an ultrasonic consolidation process.

21. The method of claim 19, wherein the enclosure is fabricated using electrical resistance welding.

22. The method of claim 19, wherein the enclosure is fabricated using frictional welding.

23. The method of claim 19, wherein the enclosure is fabricated using cold gas dynamic spraying.

24. The method of claim 19, further including the step of using a subtractive fabrication process to achieve a final desired shape.

25. The method of claim 19, further including the steps of: encapsulating the electronic circuitry in a non-metallic form; andfabricating the enclosure over the encapsulated electronic circuitry.