Claims
- 1. Structure comprising:
- a printed circuit board containing a first region and an interface area;
- a plurality of component contacts formed in said first region of said printed circuit board for receipt of electronic components;
- a plurality of electrically conductive traces formed on said printed circuit board, each trace being electrically connected to a corresponding one of said component contacts;
- a corresponding plurality of interconnect contacts formed in said interface area of said printed circuit board, each interconnect contact being connected uniquely to a corresponding one of said component contacts by one of said plurality of electrically conductive traces; and
- a multiplicity of custom conductive traces formed on said printed circuit board in said interface area, each of said custom conductive traces interconnecting at least two of said interconnect contacts thereby to form an electrically conductive path between said at least two interconnect contacts.
- 2. Structure as in claim 1 wherein said component contacts comprise holes formed through said printed circuit board, each of said holes being plated with a conductive material.
- 3. Structure as in claim 2 wherein said interconnect contacts comprise holes formed through said printed circuit board, each of said holes being coated on its interior surface with a conductive material.
- 4. Structure as in claim 1 wherein said printed circuit board contains at least two layers of insulating material, each of said two layers containing thereon a subset of said plurality of electrically conductive traces.
- 5. Structure as in claim 1 wherein said printed circuit board includes at least one additional layer of insulating material containing none of said plurality of electrically conductive traces, said at least one additional layer being suitable for containing one or more of said multiplicity of custom conductive traces formed on said printed circuit board in said interface area.
Parent Case Info
This application is a division of application Ser. No. 07/466,153, filed Jan. 17, 1990.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4821142 |
Ushifusa et al. |
Apr 1989 |
|
4840924 |
Kinbara |
Jun 1989 |
|
4860165 |
Cassinelli |
Aug 1989 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
466153 |
Jan 1990 |
|