Patent Application
20150173168
This non-provisional application claims priority on Patent Application No. 201310684973.7 filed in P. R. China on Dec. 13, 2013, the entire contents of which are hereby incorporated by reference.
1. Technical Field
The present disclosure relates to the field of DC/DC power supply, and particularly to a DC/DC power module and a DC/DC power system.
2. Description of Related Art
The DC/DC power modules have been widely used in the field of communication such as switching devices, access devices, mobile communication, microwave communication, optical transmission, routers, and in the fields of automotive electronics, aerospace and so on. In the field of communication, a communication system is generally supplied with −48V or +24V. The system may include one or more DC/DC power modules for converting the supplied DC voltage into the DC operating voltage required by the circuit boards. As the increase of the demand for the power density and conversion efficiency of the DC/DC power module, there is an urgent need to provide a DC/DC power module, which is compact, efficient and reliable.
As shown in
As shown in
An objective of the present disclosure is to provide a DC/DC power module, which can reduce the required space at the customer side and/or be adaptable for a system in which the customer heating dissipation assembly is installed below the DC/DC power module.
According to an aspect of the disclosure, a DC/DC power module comprises a printed circuit board provided with at least one heating component and at least one connecting terminal for electrical connection on a first surface of said printed circuit board; and at least one first heat sink covering the heating component and exposing the connecting terminal.
According to another aspect of the disclosure, a DC/DC power system comprises a DC/DC power module, a system board and a heating dissipation assembly. Said DC/DC power module comprises a printed circuit board provided with at least one heating component and at least one connecting terminal for electrical connection on a first surface of said printed circuit board, and at least one first heat sink covering the heating component and exposing the connecting terminal. Said system board is provided with an opening hole at a position corresponding to the DC/DC power module. Said heating dissipation assembly is suitable for contacting with the DC/DC power module via the opening hole and dissipating heat from the DC/DC power module.
According to the disclosure, the heating component and the connecting terminal(s) for electrical connection of the DC/DC power module are disposed on the same surfaces of the PCB, while the first heat sink covers the heating component but exposes the connecting terminal(s), so that the overall thickness of the DC/DC power module is reduced. When the DC/DC power module of the disclosure is applied at the customer side to constitute the power system, an opening hole is arranged in the system board, through which the heating dissipation assembly penetrates to contact with the DC/DC power module so as to perform heat dissipating on the DC/DC power module. The distance between the heat spreader and the system board can be adjusted by changing the height of a heat conducting block. In this way, the DC/DC power system of the disclosure is compact in structure, small in space for installation, and can be simply and flexibly installed.
The present disclosure will be described in detail hereinafter by referring to the accompanying drawings and the specific embodiments, which should by no means be construed as limitations to the present disclosure.
The disclosure will now be described in details through following illustrative embodiments. However, it should be understood that an element, a structure or a feature in an embodiment can be beneficially incorporated into other embodiments without further recitation.
Some references, if any, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references, if any, is provided merely to clarify the description of the present disclosure. All references listed, cited and/or discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.
It should also be understood that “comprises/comprising” when used in the specification is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components or groups thereof.
Reference is made to
As can be seen from
In this embodiment, the connecting terminals 33 are arranged respectively along two parallel edges of the PCB 31. The height of the respective heating components 32 on the PCB 31 may be different from one another. In order to fit all of the heating components 32 on the first surface of the PCB 31, a face of the first heat sink 34 that faces the first surface of the PCB 31 is configured to be of uneven and complementary to the height of the heating components 32 on the first surface of the PCB 31 in such a way that the first heat sink 34 can completely fit all the heating components 32 on the first surface of the PCB 31. Corresponding to the arrangement of the connecting terminals 33, the first heat sink 34 is provided with two openings 342 for exposing the connecting terminals 34 arranged along the two edges of the PCB 31. The first heat sink 34 is thus generally H-shaped.
According to another embodiment of the disclosure, the DC/DC power module 30 of the disclosure can further comprises a second heat sink covering the other surface (a second surface) of the PCB 31. On the second surface of the PCB 31, one or more heating components 32 can be provided, the number of which can be one, or two or more, depending on the needs in practice. Accordingly, the face of the second heat sink that faces the second surface of the PCB 31 can be configured to be of uneven and complementary to the height of the heating components 32 on the second surface of the PCB 31 in such a way that the second heat sink can completely fit all the heating components 32 on the second surface of the PCB 31. Alternatively, there can be no heating component on the second surface of the PCB 31. In this case, the second heat sink can be configured to completely fit the second surface of the PCB 31. Due to the arrangement of the second heat sink, heat can be dissipated from both surfaces of the DC/DC power module 30. The efficiency of heat dissipating is further improved.
Referring to
The heating dissipation assembly 42 contacts with the DC/DC power module 30 via the opening hole 411, to dissipate the heat from the DC/DC power module 30. The heating dissipation assembly 42 comprises a heat conducting block 421 and a heat spreader 422. In order to contact with the first heat sink 34, the heat conducting block 421 is protruded at the position corresponding to the opening hole 411, so as to contact with the first heat sink 34 of the DC/DC power module 30 through the opening hole 411. The opposite face of the heat conducting block 421 contacts with the heat spreader 422, so that heat from the DC/DC power module 30 can be dissipated to the heat spreader 422 via the heat conducting block 421 and then dissipated from the heat spreader 422. Furthermore, in another embodiment, when a single heat spreader 422 is shared by all modules that require heat dissipating on the system board 41, the difference in height between the DC/DC power module 30 and other modules requiring heat dissipating on the system board 41 can be compensated by the thickness of the heat conducting block 421. In an embodiment, the thickness h of the heat conducting block 421 can be determined by the equation of
h=h1+d
wherein, h1 is a thickness of the system board 41, d is a distance between the heat spreader 422 of the heating dissipation assembly 42 and the system board 41.
The heating dissipation assembly 42 further comprises a heat conducting gasket 43. The heat conducting gasket 43 is disposed between the heat conducting block 421 and the first heat sink 34, and has a shape which corresponds to that of the first heat sink 34. The heat conducting gasket 43 can be made from resin or silicone, and is designed and configured to be closely fit between the heat conducting block 421 and the first heat sink 34, so as to avoid any gap between the heat conducting block 421 and the first heat sink 34 due to the uneven contacting surfaces of them, and thus improve the efficiency of heat dissipating.
It can be seen from the above description on construction that, due to the arrangement of the opening hole and through holes, the DC/DC power module and the heating dissipation assembly can be arranged at two opposite surfaces of the system board, while the heat can be well dissipated from the DC/DC power module. As compared with the conventional DC/DC power module, the DC/DC power module of the disclosure occupies a relatively small space at one surface of the system board, which facilitates a low profile of the DC/DC power system.
Although several preferred embodiments of the present disclosure have been described, the present disclosure may be used with other configurations. It will be appreciated by those skilled in the art that, the present disclosure could have many other embodiments, and changes and modifications may be made thereto without departing from the disclosure in its broader aspects and as set forth in the following claims and equivalents thereof.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201310684973.7 | Dec 2013 | CN | national |
