Claims
- 1. A microprocessor cooling system, which comprises:
a. a heat sink body for mounting to a microprocessor circuit board including a plurality of cooling fins having outer ends and inner ends and a base, having an outer surface; b. at least one cooling fan mounted on said outer ends of said cooling fins for directing a cooling gas through the fins; and c. a chemical vapor deposited diamond heatspreader having an inner surface mounted to the outer surface of said base and an outer surface positioned for mounting directly onto a microprocessor chip of said microprocessor circuit board.
- 2. The cooling system of claim 1 wherein the base has two ends and the outer surface adjacent each of the ends of said base is joinable to said microprocessor circuit board by means of a copper spacer.
- 3. The cooling system of claim 1 wherein said chemical vapor deposited diamond heatspreader is metallized prior to being mounted onto said outer surface of said base.
- 4. The cooling system of claim 3 wherein said chemical vapor deposited diamond heatspreader is metallized by applying a thick film active brazing alloy paste to 20 at least a portion of it, drying the paste and firing the film covered diamond at temperatures in the range of about 200° to about 1000° C.
- 5. The cooling system of claim 4 wherein said alloy paste is Ticusil.
- 6. The cooling system of claim 4 wherein said film covered diamond heatspreader is polished after it is fired.
- 7. The cooling system of claim 6 wherein a low melting temperature solder is applied to said polished diamond heatspreader prior to being mounted to the outer surface of said base.
- 8. A microprocessor cooling system, which comprises:
a. a heat sink body for mounting to a microprocessor circuit board including a plurality of cooling fins having out ends and inner ends, a heat sink base having two ends, an inner surface attached to said inner ends and an outer surface having a depression equidistant from each of the ends; b. at least one cooling fan mounted on said outer ends of said cooling fins for directing a cooling gas through the fins; and c. a copper insert having an indent equidistant from each of the ends of said heat sink body and mounted within said depression and a chemical vapor deposited diamond heatspreader insert having an inner surface mounted within said indent and an outer surface positioned for mounting directly onto a main microprocessor chip of said microprocessor circuit board.
- 9. The cooling system of claim 4 wherein the base has two ends and the lower surface adjacent each of the ends of said base is joinable to said microprocessor circuit board by means of a copper spacer.
- 10. The cooling system of claim 1 wherein the diamond heatspreader is metallized and polished prior to being mounted within said indent of said copper insert.
Priority Claims (1)
Number |
Date |
Country |
Kind |
60263576 |
Jan 2001 |
US |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to U.S. Provisional Application No. 60/263,576 filed in the U.S. Patent and Trademark Office on Jan. 22, 2001.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/US02/01436 |
1/18/2002 |
WO |
|